JPH0263548U - - Google Patents

Info

Publication number
JPH0263548U
JPH0263548U JP1988143653U JP14365388U JPH0263548U JP H0263548 U JPH0263548 U JP H0263548U JP 1988143653 U JP1988143653 U JP 1988143653U JP 14365388 U JP14365388 U JP 14365388U JP H0263548 U JPH0263548 U JP H0263548U
Authority
JP
Japan
Prior art keywords
die
bonded
heat sink
thick film
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988143653U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988143653U priority Critical patent/JPH0263548U/ja
Publication of JPH0263548U publication Critical patent/JPH0263548U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01308—Manufacture or treatment of die-attach connectors using permanent auxiliary members, e.g. using alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂおよび第２図ａ，ｂはこの考案の
実施例をそれぞれ示す図で、各ａ図はダイスがヒ
ートシンクにダイボンドされた状態を示す上面図
、各ｂは厚膜混成集積回路装置の側面図、第３図
ａ，ｂは従来例を示す第１図、第２図と同様な上
面図および側面図である。 図において、１はダイス、２はヒートシンク、
３は絶縁性基板、４は導体ペースト、５はボンデ
イングワイヤ、６は半田である。なお、各図中の
同一符号は同一または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面に回路が形成された絶縁性基板上に、ダイ
    スがダイボンドされたヒートシンクが固定され、
    所要のワイヤボンデイングが施された構造の厚膜
    混成集積回路において、前記ダイスがダイボンド
    される前記ヒートシンク面に、階段上の段差を形
    成し、この階段状の段差の低い方の面に前記ダイ
    スをダイボンドするか、または前記ダイスとボン
    デイング領域との間に所要幅の溝を形成して前記
    ダイスをダイボンドしたことを特徴とする厚膜混
    成集積回路装置。
JP1988143653U 1988-11-02 1988-11-02 Pending JPH0263548U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988143653U JPH0263548U (ja) 1988-11-02 1988-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988143653U JPH0263548U (ja) 1988-11-02 1988-11-02

Publications (1)

Publication Number Publication Date
JPH0263548U true JPH0263548U (ja) 1990-05-11

Family

ID=31410665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988143653U Pending JPH0263548U (ja) 1988-11-02 1988-11-02

Country Status (1)

Country Link
JP (1) JPH0263548U (ja)

Similar Documents

Publication Publication Date Title
JPH031540U (ja)
JPH0263548U (ja)
JPS6395271U (ja)
JPH02114943U (ja)
JPS63187330U (ja)
JPS6413144U (ja)
JPS6194356U (ja)
JPS61182036U (ja)
JPH01146559U (ja)
JPS6397241U (ja)
JPH0336478U (ja)
JPS62204327U (ja)
JPS63159842U (ja)
JPS6083258U (ja) 樹脂封止型半導体装置
JPH0451145U (ja)
JPH038445U (ja)
JPH01135736U (ja)
JPS61140574U (ja)
JPH0343738U (ja)
JPH03126363U (ja)
JPS631340U (ja)
JPH0428449U (ja)
JPS63200340U (ja)
JPS63149546U (ja)
JPS6230341U (ja)