JPH0317648U - - Google Patents

Info

Publication number
JPH0317648U
JPH0317648U JP1989078467U JP7846789U JPH0317648U JP H0317648 U JPH0317648 U JP H0317648U JP 1989078467 U JP1989078467 U JP 1989078467U JP 7846789 U JP7846789 U JP 7846789U JP H0317648 U JPH0317648 U JP H0317648U
Authority
JP
Japan
Prior art keywords
chip
lead frame
protrusion
approximately
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989078467U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989078467U priority Critical patent/JPH0317648U/ja
Publication of JPH0317648U publication Critical patent/JPH0317648U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の平面図、第２図は
はみ出た接着剤を張出部で受けている様子を示す
図、第３図は本考案による樹脂のタブへの咬み込
みを説明する図、第４図は本考案の他の実施例の
要部の平面図、第５図は従来の一例の平面図であ
る。 ２…ＩＣチツプ、１０…リードフレーム、１１
…タブ、１１ａ…張出部、１１ａ′…外周線、１
２…タブリード、１６…樹脂、１７，１８…凹部
、１９…接着剤。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＩＣチツプを載置固定するための四角形のタブ
    のうち、各辺の略中央部に、水平面上に接着剤受
    け用の張出部を設けてなるＩＣチツプ用リードフ
    レーム。
JP1989078467U 1989-07-03 1989-07-03 Pending JPH0317648U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989078467U JPH0317648U (ja) 1989-07-03 1989-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989078467U JPH0317648U (ja) 1989-07-03 1989-07-03

Publications (1)

Publication Number Publication Date
JPH0317648U true JPH0317648U (ja) 1991-02-21

Family

ID=31621765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989078467U Pending JPH0317648U (ja) 1989-07-03 1989-07-03

Country Status (1)

Country Link
JP (1) JPH0317648U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203274A (ja) * 2008-05-27 2008-09-04 Tacmina Corp 残留塩素計およびこれを用いた液体殺菌装置
KR101017869B1 (ko) * 2008-10-09 2011-03-04 오영선 배수지 또는 수조에서의 수질 대표값 측정 시스템

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008203274A (ja) * 2008-05-27 2008-09-04 Tacmina Corp 残留塩素計およびこれを用いた液体殺菌装置
KR101017869B1 (ko) * 2008-10-09 2011-03-04 오영선 배수지 또는 수조에서의 수질 대표값 측정 시스템

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