JPH0330433U - - Google Patents

Info

Publication number
JPH0330433U
JPH0330433U JP1989089956U JP8995689U JPH0330433U JP H0330433 U JPH0330433 U JP H0330433U JP 1989089956 U JP1989089956 U JP 1989089956U JP 8995689 U JP8995689 U JP 8995689U JP H0330433 U JPH0330433 U JP H0330433U
Authority
JP
Japan
Prior art keywords
semiconductor device
inner lead
tip
bonding pad
same plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989089956U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989089956U priority Critical patent/JPH0330433U/ja
Publication of JPH0330433U publication Critical patent/JPH0330433U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る半導体装置の要部図、第
２図は同半導体装置用リードフレームを示す図、
第３図は同リードフレームの要部を示す図、第４
図は、本考案の半導体装置に用いられるリードフ
レームの変形例を示す図、第５図は従来の半導体
装置のリードフレームの一例を示す平面図、第６
図はワイヤボンデイングの説明図、第７図は従来
のダイレクトボンデイングの説明図である。 １……インナーリード、２……タイバー、３…
…アウターリード、４……枠体、１０……ダイパ
ツド、１１ａ……バンプ、１１……肉薄のパター
ン、１２……変形部、２０……チツプ、３２……
曲折部、ボンデイングパツド、ｐ……バンプ。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体素子のボンデイングパツドにインナーリ
    ードの先端が直接接続されたダイレクトボンド型
    の半導体装置において、 前記ボンデイングパツドに接続されるインナー
    リードは、その先端近傍でインナーリードの幅よ
    りも大きく変位して同一平面内に伸びる変形部を
    具備してなることを特徴とする半導体装置。
JP1989089956U 1989-07-31 1989-07-31 Pending JPH0330433U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989089956U JPH0330433U (ja) 1989-07-31 1989-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989089956U JPH0330433U (ja) 1989-07-31 1989-07-31

Publications (1)

Publication Number Publication Date
JPH0330433U true JPH0330433U (ja) 1991-03-26

Family

ID=31639505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989089956U Pending JPH0330433U (ja) 1989-07-31 1989-07-31

Country Status (1)

Country Link
JP (1) JPH0330433U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007285720A (ja) * 2006-04-12 2007-11-01 Chugoku Electric Power Co Inc:The 測定装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007285720A (ja) * 2006-04-12 2007-11-01 Chugoku Electric Power Co Inc:The 測定装置

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