JPH0330299B2 - - Google Patents
Info
- Publication number
- JPH0330299B2 JPH0330299B2 JP57110637A JP11063782A JPH0330299B2 JP H0330299 B2 JPH0330299 B2 JP H0330299B2 JP 57110637 A JP57110637 A JP 57110637A JP 11063782 A JP11063782 A JP 11063782A JP H0330299 B2 JPH0330299 B2 JP H0330299B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- transfer base
- support
- base
- wafer support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57110637A JPS593944A (ja) | 1982-06-29 | 1982-06-29 | ウエハ−搬送装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57110637A JPS593944A (ja) | 1982-06-29 | 1982-06-29 | ウエハ−搬送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS593944A JPS593944A (ja) | 1984-01-10 |
| JPH0330299B2 true JPH0330299B2 (cs) | 1991-04-26 |
Family
ID=14540771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57110637A Granted JPS593944A (ja) | 1982-06-29 | 1982-06-29 | ウエハ−搬送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS593944A (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60264338A (ja) * | 1984-06-11 | 1985-12-27 | Furukawa Electric Co Ltd:The | 光フアイバ母材の製造方法 |
| JP2728766B2 (ja) * | 1990-07-18 | 1998-03-18 | 株式会社東芝 | 半導体の処理方法およびその装置 |
| JP2754297B2 (ja) * | 1991-09-30 | 1998-05-20 | 株式会社フジクラ | レーザ治療用光ファイバ |
-
1982
- 1982-06-29 JP JP57110637A patent/JPS593944A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS593944A (ja) | 1984-01-10 |
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