JPH0332432U - - Google Patents

Info

Publication number
JPH0332432U
JPH0332432U JP1989091910U JP9191089U JPH0332432U JP H0332432 U JPH0332432 U JP H0332432U JP 1989091910 U JP1989091910 U JP 1989091910U JP 9191089 U JP9191089 U JP 9191089U JP H0332432 U JPH0332432 U JP H0332432U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation fin
semiconductor device
view
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989091910U
Other languages
English (en)
Other versions
JPH0648865Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989091910U priority Critical patent/JPH0648865Y2/ja
Publication of JPH0332432U publication Critical patent/JPH0332432U/ja
Application granted granted Critical
Publication of JPH0648865Y2 publication Critical patent/JPH0648865Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Description

【図面の簡単な説明】
第１図は本考案の一実施例の取付機構を利用し
て半導体装置に放熱フインを取り付けた状態を示
す断面図、第２図は同じくその正面図、第３図は
同じくその平面図、第４図は同じくその側面図、
第５図は同じく放熱フインの斜視図、第６図は同
じく封止樹脂の硬化収縮特性による反りの状態を
示す図である。第７図は従来のねじ締めにより半
導体装置に放熱フインを取り付けた例を示す正面
図、第８図は同じくその側面図、第９図は同じく
その平面図、第１０図は同じくその断面図、第１
１図は同じくその半導体装置の正面図、第１２図
は同じくその放熱フインの斜視図である。 １１……外枠、１２……半導体内部素子、１３
……熱硬化封止樹脂、１４……半導体装置、１５
……放熱フイン、１７……凹部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱フインと、該放熱フインに形成された凹部
    に挿入載置され、かつ挿入載置された状態で外枠
    内の半導体素子が熱硬化封止樹脂により樹脂封止
    される半導体装置とからなる半導体装置の放熱フ
    イン取付機構。
JP1989091910U 1989-08-03 1989-08-03 半導体装置の放熱フイン取付機構 Expired - Fee Related JPH0648865Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989091910U JPH0648865Y2 (ja) 1989-08-03 1989-08-03 半導体装置の放熱フイン取付機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989091910U JPH0648865Y2 (ja) 1989-08-03 1989-08-03 半導体装置の放熱フイン取付機構

Publications (2)

Publication Number Publication Date
JPH0332432U true JPH0332432U (ja) 1991-03-29
JPH0648865Y2 JPH0648865Y2 (ja) 1994-12-12

Family

ID=31641369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989091910U Expired - Fee Related JPH0648865Y2 (ja) 1989-08-03 1989-08-03 半導体装置の放熱フイン取付機構

Country Status (1)

Country Link
JP (1) JPH0648865Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101043369B1 (ko) * 2009-03-06 2011-06-21 현대로템 주식회사 소화기 상태 감지 시스템

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101043369B1 (ko) * 2009-03-06 2011-06-21 현대로템 주식회사 소화기 상태 감지 시스템

Also Published As

Publication number Publication date
JPH0648865Y2 (ja) 1994-12-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees