JPH0361354U - - Google Patents

Info

Publication number
JPH0361354U
JPH0361354U JP1989122387U JP12238789U JPH0361354U JP H0361354 U JPH0361354 U JP H0361354U JP 1989122387 U JP1989122387 U JP 1989122387U JP 12238789 U JP12238789 U JP 12238789U JP H0361354 U JPH0361354 U JP H0361354U
Authority
JP
Japan
Prior art keywords
resin case
resin
cut
semiconductor device
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989122387U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989122387U priority Critical patent/JPH0361354U/ja
Publication of JPH0361354U publication Critical patent/JPH0361354U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は従来装置の断面構造図、第２図、第４
図は本考案の実施例をしめす断面構造図、第３図
ａ，ｂは製造工程図であり、１……半導体チツプ
、２，２′……リード片、Ａ，Ａ′……リード片
の外部電極面、Ｂ，Ｂ′……リード片の折曲部、
Ｃ，Ｃ′……リード片の端部切断面、Ｄ，Ｄ′…
…リード片の薄い部分、３……接続子、４……樹
脂ケースである。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 少なくとも、半導体チツプ、予め折曲部を
    形成した複数個のリード片、及び樹脂ケースから
    成り、リード片の折曲部を樹脂ケース内に配置し
    、その折曲部の一部を樹脂ケースから露出せしめ
    て外部電極面となし、かつ、折曲部から樹脂ケー
    スの外側に向うリード片の端部切断面を樹脂ケー
    ス表面の近傍又は内側に配置せしめるように構成
    したことを特徴とする樹脂封止型半導体装置。 (2) 樹脂ケース下方に各外部電極面を配置し、
    樹脂ケース側方にリード片の端部切断面を配置し
    た実用新案登録請求の範囲第(1)項の樹脂封止型
    半導体装置。 (3) 外力により切断し得るごとく、リード片に
    予め設けた切り込みなどによる薄い部分に端部切
    断面を設けた実用新案登録請求の範囲第(1)項、
    及び第(2)項の樹脂封止型半導体装置。
JP1989122387U 1989-10-19 1989-10-19 Pending JPH0361354U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989122387U JPH0361354U (ja) 1989-10-19 1989-10-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989122387U JPH0361354U (ja) 1989-10-19 1989-10-19

Publications (1)

Publication Number Publication Date
JPH0361354U true JPH0361354U (ja) 1991-06-17

Family

ID=31670388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989122387U Pending JPH0361354U (ja) 1989-10-19 1989-10-19

Country Status (1)

Country Link
JP (1) JPH0361354U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062527A (ja) * 2006-10-04 2013-04-04 Rohm Co Ltd 半導体装置
JP2016003910A (ja) * 2014-06-16 2016-01-12 アルプス電気株式会社 圧力検出装置及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013062527A (ja) * 2006-10-04 2013-04-04 Rohm Co Ltd 半導体装置
JP2016003910A (ja) * 2014-06-16 2016-01-12 アルプス電気株式会社 圧力検出装置及びその製造方法

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