JPH0350342U - - Google Patents
Info
- Publication number
- JPH0350342U JPH0350342U JP1989111715U JP11171589U JPH0350342U JP H0350342 U JPH0350342 U JP H0350342U JP 1989111715 U JP1989111715 U JP 1989111715U JP 11171589 U JP11171589 U JP 11171589U JP H0350342 U JPH0350342 U JP H0350342U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- heat sink
- recess
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
- H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図は従来装置の断面構造図、第２図、第３
図は本考案の実施例を示す断面構造図、斜視構造
図、第４図は第３図の製造工程図、１……半導体
チツプ、２……内部接続片、３……外部取出しリ
ード片、４……絶縁金属基板、５……樹脂ケース
、６……注入樹脂部、７……凹部、８……放熱体
、Ａ……接着材である。
図は本考案の実施例を示す断面構造図、斜視構造
図、第４図は第３図の製造工程図、１……半導体
チツプ、２……内部接続片、３……外部取出しリ
ード片、４……絶縁金属基板、５……樹脂ケース
、６……注入樹脂部、７……凹部、８……放熱体
、Ａ……接着材である。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 放熱体を具備する樹脂封止型半導体装置に
おいて、樹脂ケースの内、半導体チツプを装着し
た部分の少なくとも片面に凹部を形成し、該凹部
に放熱体をその一部が露出するごとく、はめ込ん
で固着したことを特徴とする樹脂封止型半導体装
置。 (2) 樹脂ケースの内、放熱体の固着部分よりリ
ード取出し部分を厚く形成した実用新案登録請求
の範囲第(1)項の樹脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989111715U JPH0350342U (ja) | 1989-09-25 | 1989-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989111715U JPH0350342U (ja) | 1989-09-25 | 1989-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350342U true JPH0350342U (ja) | 1991-05-16 |
Family
ID=31660182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989111715U Pending JPH0350342U (ja) | 1989-09-25 | 1989-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350342U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366953A (ja) * | 1986-09-08 | 1988-03-25 | Toshiba Corp | 樹脂絶縁型半導体装置 |
-
1989
- 1989-09-25 JP JP1989111715U patent/JPH0350342U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6366953A (ja) * | 1986-09-08 | 1988-03-25 | Toshiba Corp | 樹脂絶縁型半導体装置 |