JPH0363942U - - Google Patents

Info

Publication number
JPH0363942U
JPH0363942U JP12545489U JP12545489U JPH0363942U JP H0363942 U JPH0363942 U JP H0363942U JP 12545489 U JP12545489 U JP 12545489U JP 12545489 U JP12545489 U JP 12545489U JP H0363942 U JPH0363942 U JP H0363942U
Authority
JP
Japan
Prior art keywords
insulating base
package
lid
recess
sealing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12545489U
Other languages
English (en)
Other versions
JPH0745962Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12545489U priority Critical patent/JPH0745962Y2/ja
Publication of JPH0363942U publication Critical patent/JPH0363942U/ja
Application granted granted Critical
Publication of JPH0745962Y2 publication Critical patent/JPH0745962Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は第１図に示す
半導体素子収納用パツケージの絶縁基体の平面図
、第３図は従来の半導体素子収納用パツケージの
断面図、第４図は第３図に示すパツケージの絶縁
基体の平面図である。 １……絶縁基体、１ａ……凹部、２……蓋体、
４……メタライズ金属層、６……外部リード端子
、７……絶縁膜、８……封止材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を収容するための凹部を有する絶縁
    基体と蓋体とから成り、絶縁基体上に該絶縁基体
    の凹部を塞ぐよう蓋体を封止材を介し取着するよ
    うになした半導体素子収納用パツケージにおいて
    、前記絶縁基体の少なくとも封止材が接合する表
    面に絶縁基体と実質的に同一の熱膨張係数を有し
    、且つ表面の中心線平均粗さ（Ｒａ）がＲａ≧０
    ．６５μｍである厚膜形成技術により形成される
    絶縁膜を被着させたことを特徴とする半導体素子
    収納用パツケージ。
JP12545489U 1989-10-26 1989-10-26 半導体素子収納用パッケージ Expired - Lifetime JPH0745962Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12545489U JPH0745962Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12545489U JPH0745962Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0363942U true JPH0363942U (ja) 1991-06-21
JPH0745962Y2 JPH0745962Y2 (ja) 1995-10-18

Family

ID=31673324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12545489U Expired - Lifetime JPH0745962Y2 (ja) 1989-10-26 1989-10-26 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0745962Y2 (ja)

Also Published As

Publication number Publication date
JPH0745962Y2 (ja) 1995-10-18

Similar Documents

Publication Publication Date Title
JPH0363942U (ja)
JPH0363945U (ja)
JPH0187547U (ja)
JPH0436235U (ja)
JPS602838U (ja) 保護膜を有する半導体装置
JPH0442731U (ja)
JPS5892745U (ja) 半導体圧力変換器
JPS59109164U (ja) 半導体装置
JPH0351845U (ja)
JPS6047319U (ja) 圧電振動子の容器
JPS6019229U (ja) 圧電発振器
JPH0247054U (ja)
JPH0434749U (ja)
JPH01162246U (ja)
JPH045650U (ja)
JPH0412636U (ja)
JPS63112348U (ja)
JPS6450438U (ja)
JPS59112951U (ja) 絶縁物封止半導体装置
JPH045651U (ja)
JPS6052725U (ja) 圧電振動子の容器
JPH0427623U (ja)
JPS62177047U (ja)
JPS59117149U (ja) ビ−ムリ−ド型半導体装置
JPS62186433U (ja)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term