JPH033794U - - Google Patents
Info
- Publication number
- JPH033794U JPH033794U JP6452889U JP6452889U JPH033794U JP H033794 U JPH033794 U JP H033794U JP 6452889 U JP6452889 U JP 6452889U JP 6452889 U JP6452889 U JP 6452889U JP H033794 U JPH033794 U JP H033794U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- circuit board
- insertion hole
- heat pipe
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案による一実施例の斜視図、第２
図は従来技術による斜視図である。
図において、１……回路基板、２……高熱伝導
ブロツク、２ａ……挿入孔、３……ヒートシンク
、３ａ−１……挿入孔、３ｂ……放熱フイン、４
……ヒートパイプ、１０……発熱部品を示す。
Fig. 1 is a perspective view of one embodiment of the present invention;
The figure is a perspective view according to the prior art. In the figure, 1... Circuit board, 2... High heat conduction block, 2a... Insertion hole, 3... Heat sink, 3a-1... Insertion hole, 3b... Heat dissipation fin, 4
... Heat pipe, 10 ... Indicates a heat generating component.
Claims (1)
構造であつて、 前記発熱部品１０を側面に密着搭載し他の側面
にヒートパイプ４を嵌入する挿入孔２ａを穿設し
た高熱伝導ブロツク２を前記回路基板１の一端に
固設し、側面にヒートパイプ４を嵌入する挿入孔
３ａ−１を穿設した放熱フイン３ｂを有するヒー
トシンク３を反対側の他端に固設し、前記ブロツ
ク２の挿入孔２ａにヒートパイプ４の吸熱端を、
ヒートシンク３の挿入孔３ａ−１にヒートパイプ
４の放熱端を嵌着し、該ヒートパイプ４の剛性に
より回路基板１を補強するとともに、高放熱する
ことを特徴とする回路基板の補強構造。[Claims for Utility Model Registration] A reinforcing structure for a circuit board 1 on which a heat generating component 10 is mounted, in which the heat generating component 10 is closely mounted on one side and an insertion hole 2a is bored in the other side for inserting a heat pipe 4. The high thermal conductivity block 2 is fixed to one end of the circuit board 1, and a heat sink 3 having heat dissipation fins 3b having insertion holes 3a-1 formed on the side surface into which the heat pipes 4 are inserted is fixed to the other end of the opposite side. and insert the endothermic end of the heat pipe 4 into the insertion hole 2a of the block 2.
A reinforcing structure for a circuit board, characterized in that the heat dissipation end of a heat pipe 4 is fitted into an insertion hole 3a-1 of a heat sink 3, and the rigidity of the heat pipe 4 reinforces the circuit board 1 and provides high heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6452889U JPH033794U (en) | 1989-06-01 | 1989-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6452889U JPH033794U (en) | 1989-06-01 | 1989-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH033794U true JPH033794U (en) | 1991-01-16 |
Family
ID=31595557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6452889U Pending JPH033794U (en) | 1989-06-01 | 1989-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH033794U (en) |
-
1989
- 1989-06-01 JP JP6452889U patent/JPH033794U/ja active Pending
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