JPH0375550U - - Google Patents

Info

Publication number
JPH0375550U
JPH0375550U JP13571089U JP13571089U JPH0375550U JP H0375550 U JPH0375550 U JP H0375550U JP 13571089 U JP13571089 U JP 13571089U JP 13571089 U JP13571089 U JP 13571089U JP H0375550 U JPH0375550 U JP H0375550U
Authority
JP
Japan
Prior art keywords
electronic component
component module
semiconductor element
board
metal base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13571089U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13571089U priority Critical patent/JPH0375550U/ja
Publication of JPH0375550U publication Critical patent/JPH0375550U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors

Description

【図面の簡単な説明】
第１図はこの考案による電子部品モジユールの
一実施例を示した斜視図、第２図は同モジユール
の断面図である。 図中、１……金属ベース基板、２……金属上蓋
、３……外部端子、４……回路を構成する電子部
品、５……電子部品を固着している樹脂、６……
制御基板、７……支持部材、８……半導体素子（
中央演算処理回路）である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 動作により発熱する部品を実装した電子回路金
    属ベース基板と、それを覆うべく凹状にした金属
    上蓋とから成る電子部品モジユールにおいて、前
    記基板を制御する半導体素子を備えた配線基板を
    前記電子回路金属ベース基板上に支持部材をもつ
    て保持し、前記半導体素子の上面が、前記金属上
    蓋の内面に接するようにしたことを特徴とする電
    子部品モジユール。
JP13571089U 1989-11-22 1989-11-22 Pending JPH0375550U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13571089U JPH0375550U (ja) 1989-11-22 1989-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13571089U JPH0375550U (ja) 1989-11-22 1989-11-22

Publications (1)

Publication Number Publication Date
JPH0375550U true JPH0375550U (ja) 1991-07-29

Family

ID=31682958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13571089U Pending JPH0375550U (ja) 1989-11-22 1989-11-22

Country Status (1)

Country Link
JP (1) JPH0375550U (ja)

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