JPH045652U - - Google Patents

Info

Publication number
JPH045652U
JPH045652U JP1990046506U JP4650690U JPH045652U JP H045652 U JPH045652 U JP H045652U JP 1990046506 U JP1990046506 U JP 1990046506U JP 4650690 U JP4650690 U JP 4650690U JP H045652 U JPH045652 U JP H045652U
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor element
semiconductor device
resin
mounting lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990046506U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990046506U priority Critical patent/JPH045652U/ja
Publication of JPH045652U publication Critical patent/JPH045652U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案第一実施例を示す半導体装置の
横断平面図、第２図は同じくその縦断側面図、第
３図は同じくその斜視図、第４図は本考案第二実
施例を示す半導体装置の横断平面図、第５図は同
じくその縦断側面図、第６図は従来の半導体装置
の横断平面図、第７図は同じくその縦断側面図、
第８図は同じくその斜視図、第９図は同じくその
要部拡大図である。 １１……半導体素子、１２……搭載用リードフ
レーム、１３……ボンデイングワイヤ、１４……
結線用リードフレーム、１５……封止樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子と、該半導体素子が搭載される搭載
    用リードフレームと、ボンデイングワイヤを介し
    て前記半導体素子と内部結線される結線用リード
    フレームとを備え、これらが封止樹脂にて樹脂封
    止されて成る半導体装置において、前記搭載用リ
    ードフレームおよび結線用リードフレームは互い
    に平行に並置され、前記半導体素子は、前記搭載
    用リードフレームの樹脂封止領域の中央部に搭載
    され、前記ボンデイングワイヤは、前記半導体素
    子と前記結線用リードフレームとの間で該リード
    フレームの長手方向に対して直交する方向に張設
    されたことを特徴とする半導体装置。
JP1990046506U 1990-04-26 1990-04-26 Pending JPH045652U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990046506U JPH045652U (ja) 1990-04-26 1990-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990046506U JPH045652U (ja) 1990-04-26 1990-04-26

Publications (1)

Publication Number Publication Date
JPH045652U true JPH045652U (ja) 1992-01-20

Family

ID=31561645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990046506U Pending JPH045652U (ja) 1990-04-26 1990-04-26

Country Status (1)

Country Link
JP (1) JPH045652U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374005A (ja) * 2001-04-10 2002-12-26 Toshiba Corp 光半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374005A (ja) * 2001-04-10 2002-12-26 Toshiba Corp 光半導体装置

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