JPH03246977A - Manufacture of superconductor wiring based on oxide of bismuth, lead, strontium, calcium and copper - Google Patents

Manufacture of superconductor wiring based on oxide of bismuth, lead, strontium, calcium and copper

Info

Publication number
JPH03246977A
JPH03246977A JP2042367A JP4236790A JPH03246977A JP H03246977 A JPH03246977 A JP H03246977A JP 2042367 A JP2042367 A JP 2042367A JP 4236790 A JP4236790 A JP 4236790A JP H03246977 A JPH03246977 A JP H03246977A
Authority
JP
Japan
Prior art keywords
lead
strontium
bismuth
calcium
superconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2042367A
Other languages
Japanese (ja)
Other versions
JP3026224B2 (en
Inventor
Hironori Gotou
後藤　尋規
Kazunori Yamanaka
一典 山中
Takuya Uzumaki
拓也 渦巻
Atsushi Tanaka
厚志 田中
Nobuo Kamehara
亀原　信男
Koichi Niwa
丹羽　紘一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2042367A priority Critical patent/JP3026224B2/en
Publication of JPH03246977A publication Critical patent/JPH03246977A/en
Application granted granted Critical
Publication of JP3026224B2 publication Critical patent/JP3026224B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Landscapes

  • Inorganic Compounds Of Heavy Metals (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)

Abstract

PURPOSE:To obtain a superconductor wiring in which a residual resistance is not left by a method wherein a thick film used to manufacture a superconductor based on an oxide of bismuth, lead, strontium, calcium and copper is manufactured and the thick film is covered with a ceramic cover and is baked. CONSTITUTION:A paste used to manufacture a superconductor based on an oxide of bismuth, lead, strontium, calcium and copper is printed on a magnesium-oxide single-crystal substrate 1 by using a screen printing method; a thick film or a thin film 2 used to manufacture the superconductor is formed and dried. Then, the film 2 is covered with a cover 3 composed of magnetism oxide or with a cover 31 composed of a metal; this assembly is heated and baked in the air. A gap of about 100 to 1000mum is formed between the film 2 and the cover 3 or the cover 31. When the film 2 is baked together with the cover 3 or the cover 31, it is possible to restrain a superconductor component from being evaporated. As a result, even when a wiring having a narrow line width is formed, it is possible to manufacture a superconductor wiring in which a residual resistance is not left at a critical temperature of 77K.

Description

【発明の詳細な説明】 Ｅ概要〕 ビスマス・鉛・ストロンチウム・カルシウム・銅の酸化
物系超伝導体配線の製造方法、特に、配線幅の狭い配線
の電気的特性の劣化を少なくする製造方法に関し、 配線幅が狭くても臨界温度Ｔｃの低下が殆んど無く、液
体窒素温度の７７Ｋにおいて残留抵抗が残らないように
するビスマス・鉛・ストロンチウム・カルシウム・銅の
酸化物系超伝導体配線の製造方法を提供することを目的
とし、 ビスマス・鉛・ストロンチウム・カルシウム・銅の酸化
物系超伝導体製造用ペーストを成形して、前記のビスマ
ス・鉛・ストロンチウム・カルシウム・銅の酸化物系超
伝導体製造用厚膜または薄膜を製造し、この厚膜または
薄膜をセラミックスまたは金属のカバーをもって覆って
焼成する工程をもって構成する。[Detailed Description of the Invention] E-Summary] This invention relates to a method for manufacturing bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring, particularly a manufacturing method that reduces deterioration of electrical characteristics of narrow wiring. , a bismuth-lead-strontium-calcium-copper oxide-based superconductor interconnect that has almost no drop in critical temperature Tc even when the interconnect width is narrow and leaves no residual resistance at the liquid nitrogen temperature of 77K. For the purpose of providing a manufacturing method, a paste for manufacturing bismuth-lead-strontium-calcium-copper oxide-based superconductors is molded to produce the aforementioned bismuth-lead-strontium-calcium-copper oxide-based superconductors. It consists of the steps of manufacturing a thick or thin film for producing a conductor, covering the thick or thin film with a ceramic or metal cover, and firing it.

