JPH0317629U - - Google Patents
Info
- Publication number
- JPH0317629U JPH0317629U JP1989077489U JP7748989U JPH0317629U JP H0317629 U JPH0317629 U JP H0317629U JP 1989077489 U JP1989077489 U JP 1989077489U JP 7748989 U JP7748989 U JP 7748989U JP H0317629 U JPH0317629 U JP H0317629U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor chip
- resin
- tabs
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を組立て工程順に示
し、ａは樹脂封止前の状態を示す縦断面図、ｂは
樹脂封止後の状態を示す縦断面図、第２図は従来
の樹脂封止型半導体装置の一例を示す縦断面図で
ある。 １…半導体チツプ、２…タブ、３…ボンデイン
グワイヤ、４…封止樹脂部、５…リードフレーム
、６…電極。
し、ａは樹脂封止前の状態を示す縦断面図、ｂは
樹脂封止後の状態を示す縦断面図、第２図は従来
の樹脂封止型半導体装置の一例を示す縦断面図で
ある。 １…半導体チツプ、２…タブ、３…ボンデイン
グワイヤ、４…封止樹脂部、５…リードフレーム
、６…電極。
Claims (1)
- 電極群を有する半導体チツプと、タブを有しな
いリードフレームと、該リードフレームとこれに
対応する前記各電極とを電気的に接続するボンデ
イングワイヤと、上記各部品をモールドする封止
樹脂部とを備え、前記半導体チツプは前記リード
フレームと遊離した位置に設けられていることを
特徴とする樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989077489U JPH0317629U (ja) | 1989-06-30 | 1989-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989077489U JPH0317629U (ja) | 1989-06-30 | 1989-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317629U true JPH0317629U (ja) | 1991-02-21 |
Family
ID=31619923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989077489U Pending JPH0317629U (ja) | 1989-06-30 | 1989-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317629U (ja) |
-
1989
- 1989-06-30 JP JP1989077489U patent/JPH0317629U/ja active Pending