JPH032635U - - Google Patents
Info
- Publication number
- JPH032635U JPH032635U JP6254489U JP6254489U JPH032635U JP H032635 U JPH032635 U JP H032635U JP 6254489 U JP6254489 U JP 6254489U JP 6254489 U JP6254489 U JP 6254489U JP H032635 U JPH032635 U JP H032635U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- insulating substrate
- bonding pad
- printed wiring
- bare chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Description
第１図イないしハは本考案における一実施例概
略構成図、第２図イおよびロは従来例説明図であ
る。 １……印刷配線板、２……ダイランド、３……
ベアチツプ、４……ボンデイング・パツド、５…
…ワイヤー、６……プツシユ・バツク可能な絶縁
基板、７……開口。
略構成図、第２図イおよびロは従来例説明図であ
る。 １……印刷配線板、２……ダイランド、３……
ベアチツプ、４……ボンデイング・パツド、５…
…ワイヤー、６……プツシユ・バツク可能な絶縁
基板、７……開口。
Claims (1)
- 【実用新案登録請求の範囲】 絶縁基板上に回路、ダイランド２、およびボン
デイング・パツド４が形成されている印刷配線板
１において、 当該印刷配線板１の一部を打ち抜いてプツシユ
・バツク可能な状態に嵌め込まれている絶縁基板
６と、 当該プツシユ・バツク可能な絶縁基板６上に設
けられたダイランド２と、 当該ダイランド２上に載置されている半導体ベ
アチツプ３と、 当該半導体ベアチツプ３と上記印刷配線板１の
ボンデイング・パツド４とを接続するワイヤー５
と、 半導体ベアチツプ３、ボンデイング・パツド４
およびワイヤー５の部分をモールドする樹脂と、 からなることを特徴とする印刷配線板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6254489U JPH032635U (ja) | 1989-05-31 | 1989-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6254489U JPH032635U (ja) | 1989-05-31 | 1989-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032635U true JPH032635U (ja) | 1991-01-11 |
Family
ID=31591791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6254489U Pending JPH032635U (ja) | 1989-05-31 | 1989-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032635U (ja) |
-
1989
- 1989-05-31 JP JP6254489U patent/JPH032635U/ja active Pending