JPH0381641U - - Google Patents

Info

Publication number
JPH0381641U
JPH0381641U JP14218689U JP14218689U JPH0381641U JP H0381641 U JPH0381641 U JP H0381641U JP 14218689 U JP14218689 U JP 14218689U JP 14218689 U JP14218689 U JP 14218689U JP H0381641 U JPH0381641 U JP H0381641U
Authority
JP
Japan
Prior art keywords
semiconductor chip
lead frame
mounting surface
punched
pressed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14218689U
Other languages
English (en)
Other versions
JP2508612Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989142186U priority Critical patent/JP2508612Y2/ja
Publication of JPH0381641U publication Critical patent/JPH0381641U/ja
Application granted granted Critical
Publication of JP2508612Y2 publication Critical patent/JP2508612Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案のリードフレームの一例の要部
平面図、第２図は第１図の−線拡大断面図、
第３図は第１図の−線拡大断面図、第４図は
上記一例の樹脂封止後の状態を示す要部断面図、
第５図は本考案のリードフレームの他の一例の要
部断面図、第６図は従来のリードフレームの例を
説明するための要部断面図である。 １，２０……リードフレーム、２，２１……ダ
イパツド部、３，２４……インナーリード部、４
……ダイパツド部の長辺、５……ダイパツド部の
短辺、９……チツプの搭載面、１０……裏面、１
１，１４……バリ、１２……側端部、１３……半
導体チツプ、１５……ワイヤ、１６……樹脂、２
２……ダイパツド部の４つ辺。

Claims (1)

  1. 【実用新案登録請求の範囲】 樹脂封止される半導体チツプのリードフレーム
    において、 ダイパツド部は上記半導体チツプの搭載面から
    その裏面へプレスされて打ち抜かれ、それ以外の
    リード部等の部分は上記搭載面の裏面から上記搭
    載面へプレスされて打ち抜かれてなることを特徴
    とするリードフレーム。
JP1989142186U 1989-12-08 1989-12-08 リ―ドフレ―ム Expired - Fee Related JP2508612Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989142186U JP2508612Y2 (ja) 1989-12-08 1989-12-08 リ―ドフレ―ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989142186U JP2508612Y2 (ja) 1989-12-08 1989-12-08 リ―ドフレ―ム

Publications (2)

Publication Number Publication Date
JPH0381641U true JPH0381641U (ja) 1991-08-21
JP2508612Y2 JP2508612Y2 (ja) 1996-08-28

Family

ID=31689026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989142186U Expired - Fee Related JP2508612Y2 (ja) 1989-12-08 1989-12-08 リ―ドフレ―ム

Country Status (1)

Country Link
JP (1) JP2508612Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61135145A (ja) * 1984-12-06 1986-06-23 Fujitsu Ltd リ−ドフレ−ム
JPS63308358A (ja) * 1987-06-10 1988-12-15 Mitsui Haitetsuku:Kk リ−ドフレ−ム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61135145A (ja) * 1984-12-06 1986-06-23 Fujitsu Ltd リ−ドフレ−ム
JPS63308358A (ja) * 1987-06-10 1988-12-15 Mitsui Haitetsuku:Kk リ−ドフレ−ム

Also Published As

Publication number Publication date
JP2508612Y2 (ja) 1996-08-28

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