JPH0418441U - - Google Patents

Info

Publication number
JPH0418441U
JPH0418441U JP1990057257U JP5725790U JPH0418441U JP H0418441 U JPH0418441 U JP H0418441U JP 1990057257 U JP1990057257 U JP 1990057257U JP 5725790 U JP5725790 U JP 5725790U JP H0418441 U JPH0418441 U JP H0418441U
Authority
JP
Japan
Prior art keywords
electrode
semiconductor device
bump electrode
wiring
uneven
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990057257U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990057257U priority Critical patent/JPH0418441U/ja
Publication of JPH0418441U publication Critical patent/JPH0418441U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示すバンプ電極形成
部の断面図、第２図はそのバンプ電極形成部の平
面図、第３図はそのバンプ電極形成部の変形例を
示す平面図、第４図は従来のバンプ電極形成部の
断面図、第５図は従来の他のバンプ電極形成部の
断面図、第６図は従来のボンデイングパツド電極
部の構成図、第７図は本考案の他の実施例を示す
半導体装置のボンデイングパツド電極の構成図、
第８図は本考案の更なる他の実施例を示す半導体
装置のボンデイングパツド電極の構成図である。 ３１，５１，６１……半導体基板、３２，５２
，６２……絶縁膜、３３……アルミ膜、３４，５
５，６５……表面保護絶縁膜、３５……メツキ電
極用膜、３６……拡散防止膜、３７……バンプ電
極、３８，４１……コンタクト孔、３９……拡散
層、５３……ポリシリコン層、５４，６４……メ
タル層（Ａｌ蒸着膜）、５６，６６……ボンデイ
ングパツド電極のエリア、６３……凹部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体素子の電極配線部にバンプ電極を形
    成する半導装置において、 下地層に凹凸部を形成し、該凹凸部に電極配線
    を行い、前記凹凸部が形成される電極配線部にバ
    ンプ電極を設けるようにしたことを特徴とする半
    導体装置。 (2) 前記電極配線はアルミ配線からなり、バン
    プ電極を形成するに当たり、バンプ電極形成部分
    のアルミ配線部と下地拡散層とのオーミツク接合
    をとるために複数のコンタクト孔を形成すること
    を特徴とする請求項１記載の半導体装置。 (3) 下地層である絶縁膜に凹凸を複数個、１列
    状又は格子状に構成し、メタル層表面が凹凸であ
    るワイヤボンデイングパツド電極構造を有するこ
    とを特徴とする半導体装置。
JP1990057257U 1990-06-01 1990-06-01 Pending JPH0418441U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990057257U JPH0418441U (ja) 1990-06-01 1990-06-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990057257U JPH0418441U (ja) 1990-06-01 1990-06-01

Publications (1)

Publication Number Publication Date
JPH0418441U true JPH0418441U (ja) 1992-02-17

Family

ID=31581805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990057257U Pending JPH0418441U (ja) 1990-06-01 1990-06-01

Country Status (1)

Country Link
JP (1) JPH0418441U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114827A (ja) * 2004-10-18 2006-04-27 Denso Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006114827A (ja) * 2004-10-18 2006-04-27 Denso Corp 半導体装置

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