JPH0478701B2 - - Google Patents

Info

Publication number
JPH0478701B2
JPH0478701B2 JP60126434A JP12643485A JPH0478701B2 JP H0478701 B2 JPH0478701 B2 JP H0478701B2 JP 60126434 A JP60126434 A JP 60126434A JP 12643485 A JP12643485 A JP 12643485A JP H0478701 B2 JPH0478701 B2 JP H0478701B2
Authority
JP
Japan
Prior art keywords
lead material
conductivity
alloy
semiconductor devices
alloy lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60126434A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61284946A (ja
Inventor
Rensei Futatsuka
Takeshi Suzuki
Seiji Kumagai
Manpei Kuwabara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Shindoh Co Ltd
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd, Mitsubishi Materials Corp filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP60126434A priority Critical patent/JPS61284946A/ja
Publication of JPS61284946A publication Critical patent/JPS61284946A/ja
Priority to JP3206445A priority patent/JP2565029B2/ja
Publication of JPH0478701B2 publication Critical patent/JPH0478701B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP60126434A 1985-06-11 1985-06-11 半導体装置用Ｃｕ合金リ−ド素材 Granted JPS61284946A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60126434A JPS61284946A (ja) 1985-06-11 1985-06-11 半導体装置用Ｃｕ合金リ−ド素材
JP3206445A JP2565029B2 (ja) 1985-06-11 1991-07-23 半導体装置リード材

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60126434A JPS61284946A (ja) 1985-06-11 1985-06-11 半導体装置用Ｃｕ合金リ−ド素材
JP3206445A JP2565029B2 (ja) 1985-06-11 1991-07-23 半導体装置リード材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3206445A Division JP2565029B2 (ja) 1985-06-11 1991-07-23 半導体装置リード材

Publications (2)

Publication Number Publication Date
JPS61284946A JPS61284946A (ja) 1986-12-15
JPH0478701B2 true JPH0478701B2 (fr) 1992-12-11

Family

ID=26462619

Family Applications (2)

Application Number Title Priority Date Filing Date
JP60126434A Granted JPS61284946A (ja) 1985-06-11 1985-06-11 半導体装置用Ｃｕ合金リ−ド素材
JP3206445A Expired - Lifetime JP2565029B2 (ja) 1985-06-11 1991-07-23 半導体装置リード材

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP3206445A Expired - Lifetime JP2565029B2 (ja) 1985-06-11 1991-07-23 半導体装置リード材

Country Status (1)

Country Link
JP (2) JPS61284946A (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005213629A (ja) * 2004-02-02 2005-08-11 Nikko Metal Manufacturing Co Ltd 銅合金の熱処理方法と銅合金および素材
JP4756197B2 (ja) * 2005-08-23 2011-08-24 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｍｇ−Ｐ系銅合金およびその製造法
WO2015093317A1 (fr) * 2013-12-19 2015-06-25 住友電気工業株式会社 Fil d'alliage de cuivre, fil d'alliage de cuivre torsadé, fil électrique auquel est fixée une cosse et procédé pour la production de fil d'alliage de cuivre
US10676803B2 (en) 2015-09-09 2020-06-09 Mitsubishi Materials Corporation Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar
JP6187629B1 (ja) * 2016-03-30 2017-08-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
KR102474009B1 (ko) * 2015-09-09 2022-12-02 미쓰비시 마테리알 가부시키가이샤 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 및, 버스바
EP3243918B1 (fr) 2015-09-09 2020-05-20 Mitsubishi Materials Corporation Alliage de cuivre pour dispositif électronique/électrique, matériau en alliage de cuivre travaillé plastiquement pour dispositif électronique/électrique, composant pour dispositif électronique/électrique, borne et barre omnibus
JP6156600B1 (ja) 2015-09-09 2017-07-05 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
JP6187630B1 (ja) * 2016-03-30 2017-08-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
US11319615B2 (en) 2016-03-30 2022-05-03 Mitsubishi Materials Corporation Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay
WO2017170699A1 (fr) 2016-03-30 2017-10-05 三菱マテリアル株式会社 Alliage de cuivre pour équipement électronique et électrique, bande plate en alliage de cuivre pour équipement électronique et électrique, composant pour équipement électronique et électrique, terminal, barre omnibus et pièce mobile pour relais
JP6780187B2 (ja) 2018-03-30 2020-11-04 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
WO2019189558A1 (fr) 2018-03-30 2019-10-03 三菱マテリアル株式会社 Alliage de cuivre pour dispositif électronique/électrique, matériau en feuille/bande en strip alliage de cuivre pour dispositif électronique/électrique, composant pour dispositif électronique/électrique, borne et barre omnibus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324917B2 (fr) * 1972-05-31 1978-07-24
JPS52103316A (en) * 1976-02-27 1977-08-30 Furukawa Electric Co Ltd:The Heat-resisting copper alloy having excellent electrical conductivity a nd thermal conductivity
JPS5834536B2 (ja) * 1980-06-06 1983-07-27 日本鉱業株式会社 半導体機器のリ−ド材用の銅合金
JPS57108235A (en) * 1980-12-24 1982-07-06 Sumitomo Electric Ind Ltd Copper alloy for lead frame
JPS6039139A (ja) * 1983-08-12 1985-02-28 Mitsui Mining & Smelting Co Ltd 耐軟化高伝導性銅合金
JPS6046340A (ja) * 1983-08-23 1985-03-13 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS6075541A (ja) * 1983-09-30 1985-04-27 Tatsuta Electric Wire & Cable Co Ltd 耐熱性、機械的特性及び導電性に優れた銅合金
JPS60114556A (ja) * 1983-11-24 1985-06-21 Mitsui Mining & Smelting Co Ltd 銅基合金の製造方法
JPS60245754A (ja) * 1984-05-22 1985-12-05 Nippon Mining Co Ltd 高力高導電銅合金
JPS61119660A (ja) * 1984-11-16 1986-06-06 Nippon Mining Co Ltd 高力高導電性銅基合金の製造方法
JPS61266540A (ja) * 1985-05-21 1986-11-26 Mitsubishi Electric Corp 銅基合金
JPS61266541A (ja) * 1985-05-21 1986-11-26 Mitsubishi Electric Corp 銅基合金

Also Published As

Publication number Publication date
JP2565029B2 (ja) 1996-12-18
JPH05306421A (ja) 1993-11-19
JPS61284946A (ja) 1986-12-15

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