JPH0439231B2 - - Google Patents

Info

Publication number
JPH0439231B2
JPH0439231B2 JP57007588A JP758882A JPH0439231B2 JP H0439231 B2 JPH0439231 B2 JP H0439231B2 JP 57007588 A JP57007588 A JP 57007588A JP 758882 A JP758882 A JP 758882A JP H0439231 B2 JPH0439231 B2 JP H0439231B2
Authority
JP
Japan
Prior art keywords
chip
substrate
wiring
board
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57007588A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58125859A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57007588A priority Critical patent/JPS58125859A/ja
Publication of JPS58125859A publication Critical patent/JPS58125859A/ja
Publication of JPH0439231B2 publication Critical patent/JPH0439231B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP57007588A 1982-01-22 1982-01-22 半導体装置 Granted JPS58125859A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57007588A JPS58125859A (ja) 1982-01-22 1982-01-22 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57007588A JPS58125859A (ja) 1982-01-22 1982-01-22 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5213738A Division JPH0810738B2 (ja) 1993-08-30 1993-08-30 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS58125859A JPS58125859A (ja) 1983-07-27
JPH0439231B2 true JPH0439231B2 (fr) 1992-06-26

Family

ID=11669969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57007588A Granted JPS58125859A (ja) 1982-01-22 1982-01-22 半導体装置

Country Status (1)

Country Link
JP (1) JPS58125859A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2762705B2 (ja) * 1990-05-28 1998-06-04 松下電工株式会社 半導体装置実装用回路基板の構造
JP2868167B2 (ja) * 1991-08-05 1999-03-10 インターナショナル・ビジネス・マシーンズ・コーポレイション 多重レベル高密度相互接続構造体及び高密度相互接続構造体
US6696765B2 (en) 2001-11-19 2004-02-24 Hitachi, Ltd. Multi-chip module
JP3967108B2 (ja) 2001-10-26 2007-08-29 富士通株式会社 半導体装置およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5473564A (en) * 1977-11-24 1979-06-12 Hitachi Ltd Circuit device
JPS552738A (en) * 1978-06-20 1980-01-10 Nippon Giken:Kk Sheltering system of gas generated during electrolytic treatment and catching and collecting apparatus of gas
EP0007993A1 (fr) * 1978-07-12 1980-02-20 Siemens Aktiengesellschaft Plaque de conducteurs pour le montage et la connexion électrique de pastilles semiconductrices
JPS5571091A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Multilayer circuit board

Also Published As

Publication number Publication date
JPS58125859A (ja) 1983-07-27

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