JPH0350328U - - Google Patents

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Publication number
JPH0350328U
JPH0350328U JP11152489U JP11152489U JPH0350328U JP H0350328 U JPH0350328 U JP H0350328U JP 11152489 U JP11152489 U JP 11152489U JP 11152489 U JP11152489 U JP 11152489U JP H0350328 U JPH0350328 U JP H0350328U
Authority
JP
Japan
Prior art keywords
sample
metal film
ion
diagram showing
etching apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11152489U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11152489U priority Critical patent/JPH0350328U/ja
Publication of JPH0350328U publication Critical patent/JPH0350328U/ja
Pending legal-status Critical Current

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  • Drying Of Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るイオンエツチング装置の
要部実施例を示す図、第２図は本考案の応用例を
示す図、第３図は従来のカウフマン型のイオン源
を持つイオンエツチング装置を示す構成断面図、
第４図はコード板の構成を示す図、第５図は異常
放電により破壊された試料の拡大図である。 ７……試料台、８……試料、２０……金属膜、
２１……ガラス基板、２２……電子線レジスト、
１６……試料押え。

Claims (1)

  1. 【実用新案登録請求の範囲】 絶縁物の基板２１に金属膜２０を設け、更にこ
    の金属膜２０の上に電子線レジスト２２が設けら
    れた試料８を試料台７上に配置し、この試料台を
    冷却しながら試料にイオンビームを衝突させてエ
    ツチングを行なうイオンエツチング装置において
    、 前記試料台７を熱伝導率の高いセラミツクスで
    構成したことを特徴とするイオンエツチング装置
    。
JP11152489U 1989-09-22 1989-09-22 Pending JPH0350328U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11152489U JPH0350328U (ja) 1989-09-22 1989-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11152489U JPH0350328U (ja) 1989-09-22 1989-09-22

Publications (1)

Publication Number Publication Date
JPH0350328U true JPH0350328U (ja) 1991-05-16

Family

ID=31659996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11152489U Pending JPH0350328U (ja) 1989-09-22 1989-09-22

Country Status (1)

Country Link
JP (1) JPH0350328U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002360321A (ja) * 2001-06-12 2002-12-17 Etsuzo Fukuda 杖の支持装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62272537A (ja) * 1986-05-21 1987-11-26 Hitachi Ltd イオンビ−ム加工方法
JPS63155727A (ja) * 1986-12-19 1988-06-28 Hitachi Ltd 低温ドライエツチング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62272537A (ja) * 1986-05-21 1987-11-26 Hitachi Ltd イオンビ−ム加工方法
JPS63155727A (ja) * 1986-12-19 1988-06-28 Hitachi Ltd 低温ドライエツチング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002360321A (ja) * 2001-06-12 2002-12-17 Etsuzo Fukuda 杖の支持装置

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