JPH043105B2 - - Google Patents
Info
- Publication number
- JPH043105B2 JPH043105B2 JP59221000A JP22100084A JPH043105B2 JP H043105 B2 JPH043105 B2 JP H043105B2 JP 59221000 A JP59221000 A JP 59221000A JP 22100084 A JP22100084 A JP 22100084A JP H043105 B2 JPH043105 B2 JP H043105B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead frame
- positioning
- lead frames
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59221000A JPS6199340A (ja) | 1984-10-19 | 1984-10-19 | リードフレームの枚数及び位置決めチエック機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59221000A JPS6199340A (ja) | 1984-10-19 | 1984-10-19 | リードフレームの枚数及び位置決めチエック機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6199340A JPS6199340A (ja) | 1986-05-17 |
| JPH043105B2 true JPH043105B2 (lt) | 1992-01-22 |
Family
ID=16759898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59221000A Granted JPS6199340A (ja) | 1984-10-19 | 1984-10-19 | リードフレームの枚数及び位置決めチエック機構 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6199340A (lt) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61136237A (ja) * | 1984-12-07 | 1986-06-24 | Toshiba Mach Co Ltd | フレ−ムセツト確認装置 |
| JP2505051B2 (ja) * | 1990-02-01 | 1996-06-05 | 三菱電機株式会社 | 半導体素子用樹脂封止装置及び半導体装置の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57167639A (en) * | 1981-04-08 | 1982-10-15 | Toshiba Corp | Feeder for lead frame in molding device for resin sealing |
-
1984
- 1984-10-19 JP JP59221000A patent/JPS6199340A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6199340A (ja) | 1986-05-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |