JPH0381652U - - Google Patents

Info

Publication number
JPH0381652U
JPH0381652U JP1989142390U JP14239089U JPH0381652U JP H0381652 U JPH0381652 U JP H0381652U JP 1989142390 U JP1989142390 U JP 1989142390U JP 14239089 U JP14239089 U JP 14239089U JP H0381652 U JPH0381652 U JP H0381652U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
diode chip
lead frame
reflector plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989142390U
Other languages
English (en)
Other versions
JP2553342Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989142390U priority Critical patent/JP2553342Y2/ja
Publication of JPH0381652U publication Critical patent/JPH0381652U/ja
Application granted granted Critical
Publication of JP2553342Y2 publication Critical patent/JP2553342Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図は本考案にかかる発光ダイオードランプ
の一例をモールド樹脂を省略して示す斜視図、第
２図はその断面図、第３図はモールド樹脂も含め
た全体構造を示す断面図、第４図は本考案にかか
る発光ダイオードランプの他の例を示す断面図、
第５図は従来の発光ダイオードランプをモールド
樹脂を省略して示す斜視図、第６図はその断面図
、第７図はモールド樹脂も含めた全体構造を示す
断面図である。 １０…発光ダイオードチツプ、２０…反射カツ
プ、３０…リードフレーム、６０…反射板、７０
…モールド樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 反射カツプに収容されてリードフレーム上に搭
    載された発光ダイオードチツプと、該発光ダイオ
    ードチツプを収容する反射カツプの外周側に配設
    された環状の反射板と、該反射板を含むリードフ
    レーム上の搭載物を包容するモールド樹脂とを具
    備することを特徴とする発光ダイオードランプ。
JP1989142390U 1989-12-08 1989-12-08 発光ダイオードランプ Expired - Lifetime JP2553342Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (ja) 1989-12-08 1989-12-08 発光ダイオードランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (ja) 1989-12-08 1989-12-08 発光ダイオードランプ

Publications (2)

Publication Number Publication Date
JPH0381652U true JPH0381652U (ja) 1991-08-21
JP2553342Y2 JP2553342Y2 (ja) 1997-11-05

Family

ID=31689220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989142390U Expired - Lifetime JP2553342Y2 (ja) 1989-12-08 1989-12-08 発光ダイオードランプ

Country Status (1)

Country Link
JP (1) JP2553342Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185046A (ja) * 2000-12-19 2002-06-28 Sharp Corp チップ部品型ｌｅｄとその製造方法
JP2004363635A (ja) * 2004-09-27 2004-12-24 Nichia Chem Ind Ltd 発光ダイオード

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124654U (ja) * 1977-03-14 1978-10-04
JPS53151376U (ja) * 1977-05-04 1978-11-29
JPS54159977U (ja) * 1978-04-27 1979-11-08
JPS61156779A (ja) * 1984-12-28 1986-07-16 Toshiba Corp 発光表示装置用電極部材の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124654U (ja) * 1977-03-14 1978-10-04
JPS53151376U (ja) * 1977-05-04 1978-11-29
JPS54159977U (ja) * 1978-04-27 1979-11-08
JPS61156779A (ja) * 1984-12-28 1986-07-16 Toshiba Corp 発光表示装置用電極部材の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185046A (ja) * 2000-12-19 2002-06-28 Sharp Corp チップ部品型ｌｅｄとその製造方法
JP2004363635A (ja) * 2004-09-27 2004-12-24 Nichia Chem Ind Ltd 発光ダイオード

Also Published As

Publication number Publication date
JP2553342Y2 (ja) 1997-11-05

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term