JPH0367061U - - Google Patents
Info
- Publication number
- JPH0367061U JPH0367061U JP12835289U JP12835289U JPH0367061U JP H0367061 U JPH0367061 U JP H0367061U JP 12835289 U JP12835289 U JP 12835289U JP 12835289 U JP12835289 U JP 12835289U JP H0367061 U JPH0367061 U JP H0367061U
- Authority
- JP
- Japan
- Prior art keywords
- target
- cooling plate
- electromagnet
- power supply
- transported
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 7
- 230000007723 transport mechanism Effects 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図は本考案のマグネトロンスパツタ装置構
成図、第２図は本考案の装置に使用するターゲツ
ト、第３図は本考案の一実施例のターゲツト装着
機構、である。
図において、１……ターゲツト、２……冷却板
、３……電磁石、３′……電磁石の直流電源、４
……スパツター用の直流電源、５……ターゲツト
搬送機構、６……基板、７……基板搬送機構、８
……スパツター室、９……排気系、１０……磁性
体、１１……使用前ターゲツト、１２……使用後
ターゲツト、１３……ストツパー、１４……冷却
管、である。
FIG. 1 is a block diagram of a magnetron sputtering device of the present invention, FIG. 2 is a target used in the device of the present invention, and FIG. 3 is a target mounting mechanism of an embodiment of the present invention. In the figure, 1...target, 2...cooling plate, 3...electromagnet, 3'...DC power supply for electromagnet, 4
...DC power supply for sputtering, 5...Target transport mechanism, 6...Substrate, 7...Substrate transport mechanism, 8
. . . spatter chamber, 9 . . . exhaust system, 10 . . . magnetic material, 11 . . . target before use, 12 .
Claims (1)
ト搬送機構５とを有し、 該冷却板２は内部に水冷管１４を有して、該タ
ーゲツト１を冷却するものであり、 該電磁石３はマグネトロンスパツターに必要な
磁場を形成するもので、直流電源４をオン・オフ
することにより、スパツターガンとして作用する
ものであり、 該ターゲツト搬送機構５は使用前のターゲツト
１を使用前格納部より該冷却板３に、また使用後
のターゲツトを該冷却板より使用後格納部に搬送
するものであり、 該ダーゲツト１はその裏面に磁性体１０を埋め
込んで、該電磁石３の電源３′のオン・オフと共
に、該冷却板２に密着・脱着をすることにより、
真空中で該ターゲツト１の交換を可能とすること
を特徴とするスパツター装置のターゲツト装着機
構。[Claims for Utility Model Registration] The target 1 has a target 1, a cooling plate 2, an electromagnet 3, and a target transport mechanism 5, and the cooling plate 2 has a water cooling pipe 14 inside to cool the target 1. The electromagnet 3 forms the magnetic field necessary for the magnetron sputter, and by turning on and off the DC power supply 4, it acts as a sputter gun.The target transport mechanism 5 carries the target 1 before use. The target 1 is transported from the storage section before use to the cooling plate 3, and the target after use is transported from the cooling plate to the storage section after use. By attaching and detaching the cooling plate 2 while turning on and off the power supply 3',
A target mounting mechanism for a sputtering device, characterized in that the target 1 can be replaced in a vacuum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12835289U JPH0367061U (en) | 1989-11-01 | 1989-11-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12835289U JPH0367061U (en) | 1989-11-01 | 1989-11-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367061U true JPH0367061U (en) | 1991-06-28 |
Family
ID=31676064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12835289U Pending JPH0367061U (en) | 1989-11-01 | 1989-11-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367061U (en) |
-
1989
- 1989-11-01 JP JP12835289U patent/JPH0367061U/ja active Pending
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