JPH0344421B2 - - Google Patents
Info
- Publication number
- JPH0344421B2 JPH0344421B2 JP60022749A JP2274985A JPH0344421B2 JP H0344421 B2 JPH0344421 B2 JP H0344421B2 JP 60022749 A JP60022749 A JP 60022749A JP 2274985 A JP2274985 A JP 2274985A JP H0344421 B2 JPH0344421 B2 JP H0344421B2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- displacement
- tapered roller
- micro
- seam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60022749A JPS61183946A (ja) | 1985-02-09 | 1985-02-09 | マイクロパラレルシ−ム接合装置の接合不良判別方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60022749A JPS61183946A (ja) | 1985-02-09 | 1985-02-09 | マイクロパラレルシ−ム接合装置の接合不良判別方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61183946A JPS61183946A (ja) | 1986-08-16 |
| JPH0344421B2 true JPH0344421B2 (mo) | 1991-07-05 |
Family
ID=12091338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60022749A Granted JPS61183946A (ja) | 1985-02-09 | 1985-02-09 | マイクロパラレルシ−ム接合装置の接合不良判別方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183946A (mo) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100348744B1 (ko) * | 1998-06-17 | 2002-10-25 | 차이나 스틸 코포레이션 | 벽부재상의링리테이너내에장착되는튜브형본체의조립과해체에적합한푸시풀장치 |
| KR101366536B1 (ko) * | 2012-12-13 | 2014-02-28 | 주식회사 장원 | 용광로용 풍구해체장치 |
| LU100373B1 (en) * | 2017-08-18 | 2019-03-26 | Wurth Paul Sa | Extraction Device for a Tuyere Part |
-
1985
- 1985-02-09 JP JP60022749A patent/JPS61183946A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61183946A (ja) | 1986-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5062301A (en) | Scanning device for ultrasonic quality control of articles | |
| JPWO2002047862A1 (ja) | ナット等溶接装置 | |
| KR101136101B1 (ko) | 튜브 용접선 정렬장치와 그 제어방법 | |
| JPH0344421B2 (mo) | ||
| JP2024037795A (ja) | フレームレスのモータ駆動部を有するダイナミックバランサ | |
| US3819902A (en) | Pattern welding control device | |
| CN218331238U (zh) | 定子熔接检测机 | |
| JP3338607B2 (ja) | ピンホール検査装置 | |
| JP3238664B2 (ja) | レーザ溶接部の検査方法 | |
| JP2002239754A (ja) | 摩擦攪拌接合方法及びその装置 | |
| JPH049098Y2 (mo) | ||
| KR100270098B1 (ko) | 용접품질 판정장치 및 방법 | |
| KR102606676B1 (ko) | 용접 검사 장치 | |
| JP3432681B2 (ja) | マイクロパラレルシーム接合装置 | |
| JPS62282778A (ja) | スパイラルミル外面溶接用シ−ム位置検出装置 | |
| JPS59198735A (ja) | シ−ム溶接法 | |
| JPH0731890Y2 (ja) | シーム溶接機 | |
| JP2557087Y2 (ja) | シーム接合の仮止め用電極装置 | |
| JPH02229680A (ja) | 溶接状態判断システム | |
| JP6190707B2 (ja) | センサのキャリブレーション用の基準部材及びセンサのキャリブレーション方法 | |
| JPH04190998A (ja) | 溶接装置 | |
| JPH10232180A (ja) | 溶接の気密性検査方法および検査装置 | |
| JPH0230152Y2 (mo) | ||
| JP2002035946A (ja) | スポット溶接方法およびその装置 | |
| JPS606280A (ja) | シ−ム熔接方法 |