JPH04756U - - Google Patents

Info

Publication number
JPH04756U
JPH04756U JP1990040378U JP4037890U JPH04756U JP H04756 U JPH04756 U JP H04756U JP 1990040378 U JP1990040378 U JP 1990040378U JP 4037890 U JP4037890 U JP 4037890U JP H04756 U JPH04756 U JP H04756U
Authority
JP
Japan
Prior art keywords
lsi
heat dissipation
dissipation fin
fin block
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990040378U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990040378U priority Critical patent/JPH04756U/ja
Publication of JPH04756U publication Critical patent/JPH04756U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す縦断面図、第
２図は同分解斜視図、第３図は従来例を示す縦断
面図である。 １……放熱フインブロツク、２……ダイボンデ
イングのためのメタライズ部、３……ＬＳＩケー
ス、４，５……結合のためのメタライズ部、６…
…グランドパターン、７……ろう付ペースト、８
……ろう付け、９……ＬＳＩ、１０……封止キヤ
ツプ。 FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, FIG. 2 is an exploded perspective view of the same, and FIG. 3 is a longitudinal sectional view showing a conventional example. 1... Heat dissipation fin block, 2... Metallized part for die bonding, 3... LSI case, 4, 5... Metallized part for bonding, 6...
...Ground pattern, 7...Brazing paste, 8
...brazing, 9...LSI, 10...sealing cap.

Claims (1)

【実用新案登録請求の範囲】 一体に接合されるＬＳＩケースとＬＳＩ実装用
の放熱フインブロツクとを有するＬＳＩパツケー
ジであつて、 前記放熱フインブロツクは、ＬＳＩに発生する
熱を放熱する機能を有し、ＬＳＩが直接実装され
たものであり、 前記ＬＳＩケースは、ＬＳＩの入出力端子とし
て機能する複数のリード端子と、放熱フインブロ
ツクに実装されたＬＳＩを受け入れる無底のキヤ
ビテイとを有するものであることを特徴とするＬ
ＳＩパツケージ。[Claims for Utility Model Registration] An LSI package having an LSI case and a heat dissipation fin block for LSI mounting that are joined together, the heat dissipation fin block having a function of dissipating heat generated in the LSI, is directly mounted, and the LSI case has a plurality of lead terminals that function as input/output terminals of the LSI, and a bottomless cavity that receives the LSI mounted on the heat dissipation fin block. L to be
SI package.
JP1990040378U 1990-04-16 1990-04-16 Pending JPH04756U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990040378U JPH04756U (en) 1990-04-16 1990-04-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990040378U JPH04756U (en) 1990-04-16 1990-04-16

Publications (1)

Publication Number Publication Date
JPH04756U true JPH04756U (en) 1992-01-07

Family

ID=31550118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990040378U Pending JPH04756U (en) 1990-04-16 1990-04-16

Country Status (1)

Country Link
JP (1) JPH04756U (en)

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