〔産業上の利用分野〕[Industrial application field]

本発明は、ビスマス・鉛・ストロンチウム・カルシウム
・銅の酸化物系超伝導体配線の製造方法、特に、配線幅
の狭い配線の電気的特性の劣化を少なくする製造方法に
関する。The present invention relates to a method for manufacturing bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring, and particularly to a manufacturing method for reducing deterioration of electrical characteristics of narrow wiring.

〔従来の技術〕[Conventional technology]

超伝導配線は、直流電流に対しては電気抵抗が零である
ため、損失なく電流を流すことができ、また、高周波電
流に対しても、極めて少ないエネルギー損失をもって電
流を流すことができるので高性能な配線材料として期待
されている。Superconducting wiring has zero electrical resistance to direct current, so it can pass current without loss, and it can also pass high-frequency current with extremely little energy loss, so it is highly effective. It is expected to be a high-performance wiring material.

超伝導体厚膜配線は、基板上に超伝導体製造用ペースト
を印刷法を使用して印刷して所定の配線パターンを形成
し、これを焼成することによって形成される。また、超
伝導薄膜配線は、基板上に蒸着法、スパッタ法等を使用
して超伝導体製造用薄膜を形成し、これをパターニング
して配線パターンを形成した後焼成することによって形
成される。Superconductor thick film wiring is formed by printing a superconductor manufacturing paste on a substrate using a printing method to form a predetermined wiring pattern, and then firing this. Further, superconducting thin film wiring is formed by forming a superconductor manufacturing thin film on a substrate using a vapor deposition method, a sputtering method, etc., patterning the thin film to form a wiring pattern, and then baking it.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

ところで、ビスマス・鉛・ストロンチウム・カルシウム
・銅の酸化物系超伝導体配線を形成する場合に、超伝導
体バルクを製造する場合と同一の焼成条件をもって焼成
しても、配線幅が狭くなると臨界温度Ｔｃが低くなった
り、液体窒素温度の７７Ｋにおいて残留抵抗が残ると云
う現象が発生することを本願発明の発明者等は発見した
。By the way, when forming bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring, even if the firing is performed under the same firing conditions as those used for manufacturing bulk superconductors, criticality may occur if the wiring width becomes narrow. The inventors of the present invention discovered that a phenomenon occurs in which residual resistance remains when the temperature Tc becomes low or the liquid nitrogen temperature is 77K.

具体例を示すと、超伝導体配線の配線幅が５ｍの場合に
は、第６図の温度−抵抗率曲線に示すように、臨界温度
Ｔｃが１００Ｋを超えているのに対し、配線幅が１ｍと
狭くなった場合には、第７図に示すように、臨界温度Ｔ
ｃが低くなり、液体窒素温度の７７Ｋにおいて残留抵抗
が残ってしまう。To give a concrete example, when the wiring width of the superconductor wiring is 5 m, as shown in the temperature-resistivity curve in Figure 6, the critical temperature Tc exceeds 100K, but the wiring width is When the width is 1 m, as shown in Figure 7, the critical temperature T
c becomes low, and residual resistance remains at the liquid nitrogen temperature of 77K.

本発明の目的は、この欠点を解消することにあり、配線
幅が狭くても臨界温度Ｔｃの低下が殆んど無く、液体窒
素の気化温度である７７Ｋにおいても残留抵抗が残らな
いようにするビスマス・鉛・ストロンチウム・カルシウ
ム・銅の酸化物系超伝導体配線の製造方法を提供するこ
とにある。The purpose of the present invention is to eliminate this drawback, so that there is almost no drop in the critical temperature Tc even if the wiring width is narrow, and no residual resistance remains even at 77K, which is the vaporization temperature of liquid nitrogen. The object of the present invention is to provide a method for manufacturing bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring.

〔課題を解決するための手段〕[Means to solve the problem]

