JPH0345681U - - Google Patents
Info
- Publication number
- JPH0345681U JPH0345681U JP10681189U JP10681189U JPH0345681U JP H0345681 U JPH0345681 U JP H0345681U JP 10681189 U JP10681189 U JP 10681189U JP 10681189 U JP10681189 U JP 10681189U JP H0345681 U JPH0345681 U JP H0345681U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- overlap
- parts
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の一実施例を示す混成集積回路
装置の配線パターンが形成された基板の一部を示
す平面図、第２図及び第３図は本考案の他の実施
例を示す混成集積回路装置の配線パターンが形成
された基板の一部を示す平面図、第４図は混成集
積回路の一例である低周波領域通過フイルタを示
す回路図、第５図は従来の低周波領域通過フイル
タの回路が形成された基板の一部を示す平面図で
ある。
１……基板、２，２ｂ，２ｃ……第１の配線パ
ターン、３……第２の配線パターン、３ａ，３ｂ
，３ｃ，３ｄ，３ｅ，３ｆ，３ｇ，３ｈ，３ｉ…
…配線部分。
FIG. 1 is a plan view showing a part of a substrate on which a wiring pattern of a hybrid integrated circuit device is formed, showing one embodiment of the present invention, and FIGS. 2 and 3 are hybrid integrated circuit devices showing other embodiments of the present invention. A plan view showing a part of a substrate on which a wiring pattern of an integrated circuit device is formed, FIG. 4 is a circuit diagram showing a low frequency region passing filter which is an example of a hybrid integrated circuit, and FIG. 5 is a circuit diagram showing a conventional low frequency region passing filter. FIG. 2 is a plan view showing a part of a substrate on which a filter circuit is formed. 1... Board, 2, 2b, 2c... First wiring pattern, 3... Second wiring pattern, 3a, 3b
, 3c, 3d, 3e, 3f, 3g, 3h, 3i...
...Wiring part.
Claims (1)
る第１及び第２の配線パターンと、これらの配線
パターンで配線部分が互いに重なり合う配線部分
と重なり合わない配線部分とを有し、この重なり
合わない配線部分のいずれか側の配線部分を任意
に切断することにより前記重なり合う配線部分で
容量が設定されるコンデンサとを有することを特
徴とする混成集積回路装置。 The wiring pattern has first and second wiring patterns made of a conductive film formed on a substrate via an insulating film, and wiring parts of these wiring patterns overlap with each other and wiring parts that do not overlap with each other. A hybrid integrated circuit device comprising: a capacitor whose capacitance is set in the overlapping wiring portion by arbitrarily cutting the wiring portion on either side of the wiring portions that do not match.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10681189U JPH0345681U (en) | 1989-09-11 | 1989-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10681189U JPH0345681U (en) | 1989-09-11 | 1989-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345681U true JPH0345681U (en) | 1991-04-26 |
Family
ID=31655533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10681189U Pending JPH0345681U (en) | 1989-09-11 | 1989-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345681U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006285078A (en) * | 2005-04-04 | 2006-10-19 | Mineo Harada | Bridge silencer |
-
1989
- 1989-09-11 JP JP10681189U patent/JPH0345681U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006285078A (en) * | 2005-04-04 | 2006-10-19 | Mineo Harada | Bridge silencer |