JPH0322407U - - Google Patents

Info

Publication number
JPH0322407U
JPH0322407U JP8330189U JP8330189U JPH0322407U JP H0322407 U JPH0322407 U JP H0322407U JP 8330189 U JP8330189 U JP 8330189U JP 8330189 U JP8330189 U JP 8330189U JP H0322407 U JPH0322407 U JP H0322407U
Authority
JP
Japan
Prior art keywords
package
circuit board
matching circuit
semiconductor element
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8330189U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8330189U priority Critical patent/JPH0322407U/ja
Publication of JPH0322407U publication Critical patent/JPH0322407U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires

Landscapes

  • Microwave Amplifiers (AREA)
  • Waveguides (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による高周波高出
力用半導体装置を示す斜視図、第２図は従来の高
周波高出力用半導体装置を示す斜視図である。 図において、１……パツケージ、２……半導体
素子、３……入力整合回路基板、４……出力整合
回路基板、５……導体パターン、６……金属細線
、７……ゲート外部リード、８……ドレイン外部
リード、９……ストレート形の金属体、１０……
Ｈ形の金属体である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属を主体とするパツケージ内部に半導体素子
    およびマイクロストリツプライン形のインピーダ
    ンス変換機能を備えた整合回路基板が設けられ、
    前記半導体素子と整合回路基板とが金属細線によ
    り接続され、さらに前記パツケージの開口部が金
    属板で封止された高周波高出力用半導体装置にお
    いて、前記半導体素子が並列に接続された整合回
    路基板をそれぞれ仕切るように前記パツケージ内
    部に金属体を設けたことを特徴とする高周波高出
    力用半導体装置。
JP8330189U 1989-07-14 1989-07-14 Pending JPH0322407U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8330189U JPH0322407U (ja) 1989-07-14 1989-07-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8330189U JPH0322407U (ja) 1989-07-14 1989-07-14

Publications (1)

Publication Number Publication Date
JPH0322407U true JPH0322407U (ja) 1991-03-07

Family

ID=31630851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8330189U Pending JPH0322407U (ja) 1989-07-14 1989-07-14

Country Status (1)

Country Link
JP (1) JPH0322407U (ja)

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