JPH03270090A - Board warpage preventing implement - Google Patents
Board warpage preventing implementInfo
- Publication number
- JPH03270090A JPH03270090A JP7059990A JP7059990A JPH03270090A JP H03270090 A JPH03270090 A JP H03270090A JP 7059990 A JP7059990 A JP 7059990A JP 7059990 A JP7059990 A JP 7059990A JP H03270090 A JPH03270090 A JP H03270090A
- Authority
- JP
- Japan
- Prior art keywords
- board
- port
- advanced
- solder jet
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims abstract description 15
- 238000005452 bending Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〉
本発明は、電子回路基板（以下基板と言う）の半田付は
品質向上並びに生産効率向上に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to soldering of electronic circuit boards (hereinafter referred to as "boards") to improve quality and production efficiency.
（従来の技術と現状〉
従来では、多くの電子部品（４）を挿入された基板（５
）の裏面（電子回路面＝以下Ｂターン面と言う）が自動
半田付は機（第２図）の半田噴流面（７）と接触し通過
することにより、半田付けをおこなっていまず。その際
に、半田の温度は摂氏約２５０度の高温の為基板本体が
柔らかくなり、膨張し、尚かつ上部の電子部品（４）等
の重力の為基板（５）の中央部（６）が下方に湾曲して
しまう。その為に、問題点Ａとして半田噴流面（７）へ
進入時に基板中央（６）上部に半田が乗り上る。（第４
図Ａ参照）
問題点Ｂとして基板（５）のパターン面が半田噴流面（
７）から離れる際、その面と面が水平に均一でない為半
田付けが悪く、半田付は品質が悪い。(Conventional technology and current situation) In the past, many electronic components (4) were inserted into a board (5).
) (electronic circuit surface = hereinafter referred to as the B-turn surface) contacts and passes through the solder jet surface (7) of the automatic soldering machine (Figure 2) to perform soldering. At that time, the solder temperature is about 250 degrees Celsius, so the board body becomes soft and expands, and the central part (6) of the board (5) also It curves downward. Therefore, problem A is that the solder rides on the upper part of the center of the board (6) when it enters the solder jet surface (7). (4th
(See Figure A) Problem B is that the pattern surface of the board (5) is on the solder jet surface (see Figure A).
7) When separated from the surface, the soldering is poor because the surfaces are not horizontally uniform, and the quality of the soldering is poor.
（俗に言うタッチ、トンネルの不良が多発する）（発明
の目的）
本発明器具を第１図基板に取り付け、半田付は時基板（
５）の湾曲を防止し、上記問題点Ａ及びＢを解決するこ
とを目的とするものである。(Touch and tunnel defects occur frequently.) (Purpose of the Invention) The device of the present invention is attached to the circuit board shown in Figure 1, and the soldering is carried out when the circuit board (
The purpose of this invention is to prevent the curvature of 5) and solve the above problems A and B.
（発明の構成と実施例）
図面（３ａ）の凹部に、基板中央部（６）を挿入固定し
、基板（５）の両側面を自動半田付は機（第２図）の基
板搬送チェーンの爪（８）に取っ付ける事により自動的
に半田噴流口（９）に進入する。その際（３）の下部（
３ｂ）を削っである為半田噴流口（９）の受板（１０）
の上にスムーズに乗り上がり、尚かつ（２ンの突起部に
て基板（５）を支えて、半田噴流面（７）とパターン面
が平行かつ均一に接触進行し、問題点Ａ及びＢを解決し
ながら良好な半田付けができる。(Structure and Embodiments of the Invention) The central part (6) of the board is inserted and fixed into the recess shown in drawing (3a), and both sides of the board (5) are automatically soldered using the board conveying chain of the machine (Fig. 2). By attaching it to the claw (8), it automatically enters the solder jet port (9). In this case, the lower part of (3) (
3b) is cut, so the receiving plate (10) of the solder jet port (9)
The board (5) is supported by the protrusion (2), and the solder jet surface (7) and the pattern surface come into contact with each other in parallel and uniformly, thus solving problems A and B. Good soldering can be achieved while solving the problem.
（発明の効果）
第４図Ａの通り、本発明器具（第１図）の未使用の場合
は、半田品質上悪化するが、本発明器具（１第１図）を
基板中央部（６）に取り付け、半田付けすることにより
、第４図のＢの通り半田噴流面（７）とパターン面が平
行に均一化され、接触進行し、問題点Ａ及びＢが解決さ
れる。又半田付は完了後の半田修正する人が減少し、品
質的にも効率的にも効果は大きい。(Effect of the invention) As shown in FIG. 4A, when the device of the present invention (Fig. 1) is not used, the solder quality deteriorates; By attaching and soldering, the solder jet surface (7) and the pattern surface are made parallel and uniform as shown in FIG. 4B, and contact progresses, thereby solving problems A and B. In addition, the number of people who touch up the soldering after soldering is completed is reduced, which has a great effect in terms of quality and efficiency.
第１図は本発明の本体器具である。
第２図は本発明器具（第１図）を基板（５）のパターン
面中央部（６）に、取付けた状態の自動半田付け８！（
必要以外の構造は省略している）の平面図である。
第３図は本発明器具（第１図）を取り付けて、半田付け
している状態で、第２図の＜Ａ）から見た側面図である
。
第４図Ａは、本発明器具第１図を取り付けていない時と
、第４図Ｂは、取り付けている時の半田付は進行状態で
、第２図の（Ｂ）から見た側面図である。FIG. 1 shows the main device of the present invention. Figure 2 shows automatic soldering 8! with the device of the present invention (Figure 1) attached to the center part (6) of the pattern surface of the board (5). (
FIG. FIG. 3 is a side view of the device of the present invention (FIG. 1) installed and soldered, as seen from <A) in FIG. 2. Figure 4A is a side view of the device of the present invention in Figure 1 when it is not installed, and Figure 4B is a side view of the device in Figure 2 with soldering in progress when it is installed. be.
Claims (1)
（針）状の突起部（２）を有し、尚（１）の先端に電子
回路基板の固定可能な部分（３ａ）を有する事を特徴と
する半田付け時電子回路基板の湾曲防止器具。The rod-shaped main body (1) has a sword-shaped protrusion (2) on the top that supports the surface of the electronic circuit board, and the tip of (1) has a part (3a) to which the electronic circuit board can be fixed. A device for preventing bending of an electronic circuit board during soldering, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2070599A JPH0793493B2 (en) | 1990-03-19 | 1990-03-19 | Board warp prevention device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2070599A JPH0793493B2 (en) | 1990-03-19 | 1990-03-19 | Board warp prevention device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03270090A true JPH03270090A (en) | 1991-12-02 |
| JPH0793493B2 JPH0793493B2 (en) | 1995-10-09 |
Family
ID=13436192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2070599A Expired - Lifetime JPH0793493B2 (en) | 1990-03-19 | 1990-03-19 | Board warp prevention device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0793493B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008251623A (en) * | 2007-03-29 | 2008-10-16 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board |
-
1990
- 1990-03-19 JP JP2070599A patent/JPH0793493B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008251623A (en) * | 2007-03-29 | 2008-10-16 | Ngk Spark Plug Co Ltd | Manufacturing method of wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0793493B2 (en) | 1995-10-09 |
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