JPH0363945U - - Google Patents

Info

Publication number
JPH0363945U
JPH0363945U JP1989125455U JP12545589U JPH0363945U JP H0363945 U JPH0363945 U JP H0363945U JP 1989125455 U JP1989125455 U JP 1989125455U JP 12545589 U JP12545589 U JP 12545589U JP H0363945 U JPH0363945 U JP H0363945U
Authority
JP
Japan
Prior art keywords
insulating base
package
recess
semiconductor element
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989125455U
Other languages
Japanese (ja)
Other versions
JPH0723965Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989125455U priority Critical patent/JPH0723965Y2/en
Publication of JPH0363945U publication Critical patent/JPH0363945U/ja
Application granted granted Critical
Publication of JPH0723965Y2 publication Critical patent/JPH0723965Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は従来の半導体
素子収納用パツケージの断面図である。 １……絶縁基体、１ａ……凹部、１ｂ……絶縁
膜、２……蓋体、４……接着剤。 FIG. 1 is a cross-sectional view showing an embodiment of a package for housing semiconductor elements of the present invention, and FIG. 2 is a cross-sectional view of a conventional package for housing semiconductor elements. DESCRIPTION OF SYMBOLS 1... Insulating base, 1a... Recess, 1b... Insulating film, 2... Lid, 4... Adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を載置収容するための凹部を有する
絶縁基体と蓋体とから成る半導体素子収納用パツ
ケージにおいて、前記絶縁基体の凹部底面に該絶
縁基体と実質的に同一の熱膨張係数を有し、且つ
表面の中心線平均粗さ（Ｒａ）がＲａ≧０．７μ
ｍである厚膜形成技術により形成される絶縁膜を
被着させたことを特徴とする半導体素子収納用パ
ツケージ。 In a package for storing a semiconductor element, which includes an insulating base and a lid having a recess for mounting and accommodating a semiconductor element, the bottom surface of the recess of the insulating base has substantially the same coefficient of thermal expansion as that of the insulating base; And the center line average roughness (Ra) of the surface is Ra≧0.7μ
1. A package for housing a semiconductor device, characterized in that it is coated with an insulating film formed by a thick film forming technique of m.
JP1989125455U 1989-10-26 1989-10-26 Package for storing semiconductor devices Expired - Lifetime JPH0723965Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989125455U JPH0723965Y2 (en) 1989-10-26 1989-10-26 Package for storing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989125455U JPH0723965Y2 (en) 1989-10-26 1989-10-26 Package for storing semiconductor devices

Publications (2)

Publication Number Publication Date
JPH0363945U true JPH0363945U (en) 1991-06-21
JPH0723965Y2 JPH0723965Y2 (en) 1995-05-31

Family

ID=31673325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989125455U Expired - Lifetime JPH0723965Y2 (en) 1989-10-26 1989-10-26 Package for storing semiconductor devices

Country Status (1)

Country Link
JP (1) JPH0723965Y2 (en)

Also Published As

Publication number Publication date
JPH0723965Y2 (en) 1995-05-31

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term