上記の目的は、ビスマス・鉛・ストロンチウム・カルシ
ウム・銅の酸化物系超伝導体製造用ペーストを成形して
、前記のビスマス・鉛・ストロンチウム・カルシウム・
銅の酸化物系超伝導体製造用厚膜（これを焼成してビス
マス・鉛・ストロンチウム・カルシウム・銅の酸化物系
超伝導体を製造する中間材としての厚膜）または薄膜（
これを焼成してビスマス・鉛・ストロンチウム・カルシ
ウム・銅の酸化物系超伝導体を製造する中間材としての
薄膜）（２）を製造し、この厚膜または薄膜（２）をセ
ラミックスのカバー（３）または金属のカバー（３１）
をもって覆って焼成をなす工程を有するビスマス・鉛・
ストロンチウム・カルシウム・銅の酸化物系超伝導体配
線の製造方法によって達成される。なお、前記の厚膜ま
たは薄膜（２）とセラミックスのカバー（３）または金
属のカバー（３１）との間に僅かの間隙を介在させるこ
とが効果的である。The above purpose is to mold a paste for manufacturing bismuth, lead, strontium, calcium, and copper oxide superconductors, and
Thick films for producing copper oxide superconductors (thick films used as intermediate materials for producing bismuth, lead, strontium, calcium, and copper oxide superconductors by firing) or thin films (
This is fired to produce a thin film (2) as an intermediate material for producing bismuth-lead-strontium-calcium-copper oxide superconductors, and this thick or thin film (2) is then covered with a ceramic cover (2). 3) or metal cover (31)
Bismuth, lead,
This is achieved by a method for manufacturing strontium-calcium-copper oxide-based superconductor wiring. Note that it is effective to provide a slight gap between the thick film or thin film (2) and the ceramic cover (3) or metal cover (31).

〔作用〕[Effect]

本発明の発明者等は、超伝導体配線の配線幅が狭くなる
と臨界温度Ｔｃが低下する理由は下記によるものと推考
した。すなわち、配線幅が狭い場合には、第３図の蒸発
概念図に示すように、焼成工程において超伝導体製造用
厚膜または薄膜から超伝導体成分が容易に蒸発してしま
うために１１０に相が十分生成されず、一方、配線幅が
広い場合には、第４図の蒸発概念図に示すように、超伝
導体製造用厚膜または薄膜表面近傍における超伝導体成
分の蒸発分子密度が高くなって超伝導体成分の蒸発が抑
制されるために１１０に相が十分生成され、臨界温度Ｔ
ｃの高い超伝導体配線が形成されるものと推考した。そ
こで、第５図に示すように、基板１上に形成された超伝
導体製造用厚膜または薄膜２をセラミックスのカバー３
または金属のカバー３１をもって覆って焼成すれば、超
伝導体成分の蒸発が抑制されて線幅が狭い場合にも臨界
温度Ｔｃの高い超伝導体配線を形成することができるで
あろうとの着想を得て研究を重ね、この着想を具体化し
たものである。The inventors of the present invention conjectured that the reason why the critical temperature Tc decreases as the wiring width of the superconductor wiring becomes narrower is as follows. That is, when the wiring width is narrow, as shown in the evaporation conceptual diagram in FIG. If the phase is not sufficiently generated and the wiring width is wide, the evaporated molecular density of the superconductor component near the surface of the thick film or thin film for superconductor production will decrease, as shown in the evaporation conceptual diagram in Figure 4. At 110, sufficient phase is generated to suppress the evaporation of the superconductor components, and the critical temperature T
It was assumed that a superconductor wiring with a high c was formed. Therefore, as shown in FIG.
Alternatively, the idea was that if the metal cover 31 is used to cover and bake, the evaporation of the superconductor components will be suppressed and it will be possible to form a superconductor wiring with a high critical temperature Tc even when the line width is narrow. After much research and development, this idea became concrete.

なお、超伝導体製造用厚膜または薄ｌｌ！Ｉ２とセラミ
ックスのカバー３または金属のカバー３１との間に１０
０〜５００ｎ程度の極めて僅かの間隙（この間隙は線幅
に支配されるが線幅を０．１−０．５　Ｍと仮定した場
合１００〜５００．ａである。）を介在させることが、
良質の超伝導体配線を形成する上において有効であるこ
とを見出した。その理由は、焼成工程において蒸発する
鉛、（Ｐ　ｂ　）または酸化鉛（ＰｂＯ）がこの間隙に
封じ込められることによって、その蒸発が抑制されてｌ
ｌ０Ｋ相の生成が促進され、しかも、最終的には、すべ
ての鉛（Ｐｂ）または酸化鉛（ＰｂＯ）がこの間隙内に
蒸発し除去されるため良質の超伝導体配線が形成される
ものと考えられる。In addition, thick film or thin film for superconductor production! 10 between I2 and ceramic cover 3 or metal cover 31
By interposing an extremely small gap of about 0 to 500 nm (this gap is controlled by the line width, but assuming the line width is 0.1 to 0.5 M, it is 100 to 500 mm).
We have found that this method is effective in forming high-quality superconductor wiring. The reason for this is that lead, (P b ) or lead oxide (PbO) that evaporates during the firing process is confined in this gap, suppressing its evaporation.
The formation of the 10K phase is promoted, and ultimately all the lead (Pb) or lead oxide (PbO) is evaporated and removed within this gap, resulting in the formation of high-quality superconductor wiring. Conceivable.

