JPS6373943U - - Google Patents

Info

Publication number
JPS6373943U
JPS6373943U JP1986168426U JP16842686U JPS6373943U JP S6373943 U JPS6373943 U JP S6373943U JP 1986168426 U JP1986168426 U JP 1986168426U JP 16842686 U JP16842686 U JP 16842686U JP S6373943 U JPS6373943 U JP S6373943U
Authority
JP
Japan
Prior art keywords
extending
package
protrude
resin
metal piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986168426U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986168426U priority Critical patent/JPS6373943U/ja
Publication of JPS6373943U publication Critical patent/JPS6373943U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図ａおよびｂは本考案に係る半導体装置の
チツプ封止前の状態を示す平面図と側面図、第２
図は同じく半導体装置の完成品を示す斜視図、第
３図は第２実施例を示す斜視図、第４図ａおよび
ｂは第３実施例を示す平面図と側面図、第５図は
その完成品を示す斜視図、第６図は第４実施例を
示す斜視図、第７図ａおよびｂは従来の半導体装
置のチツプ封止前の状態を示す平面図と側面図、
第８図はその完成品を示す斜視図である。 １……リードフレーム、２〜５……外部リード
、６〜９……内部電極、１８……パツケージ、３
１〜３５……延在片、３６……連結片、３７……
樹脂受け。

Claims (1)

    【実用新案登録請求の範囲】
  1. パツケージによつてその一部が樹脂封止され一
    側方に突出する複数の外部リードおよびこれら外
    部リードに各々接続する内部電極を有する金属片
    と、この金属片の内部電極に前記外部リードと反
    対側に突出するように設けられかつ連結片によつ
    て分断可能に接続された複数の延在片とを備え、
    前記パツケージの延在片側に前記連結片の長手方
    向に延在する樹脂受けを一体に設けたことを特徴
    とする半導体装置。
JP1986168426U 1986-10-31 1986-10-31 Pending JPS6373943U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986168426U JPS6373943U (ja) 1986-10-31 1986-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986168426U JPS6373943U (ja) 1986-10-31 1986-10-31

Publications (1)

Publication Number Publication Date
JPS6373943U true JPS6373943U (ja) 1988-05-17

Family

ID=31101297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986168426U Pending JPS6373943U (ja) 1986-10-31 1986-10-31

Country Status (1)

Country Link
JP (1) JPS6373943U (ja)

Similar Documents

Publication Publication Date Title
JPS6361149U (ja)
JPS6344454U (ja)
JPS61102055U (ja)
JPS6346855U (ja)
JPH02102734U (ja)
JPS61109148U (ja)
JPH01143128U (ja)
JPH0211332U (ja)
JPH01145140U (ja)
JPH01112053U (ja)
JPS6278762U (ja)
JPS62104460U (ja)
JPH0379442U (ja)
JPS6329938U (ja)
JPS6298240U (ja)
JPS6242247U (ja)
JPS61111160U (ja)
JPS6237930U (ja)
JPH024261U (ja)
JPS6390864U (ja)
JPH0373444U (ja)
JPS6424852U (ja)
JPH03116043U (ja)
JPH01120334U (ja)
JPS6327054U (ja)