JPH0334239U - - Google Patents
Info
- Publication number
- JPH0334239U JPH0334239U JP1989095299U JP9529989U JPH0334239U JP H0334239 U JPH0334239 U JP H0334239U JP 1989095299 U JP1989095299 U JP 1989095299U JP 9529989 U JP9529989 U JP 9529989U JP H0334239 U JPH0334239 U JP H0334239U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- tip
- bonding tool
- tool
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例を示すインナリードボ
ンデイングツールの構成図、第２図は本考案のイ
ンナリードボンデイングツールのボンデイング時
の状態を示す図、第３図は本考案のインナリード
ボンデイングツールを用いた場合の接合部分の引
張強度特性図、第４図は従来のＴＡＢ技術を用い
た半導体装置の製造工程図、第５図はその半導体
装置のインナリードのボンデイング状態を示す断
面図、第６図は従来のインナリードボンデイング
ツールの構成図、第７図は従来のインナリードボ
ンデイングツールのボンデイング時の問題点説明
図、第８図は従来のボンデイングツールを用いた
場合の接合部分の引張強度特性図、第９図は本考
案の他の実施例を示すアウタリードボンデイング
ツールの構成図、第１０図は本考案のアウタリー
ドボンデイングツールを用いた半導体パツケージ
のボンデイング状態を示す図である。
１０……インナリードボンデイングツール、１
１，２１……先端チツプ、１２，１２′、２２…
…ボンデイング面、１３，２３……ツール母材、
２０……アウタリードボンデイングツール、３０
……半導体パツケージ、３１……リード。
Fig. 1 is a configuration diagram of an inner lead bonding tool according to an embodiment of the present invention, Fig. 2 is a diagram showing the state of the inner lead bonding tool of the present invention during bonding, and Fig. 3 is a diagram showing the inner lead bonding tool of the present invention. 4 is a diagram showing the manufacturing process of a semiconductor device using conventional TAB technology. FIG. 5 is a sectional view showing the bonding state of the inner lead of the semiconductor device. Figure 6 is a configuration diagram of a conventional inner lead bonding tool, Figure 7 is a diagram explaining problems during bonding with a conventional inner lead bonding tool, and Figure 8 is a diagram showing the tensile strength of the joint when using a conventional bonding tool. FIG. 9 is a block diagram of an outer lead bonding tool showing another embodiment of the present invention, and FIG. 10 is a diagram showing a bonding state of a semiconductor package using the outer lead bonding tool of the present invention. 10...Inner lead bonding tool, 1
1, 21... Tip tip, 12, 12', 22...
... bonding surface, 13, 23 ... tool base material,
20...Outer lead bonding tool, 30
...Semiconductor package, 31...Lead.
Claims (1)
イングツールにおいて、 (a) ボンデイング面を球面状に形成する先端チ
ツプと、 (b) 該先端チツプと異なる材料からなり、該先
端チツプを支持するツール母材とを具備すること
を特徴とするボンデイングツール。[Claims for Utility Model Registration] A bonding tool for bonding leads of semiconductor devices, which includes: (a) a tip whose bonding surface is formed into a spherical shape; and (b) a tip made of a material different from that of the tip; A bonding tool comprising a supporting tool base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989095299U JPH0731542Y2 (en) | 1989-08-15 | 1989-08-15 | Bonding tools |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989095299U JPH0731542Y2 (en) | 1989-08-15 | 1989-08-15 | Bonding tools |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0334239U true JPH0334239U (en) | 1991-04-04 |
| JPH0731542Y2 JPH0731542Y2 (en) | 1995-07-19 |
Family
ID=31644569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989095299U Expired - Lifetime JPH0731542Y2 (en) | 1989-08-15 | 1989-08-15 | Bonding tools |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0731542Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645026A (en) * | 1987-06-26 | 1989-01-10 | Matsushita Electric Industrial Co Ltd | Bonding tool |
-
1989
- 1989-08-15 JP JP1989095299U patent/JPH0731542Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS645026A (en) * | 1987-06-26 | 1989-01-10 | Matsushita Electric Industrial Co Ltd | Bonding tool |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0731542Y2 (en) | 1995-07-19 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |