JPH0476037U - - Google Patents
Info
- Publication number
- JPH0476037U JPH0476037U JP1990118503U JP11850390U JPH0476037U JP H0476037 U JPH0476037 U JP H0476037U JP 1990118503 U JP1990118503 U JP 1990118503U JP 11850390 U JP11850390 U JP 11850390U JP H0476037 U JPH0476037 U JP H0476037U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- lead
- lead frame
- frame
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は本実施例の正面図、第３図は本考案の他の実
施例の断面図、第４図は本考案の他の実施例の要
部断面図、第５図は従来例の断面図である。 １……半導体チツプ、２……ダイパツド、３…
…ボンデイングワイヤ、４……リード、５……樹
脂、１０……リードフレーム、１１……枠状ダイ
パツド、１２……リード、１３……樹脂、１５…
…テーパー部、１６……凹部。
図は本実施例の正面図、第３図は本考案の他の実
施例の断面図、第４図は本考案の他の実施例の要
部断面図、第５図は従来例の断面図である。 １……半導体チツプ、２……ダイパツド、３…
…ボンデイングワイヤ、４……リード、５……樹
脂、１０……リードフレーム、１１……枠状ダイ
パツド、１２……リード、１３……樹脂、１５…
…テーパー部、１６……凹部。
Claims (1)
- 【実用新案登録請求の範囲】 半導体用のリードフレームと、 前記リードフレームに搭載される半導体チツプ
と、 前記リードフレームに設けられ、前記半導体チ
ツプが挿通される穴が開口されると共に、半導体
チツプに接着される枠状ダイパツドと、 前記リードフレームに形成され、ボンデイング
ワイヤにより半導体チツプに接続されるリードと
、 前記の半導体チツプ、ダイパツド、ボンデイン
グワイヤ及びリードの一部が封止される樹脂と、 を備えたことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118503U JPH0476037U (ja) | 1990-11-14 | 1990-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990118503U JPH0476037U (ja) | 1990-11-14 | 1990-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476037U true JPH0476037U (ja) | 1992-07-02 |
Family
ID=31866426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990118503U Pending JPH0476037U (ja) | 1990-11-14 | 1990-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476037U (ja) |
-
1990
- 1990-11-14 JP JP1990118503U patent/JPH0476037U/ja active Pending