JPH045641U - - Google Patents

Info

Publication number
JPH045641U
JPH045641U JP1990045236U JP4523690U JPH045641U JP H045641 U JPH045641 U JP H045641U JP 1990045236 U JP1990045236 U JP 1990045236U JP 4523690 U JP4523690 U JP 4523690U JP H045641 U JPH045641 U JP H045641U
Authority
JP
Japan
Prior art keywords
semiconductor device
view
perspective
collector
collector electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990045236U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990045236U priority Critical patent/JPH045641U/ja
Publication of JPH045641U publication Critical patent/JPH045641U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例である半導体装置
の斜視図、第２図は第１図の半導体チツプの拡大
断面図、第３図は従来の半導体装置の斜視図、第
４図は第３図の半導体装置のダイボンド部の拡大
断面図である。 図において、１……ベースセラミツクス、２…
…メタライズパターン、３……Ｎｉめつき層、４
……Ａｕ又はＡｇめつき層、５……フレームセラ
ミツクス、６……外部リード端子、８……放熱フ
イン、９……半導体チツプ、９ａ……半導体チツ
プ上のコレクタ電極パツド、１０……半田流れ、
１１……金属細線を示す。なお、図中、同一符号
は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. ダイパツドパターンからコレクタワイヤを配線
    する半導体装置において、トランジスタチツプ上
    面にコレクタ電極を設けたことを特徴とする半導
    体装置。
JP1990045236U 1990-04-27 1990-04-27 Pending JPH045641U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990045236U JPH045641U (ja) 1990-04-27 1990-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990045236U JPH045641U (ja) 1990-04-27 1990-04-27

Publications (1)

Publication Number Publication Date
JPH045641U true JPH045641U (ja) 1992-01-20

Family

ID=31559230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990045236U Pending JPH045641U (ja) 1990-04-27 1990-04-27

Country Status (1)

Country Link
JP (1) JPH045641U (ja)

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