〔実施例〕〔Example〕

以下、図面を参照しつ＼、本発明の一実施例に係るビス
マス・鉛・ストロンチウム・カルシウム・銅の酸化物系
超伝導体配線の製造方法について説明する。Hereinafter, with reference to the drawings, a method for manufacturing a bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring according to an embodiment of the present invention will be described.

第１図（ａ）参照 酸化マグネシウム（ＭｇＯ）単結晶基板１上に、ビスマ
ス・鉛・ストロンチウム・カルシウム・銅の酸化物系超
伝導体製造用ペーストをスクリーン印刷法を使用して印
刷して、幅が０．５■であり長さが１５ｍである配線パ
ターンを有する超伝導体製造用厚膜または薄膜２を形成
し、乾燥する。Referring to FIG. 1(a), on a magnesium oxide (MgO) single crystal substrate 1, a paste for producing an oxide superconductor of bismuth, lead, strontium, calcium, and copper is printed using a screen printing method. A thick film or thin film 2 for producing a superconductor having a wiring pattern having a width of 0.5 square meters and a length of 15 m is formed and dried.

第１図（ｂ）参照 酸化マグネシウム（ＭｇＯ）よりなるカバー３または金
属よりなるカバー３１をもって上記の超伝導体製造用厚
膜または薄膜２を覆い、大気中において８４０〜８９０
℃の温度に加熱して焼成する。Refer to FIG. 1(b) Cover the above-mentioned thick film or thin film 2 for superconductor production with a cover 3 made of magnesium oxide (MgO) or a cover 31 made of metal.
Fire by heating to a temperature of °C.

第２図参照 上記の工程をもって製造された輻０．５−の超伝導体配
線の温度と抵抗率との関係を第２図に示す。See FIG. 2 FIG. 2 shows the relationship between temperature and resistivity of the superconductor wiring with a radius of 0.5-, which was manufactured through the above process.

臨界温度Ｔｃは１００Ｋを超え、第６図に示す通常の焼
成法をもって焼成された輻５ｍの超伝導体配線の特性と
比べて遜色のない特性が得られた。The critical temperature Tc exceeded 100 K, and the characteristics were comparable to those of a superconductor wiring with a radius of 5 m fired using the normal firing method shown in FIG.

なお、超伝導体製造用厚膜または薄膜２と酸化マグネシ
ウム（ＭｇＯ）のカバー３または金属のカバー３１との
間に１００〜１，０００　ｎ程度の僅かの間隙を設ける
ことが、良質の超伝導体配線を製造する上で効果的であ
る。Note that providing a small gap of about 100 to 1,000 nm between the thick film or thin film 2 for superconductor production and the magnesium oxide (MgO) cover 3 or the metal cover 31 is recommended for high-quality superconductivity. It is effective in manufacturing body wiring.

