JPH0399451U - - Google Patents

Info

Publication number
JPH0399451U
JPH0399451U JP1990008843U JP884390U JPH0399451U JP H0399451 U JPH0399451 U JP H0399451U JP 1990008843 U JP1990008843 U JP 1990008843U JP 884390 U JP884390 U JP 884390U JP H0399451 U JPH0399451 U JP H0399451U
Authority
JP
Japan
Prior art keywords
light emitting
resin
lead
emitting diode
sealing resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990008843U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990008843U priority Critical patent/JPH0399451U/ja
Publication of JPH0399451U publication Critical patent/JPH0399451U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図は、本考案の一実施例の発光ダイオード
の断面図、第２図は従来の発光ダイオードの断面
図である。 １，１１……発光素子、２，１２……ボンデイ
ング線、３，１３……反射板付リード、４，１４
……外部リード、５，１５……樹脂、６，１６…
…レンズ部、７……凸形状部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 樹脂封止されてなる発光ダイオードにおいて、
    発光素子搭載の反射板付きリードとボンデイング
    接続されるリードの封止樹脂内で最下位部に位置
    する箇所に、封止樹脂の外壁に接する長さの凸形
    状部を設けていることを特徴とする樹脂封止型発
    光ダイオード。
JP1990008843U 1990-01-30 1990-01-30 Pending JPH0399451U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990008843U JPH0399451U (ja) 1990-01-30 1990-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990008843U JPH0399451U (ja) 1990-01-30 1990-01-30

Publications (1)

Publication Number Publication Date
JPH0399451U true JPH0399451U (ja) 1991-10-17

Family

ID=31512459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990008843U Pending JPH0399451U (ja) 1990-01-30 1990-01-30

Country Status (1)

Country Link
JP (1) JPH0399451U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999060632A1 (en) * 1998-05-20 1999-11-25 Rohm Co., Ltd. Reflective sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999060632A1 (en) * 1998-05-20 1999-11-25 Rohm Co., Ltd. Reflective sensor

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