JPH0414504B2 - - Google Patents

Info

Publication number
JPH0414504B2
JPH0414504B2 JP59156803A JP15680384A JPH0414504B2 JP H0414504 B2 JPH0414504 B2 JP H0414504B2 JP 59156803 A JP59156803 A JP 59156803A JP 15680384 A JP15680384 A JP 15680384A JP H0414504 B2 JPH0414504 B2 JP H0414504B2
Authority
JP
Japan
Prior art keywords
laminated substrate
heat dissipation
semiconductor device
semiconductor element
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59156803A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6135539A (ja
Inventor
Tooru Kamata
Shozo Noguchi
Yasuhiro Kurokawa
Kazuaki Uchiumi
Hideo Takamizawa
Keiichi Yotsuyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP15680384A priority Critical patent/JPS6135539A/ja
Publication of JPS6135539A publication Critical patent/JPS6135539A/ja
Publication of JPH0414504B2 publication Critical patent/JPH0414504B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP15680384A 1984-07-27 1984-07-27 半導体装置 Granted JPS6135539A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15680384A JPS6135539A (ja) 1984-07-27 1984-07-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15680384A JPS6135539A (ja) 1984-07-27 1984-07-27 半導体装置

Publications (2)

Publication Number Publication Date
JPS6135539A JPS6135539A (ja) 1986-02-20
JPH0414504B2 true JPH0414504B2 (fr) 1992-03-13

Family

ID=15635662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15680384A Granted JPS6135539A (ja) 1984-07-27 1984-07-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS6135539A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3604075A1 (de) * 1986-02-08 1987-08-13 Bosch Gmbh Robert Verpackung von leistungsbauelementen
JPS6318648A (ja) * 1986-07-11 1988-01-26 Toshiba Corp 窒化アルミニウム回路基板
JPS63244653A (ja) * 1987-03-31 1988-10-12 Toshiba Corp 半導体装置
JPH02192198A (ja) * 1989-01-20 1990-07-27 Nippon Cement Co Ltd Ｉｃチップ搭載多層配線基板
JPH0344310U (fr) * 1989-08-31 1991-04-24
JPH09172108A (ja) * 1996-12-24 1997-06-30 Toshiba Corp 窒化アルミニウム回路基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148965U (fr) * 1974-05-27 1975-12-10
JPS54100410A (en) * 1978-01-24 1979-08-08 Tokyo Shibaura Electric Co Ceramic heat conductor
JPS5530815A (en) * 1978-08-25 1980-03-04 Toshiba Corp Semiconductor containing vessel
JPS60178647A (ja) * 1984-02-27 1985-09-12 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
JPS6135539A (ja) 1986-02-20

Similar Documents

Publication Publication Date Title
US4517584A (en) Ceramic packaged semiconductor device
US4436785A (en) Silver-filled glass
JP3127754B2 (ja) 半導体装置
CA2060239C (fr) Composite nitrure d'aluminium/verre
JPS5896757A (ja) 半導体装置
JPH0515662B2 (fr)
JPH0414504B2 (fr)
JPH0823145A (ja) ハイブリッドｉｃ用基板
JPS63181399A (ja) 高熱伝導性厚膜多層配線基板
JPS59126665A (ja) 厚膜混成集積回路
EP0399265A2 (fr) Substrat utilisé pour la fabrication d'un circuit à film épais
JPS6135542A (ja) 樹脂封止型半導体装置
JPS63210043A (ja) 高熱伝導性ガラス−セラミツク複合体
JPH0568877B2 (fr)
EP0381242B1 (fr) Substrat pour la fabrication d'un circuit à couche épaisse
JPS59134852A (ja) 集積回路パツケ−ジ
JPS617647A (ja) 回路基板
JPS60178688A (ja) 高熱伝導性回路基板
JPS6243155A (ja) 集積回路パッケ−ジ
JPS60241239A (ja) 半導体装置
JPH0823052A (ja) リード端子付き厚膜ハイブリッドｉｃ用基板
JP3450167B2 (ja) 半導体素子収納用パッケージ
JPS59165447A (ja) 厚膜混成集積回路
JPS61256746A (ja) 半導体装置
JPH04325482A (ja) 窒化アルミニウム基板のメタライズ方法