〔発明の効果〕〔Effect of the invention〕

以上説明せるとおり、本発明に係るビスマス・鉛・スト
ロンチウム・カルシウム・銅の酸化物系超伝導体配線の
製造方法においては、ビスマス・鉛・ストロンチウム・
カルシウム・銅の酸化物系超伝導体製造用厚膜または薄
膜をセラミックスまたは金属のカバーをもって覆って焼
成することによって超伝導体成分の蒸発が抑制されるの
で、線幅の狭い配線を形成する場合にも臨界温度Ｔｃの
低下が殆ど無く、液体窒素温度の７７Ｋにおいて残留抵
抗が残らないビスマス・鉛・ストロンチウム・カルシウ
ム・銅の酸化物系超伝導体配線を製造することが可能で
ある。As explained above, in the method for manufacturing bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring according to the present invention, bismuth-lead-strontium-copper
Evaporation of the superconductor components is suppressed by covering the thick or thin film with a ceramic or metal cover and firing it for producing calcium/copper oxide superconductors, so when forming wiring with a narrow line width. However, it is possible to produce bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring with almost no drop in critical temperature Tc and no residual resistance at the liquid nitrogen temperature of 77K.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（ａ）（ｂ）は、本発明の一実施例に係るビスマ
ス・鉛・ストロンチウム・カルシウム・銅の酸化物系超
伝導体配線の製造方法を説明する工程図である。 第２図は、本発明の一実施例に係るビスマス・鉛・スト
ロンチウム・カルシウム・銅の酸化物系超伝導体配線の
製造方法を使用して製造された配線の抵抗率と温度との
関係を示すグラフである。 第３図・第４図は、超伝導体製造用厚膜または薄膜から
の蒸発を説明する蒸発概念図である。 第５図は本発明の原理図である。 第６図は、従来技術に係る製造方法を使用して製造され
た幅５閣の超伝導体配線の抵抗率と温度との関係を示す
グラフである。 第７図は従来技術に係る製造方法を使用して製造された
輻１■の超伝導体配線の抵抗率と温度との関係を示すグ
ラフである。 ・ＭｇＯ基板、 ・超伝導体製造用厚膜または薄膜、 ・セラミックスのカバー ・金属のカバーFIGS. 1(a) and 1(b) are process diagrams illustrating a method of manufacturing a bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring according to an embodiment of the present invention. FIG. 2 shows the relationship between the resistivity and temperature of wiring manufactured using the method for manufacturing bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring according to an embodiment of the present invention. This is a graph showing. FIGS. 3 and 4 are conceptual diagrams of evaporation for explaining evaporation from thick or thin films for producing superconductors. FIG. 5 is a diagram showing the principle of the present invention. FIG. 6 is a graph showing the relationship between the resistivity and temperature of a superconductor wiring of five widths manufactured using a manufacturing method according to the prior art. FIG. 7 is a graph showing the relationship between the resistivity and temperature of a superconductor wiring of level 1, manufactured using the manufacturing method according to the prior art.・MgO substrate, ・Thick or thin film for superconductor production, ・Ceramics cover, Metal cover

Claims (1)

