JPH0451143U - - Google Patents
Info
- Publication number
- JPH0451143U JPH0451143U JP9472490U JP9472490U JPH0451143U JP H0451143 U JPH0451143 U JP H0451143U JP 9472490 U JP9472490 U JP 9472490U JP 9472490 U JP9472490 U JP 9472490U JP H0451143 U JPH0451143 U JP H0451143U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- cavity
- silver
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- 229910052709 silver Inorganic materials 0.000 claims 3
- 239000004332 silver Substances 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 239000005394 sealing glass Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は基板の斜視図である。第２図は本考案
のピングリツドアレイパツケージの略式断面図で
ある。
FIG. 1 is a perspective view of the substrate. FIG. 2 is a schematic cross-sectional view of the pin grid array package of the present invention.
Claims (1)
ウムの乾燥焼成されたセラミクス製であり、厚膜
法により形成される基板からなり、前記基板はチ
ツプ埋め込み用空洞と、銅製でニツケル及び金メ
ツキされたピンの取り付け用である複数のスルー
ホールと、前記基板表面の全前記スルーホールを
包囲する穴開きパラジウム／銀の層を有し、ピン
とチツプ間の電気的結合を行う前記基板上の前記
空洞外縁に施されている金製ボンデイングパツド
と前記パラジウム／銀の層との間の結合部を形成
する線としての役割を果たす銀の層と、前記銀の
層上にあり、湿気による影響とマイグレーシヨン
を防ぐための絶縁層を有し、前記基板の前記空洞
に取り付けられたチツプと前記絶縁層を囲むよう
にその下表面に形成された封止ガラスの窓枠とか
ら構成されるピングリツドアレイパツケージ。 It consists of a substrate made of dry-fired ceramics of aluminum oxide with a concentration of at least 90% and formed by a thick film method, said substrate having a cavity for embedding the chip and mounting of pins made of copper and plated with nickel and gold. and a layer of perforated palladium/silver surrounding all of the through-holes on the surface of the substrate and applied to the outer edge of the cavity on the substrate to provide electrical coupling between pins and chips. a layer of silver that acts as a line forming a bond between the gold bonding pad and the palladium/silver layer; 1. A pin grid array package comprising a chip mounted in the cavity of the substrate and a window frame of sealing glass formed on the lower surface of the chip so as to surround the insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9472490U JPH0451143U (en) | 1990-09-08 | 1990-09-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9472490U JPH0451143U (en) | 1990-09-08 | 1990-09-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451143U true JPH0451143U (en) | 1992-04-30 |
Family
ID=31832904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9472490U Pending JPH0451143U (en) | 1990-09-08 | 1990-09-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451143U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0710140A (en) * | 1993-06-21 | 1995-01-13 | Kirin Brewery Co Ltd | Packaging material removal device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845824A (en) * | 1981-08-31 | 1983-03-17 | ウエスチングハウス・エレクトリツク・コ−ポレ−シヨン | Peening of inside of pipe |
| JPS6333850A (en) * | 1986-07-28 | 1988-02-13 | Matsushita Electric Works Ltd | Pin grid array |
-
1990
- 1990-09-08 JP JP9472490U patent/JPH0451143U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845824A (en) * | 1981-08-31 | 1983-03-17 | ウエスチングハウス・エレクトリツク・コ−ポレ−シヨン | Peening of inside of pipe |
| JPS6333850A (en) * | 1986-07-28 | 1988-02-13 | Matsushita Electric Works Ltd | Pin grid array |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0710140A (en) * | 1993-06-21 | 1995-01-13 | Kirin Brewery Co Ltd | Packaging material removal device |
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