JPS61179557A - 電子部品用キヤツプ - Google Patents

電子部品用キヤツプ

Info

Publication number
JPS61179557A
JPS61179557A JP59198164A JP19816484A JPS61179557A JP S61179557 A JPS61179557 A JP S61179557A JP 59198164 A JP59198164 A JP 59198164A JP 19816484 A JP19816484 A JP 19816484A JP S61179557 A JPS61179557 A JP S61179557A
Authority
JP
Japan
Prior art keywords
cap
bonding
electronic components
electronic part
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59198164A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0351297B2 (2
Inventor
Kenro Kimata
木俣　賢朗
Osamu Fujikawa
治 藤川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP59198164A priority Critical patent/JPS61179557A/ja
Publication of JPS61179557A publication Critical patent/JPS61179557A/ja
Publication of JPH0351297B2 publication Critical patent/JPH0351297B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
JP59198164A 1984-09-20 1984-09-20 電子部品用キヤツプ Granted JPS61179557A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59198164A JPS61179557A (ja) 1984-09-20 1984-09-20 電子部品用キヤツプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59198164A JPS61179557A (ja) 1984-09-20 1984-09-20 電子部品用キヤツプ

Publications (2)

Publication Number Publication Date
JPS61179557A true JPS61179557A (ja) 1986-08-12
JPH0351297B2 JPH0351297B2 (2) 1991-08-06

Family

ID=16386527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59198164A Granted JPS61179557A (ja) 1984-09-20 1984-09-20 電子部品用キヤツプ

Country Status (1)

Country Link
JP (1) JPS61179557A (2)

Also Published As

Publication number Publication date
JPH0351297B2 (2) 1991-08-06

Similar Documents

Publication Publication Date Title
US4750092A (en) Interconnection package suitable for electronic devices and methods for producing same
US6649834B1 (en) Injection molded image sensor and a method for manufacturing the same
JPH0452623B2 (2)
JPH02126685A (ja) 固体イメージセンサー
JPS61179557A (ja) 電子部品用キヤツプ
JPS6134990A (ja) 電子部品搭載用基板およびその製造方法
US7288847B2 (en) Assembly including a circuit and an encapsulation frame, and method of making the same
JPS617692A (ja) 導体ピンの固着方法および導体ピン固着のプリント配線板
KR100221562B1 (ko) 볼 그리드 어레이 반도체 패키지의 구조 및 그 제조 방법
JPS6288345A (ja) プラスチツク封止固体イメ−ジセンサ−
JPH01164044A (ja) チップ実装方法
JP3818219B2 (ja) 電子部品封入パッケージ並びにその製造方法
JP2682499B2 (ja) 半導体装置
JPS6239033A (ja) 半導体チツプキヤリアの製造方法
JPS6239036A (ja) ハイブリツドｉｃ
JP2700257B2 (ja) 配線基板付きリードフレームとその製造方法
JPS63114152A (ja) 混成集積回路
JPH0456187A (ja) プリント配線板の製造方法
JP2596788B2 (ja) 基板集合シートとその製造方法
JPS61296743A (ja) チツプキヤリア
KR100515101B1 (ko) 반도체패키지의 제조 방법 및 그 반도체패키지
KR100641511B1 (ko) 고집적 반도체 패키지 및 그 제조 방법
JPS6239034A (ja) 半導体チツプキヤリアの製造方法
JPS60227492A (ja) 電子回路ブロツク
JPS6240754A (ja) ピングリッドアレイ

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term