【特許請求の範囲】 ［１］ビスマス・鉛・ストロンチウム・カルシウム・銅
の酸化物系超伝導体製造用ペーストを成形して、前記ビ
スマス・鉛・ストロンチウム・カルシウム・銅の酸化物
系超伝導体製造用厚膜（２）を製造し、 該厚膜（２）をセラミックスのカバー（３）をもって覆
って焼成をなす 工程を有することを特徴とするビスマス・鉛・ストロン
チウム・カルシウム・銅の酸化物系超伝導体配線の製造
方法。 ［２］前記厚膜（２）とセラミックスのカバー（３）と
の間に僅かの間隙を介在させることを特徴とする請求項
１記載のビスマス・鉛・ストロンチウム・カルシウム・
銅の酸化物系超伝導体配線の製造方法。 ［３］ビスマス・鉛・ストロンチウム・カルシウム・銅
の酸化物系超伝導体製造用ペーストを成形して、前記ビ
スマス・鉛・ストロンチウム・カルシウム・銅の酸化物
系超伝導体製造用厚膜（２）を製造し、 該厚膜（２）を金属のカバー（３１）をもって覆って焼
成をなす 工程を有することを特徴とするビスマス・鉛・ストロン
チウム・カルシウム・銅の酸化物系超伝導体配線の製造
方法。 ［４］前記厚膜（２）と金属のカバー（３１）との間に
僅かの間隙を介在させることを特徴とする請求項３記載
のビスマス・鉛・ストロンチウム・カルシウム・銅の酸
化物系超伝導体配線の製造方法。 ［５］ビスマス・鉛・ストロンチウム・カルシウム・銅
の酸化物系超伝導体製造用ペーストを成形して、前記ビ
スマス・鉛・ストロンチウム・カルシウム・銅の酸化物
系超伝導体製造用薄膜（２）を製造し、 該薄膜（２）をセラミックスのカバー（３）をもって覆
って焼成をなす 工程を有することを特徴とするビスマス・鉛・ストロン
チウム・カルシウム・銅の酸化物系超伝導体配線の製造
方法。 ［６］前記薄膜（２）とセラミックスのカバー（３）と
の間に僅かの間隙を介在させることを特徴とする請求項
１記載のビスマス・鉛・ストロンチウム・カルシウム・
銅の酸化物系超伝導体配線の製造方法。 ［７］ビスマス・鉛・ストロンチウム・カルシウム・銅
の酸化物系超伝導体製造用ペーストを成形して、前記ビ
スマス・鉛・ストロンチウム・カルシウム・銅の酸化物
系超伝導体製造用薄膜（２）を製造し、 該薄膜（２）を金属のカバー（３１）をもって覆って焼
成をなす 工程を有することを特徴とするビスマス・鉛・ストロン
チウム・カルシウム・銅の酸化物系超伝導体配線の製造
方法。 ［８］前記薄膜（２）と金属のカバー（３１）との間に
僅かの間隙を介在させることを特徴とする請求項３記載
のビスマス・鉛・ストロンチウム・カルシウム・銅の酸
化物系超伝導体配線の製造方法。[Scope of Claims] [1] A paste for producing an oxide-based superconductor of bismuth, lead, strontium, calcium, and copper is molded to produce the oxide-based superconductor of bismuth, lead, strontium, calcium, and copper. An oxide of bismuth, lead, strontium, calcium, and copper, which comprises the steps of producing a thick film (2) for production, covering the thick film (2) with a ceramic cover (3), and firing it. A method for manufacturing superconductor wiring. [2] The bismuth-lead-strontium-calcium film according to claim 1, wherein a slight gap is interposed between the thick film (2) and the ceramic cover (3).
A method for producing copper oxide superconductor wiring. [3] Form the paste for manufacturing bismuth-lead-strontium-calcium-copper oxide-based superconductors to form the thick film (2 ), the thick film (2) is covered with a metal cover (31) and fired. Production method. [4] The bismuth-lead-strontium-calcium-copper oxide-based superstructure according to claim 3, characterized in that a slight gap is interposed between the thick film (2) and the metal cover (31). Method of manufacturing conductor wiring. [5] Forming the paste for manufacturing an oxide-based superconductor of bismuth, lead, strontium, calcium, and copper to form a thin film for manufacturing the bismuth-lead-strontium-calcium-copper oxide-based superconductor (2) A method for manufacturing a bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring, comprising the steps of: manufacturing the thin film (2), covering the thin film (2) with a ceramic cover (3), and firing the thin film (2). . [6] The bismuth-lead-strontium-calcium film according to claim 1, wherein a slight gap is interposed between the thin film (2) and the ceramic cover (3).
A method for producing copper oxide superconductor wiring. [7] Form the paste for producing an oxide-based superconductor of bismuth, lead, strontium, calcium, and copper to form a thin film for producing the bismuth-lead-strontium-calcium-copper oxide-based superconductor (2) A method for producing a bismuth-lead-strontium-calcium-copper oxide-based superconductor wiring, comprising the steps of: producing the thin film (2) with a metal cover (31) and firing the thin film (2); . [8] The bismuth-lead-strontium-calcium-copper oxide-based superconductor according to claim 3, characterized in that a slight gap is interposed between the thin film (2) and the metal cover (31). Method of manufacturing body wiring.
JP2042367A 1990-02-26 1990-02-26 Manufacturing method of bismuth / lead / strontium / calcium / copper oxide superconductor wiring Expired - Fee Related JP3026224B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2042367A JP3026224B2 (en) 1990-02-26 1990-02-26 Manufacturing method of bismuth / lead / strontium / calcium / copper oxide superconductor wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2042367A JP3026224B2 (en) 1990-02-26 1990-02-26 Manufacturing method of bismuth / lead / strontium / calcium / copper oxide superconductor wiring

Publications (2)

Publication Number Publication Date
JPH03246977A true JPH03246977A (en) 1991-11-05
JP3026224B2 JP3026224B2 (en) 2000-03-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2042367A Expired - Fee Related JP3026224B2 (en) 1990-02-26 1990-02-26 Manufacturing method of bismuth / lead / strontium / calcium / copper oxide superconductor wiring

Country Status (1)

Country Link
JP (1) JP3026224B2 (en)

Also Published As

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JP3026224B2 (en) 2000-03-27

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