JPH0361331U - - Google Patents

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Publication number
JPH0361331U
JPH0361331U JP12274389U JP12274389U JPH0361331U JP H0361331 U JPH0361331 U JP H0361331U JP 12274389 U JP12274389 U JP 12274389U JP 12274389 U JP12274389 U JP 12274389U JP H0361331 U JPH0361331 U JP H0361331U
Authority
JP
Japan
Prior art keywords
wafer
bonded
substrate
substrate according
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12274389U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12274389U priority Critical patent/JPH0361331U/ja
Publication of JPH0361331U publication Critical patent/JPH0361331U/ja
Pending legal-status Critical Current

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  • Weting (AREA)

Description

【図面の簡単な説明】
第１図Ａ乃至Ｅは本考案Ｓｉウエハ張り合わせ
基板の一実施例の製造工程図、第２図は本考案一
実施例に係る溝の形成状態を示す上面図、第３図
は本考案他の実施例に係る溝の形成状態を示す断
面図である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 表面に所定の深さの溝が形成されたＳｉウ
    エハを、溝が形成された表面を張り合わせ面とし
    て、基板に張り合わしてなることを特徴とするＳ
    ｉウエハ張り合わせ基板。 (2) Ｓｉウエハに形成される溝は、複数である
    ことを特徴とする請求項１記載のＳｉウエハ張り
    合わせ基板。 (3) Ｓｉウエハを張り合わせる基板はＳｉ基板
    であることを特徴とする請求項１または２記載の
    Ｓｉウエハ張り合わせ基板。 (4) Ｓｉウエハを張り合わせる基板及びＳｉウ
    エハの張り合わせる面夫々に、Ｓｉ酸化膜が形成
    されていることを特徴とする請求項１，２または
    ３記載のＳｉウエハ張り合わせ基板。 (5) Ｓｉウエハに形成される溝は、Ｓｉウエハ
    の端部から延設されていることを特徴とする請求
    項１，２，３または４記載のＳｉウエハ張り合わ
    せ基板。
JP12274389U 1989-10-19 1989-10-19 Pending JPH0361331U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12274389U JPH0361331U (ja) 1989-10-19 1989-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12274389U JPH0361331U (ja) 1989-10-19 1989-10-19

Publications (1)

Publication Number Publication Date
JPH0361331U true JPH0361331U (ja) 1991-06-17

Family

ID=31670736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12274389U Pending JPH0361331U (ja) 1989-10-19 1989-10-19

Country Status (1)

Country Link
JP (1) JPH0361331U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008233473A (ja) * 2007-03-20 2008-10-02 Ntt Electornics Corp 薄膜基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121715A (ja) * 1983-12-06 1985-06-29 Toshiba Corp 半導体ウエハの接合方法
JPS61144839A (ja) * 1984-12-18 1986-07-02 Toshiba Corp 半導体ウエハの接着方法
JPS62101031A (ja) * 1985-10-28 1987-05-11 Nec Corp 集積回路

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121715A (ja) * 1983-12-06 1985-06-29 Toshiba Corp 半導体ウエハの接合方法
JPS61144839A (ja) * 1984-12-18 1986-07-02 Toshiba Corp 半導体ウエハの接着方法
JPS62101031A (ja) * 1985-10-28 1987-05-11 Nec Corp 集積回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008233473A (ja) * 2007-03-20 2008-10-02 Ntt Electornics Corp 薄膜基板の製造方法

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