JPS6183038U - - Google Patents
Info
- Publication number
- JPS6183038U JPS6183038U JP1984167273U JP16727384U JPS6183038U JP S6183038 U JPS6183038 U JP S6183038U JP 1984167273 U JP1984167273 U JP 1984167273U JP 16727384 U JP16727384 U JP 16727384U JP S6183038 U JPS6183038 U JP S6183038U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- moving
- pellet
- mounting area
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の実施例にかかる半導体ペレツ
トのダイボンデイング装置の概略構成図、第２図
はペレツトマウント手段を示す斜視図、第３図は
ペレツト除去手段の要部を示す拡大側面図である
。
図中、符号３は半導体ペレツト、４はコレツト
、６はローデイング台、７は基板、８はフレーム
、９はカメラ、１０は吸引ノズル。
FIG. 1 is a schematic configuration diagram of a die bonding apparatus for semiconductor pellets according to an embodiment of the present invention, FIG. 2 is a perspective view showing pellet mounting means, and FIG. 3 is an enlarged side view showing essential parts of pellet removing means. It is. In the figure, numeral 3 is a semiconductor pellet, 4 is a collector, 6 is a loading table, 7 is a substrate, 8 is a frame, 9 is a camera, and 10 is a suction nozzle.
Claims (1)
ローデイング台６に装備されたフレーム８の基板
７上に供給するペレツトマウント手段と、 基板７上にマウントされた半導体ペレツト３の
装填状態をカメラ９で監視する手段と、 ローデイング台６をマウント部位とこれから外
れた部位との間で移動させる手段と、 マウント部位外方に移動された基板７上方にお
いて吸引ノズル１０を上下動させるペレツト除去
手段と、 を具備してなる半導体ペレツトのダイボンデイン
グ装置。[Claims for Utility Model Registration] Pellet mounting means for sucking and supporting semiconductor pellets 3 with a collet 4 and supplying them onto a substrate 7 of a frame 8 installed on a loading table 6; and a semiconductor pellet mounted on the substrate 7. means for monitoring the loading state of the substrate 3 with a camera 9; means for moving the loading table 6 between the mounting area and the area removed from the mounting area; and means for moving the suction nozzle 10 up and down above the substrate 7 which has been moved outside the mounting area. A die bonding device for semiconductor pellets, comprising: a pellet removing means for moving the pellets;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167273U JPH0217481Y2 (en) | 1984-11-02 | 1984-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984167273U JPH0217481Y2 (en) | 1984-11-02 | 1984-11-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6183038U true JPS6183038U (en) | 1986-06-02 |
| JPH0217481Y2 JPH0217481Y2 (en) | 1990-05-16 |
Family
ID=30725074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984167273U Expired JPH0217481Y2 (en) | 1984-11-02 | 1984-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217481Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164545A (en) * | 1980-05-21 | 1981-12-17 | Hitachi Ltd | Pellet bonding inspection and device therefor |
| JPS5715429A (en) * | 1980-07-02 | 1982-01-26 | Hitachi Ltd | Apparatus for mounting pellet |
| JPS57173339U (en) * | 1981-04-28 | 1982-11-01 |
-
1984
- 1984-11-02 JP JP1984167273U patent/JPH0217481Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56164545A (en) * | 1980-05-21 | 1981-12-17 | Hitachi Ltd | Pellet bonding inspection and device therefor |
| JPS5715429A (en) * | 1980-07-02 | 1982-01-26 | Hitachi Ltd | Apparatus for mounting pellet |
| JPS57173339U (en) * | 1981-04-28 | 1982-11-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217481Y2 (en) | 1990-05-16 |