JPH0480094U - - Google Patents
Info
- Publication number
- JPH0480094U JPH0480094U JP12441290U JP12441290U JPH0480094U JP H0480094 U JPH0480094 U JP H0480094U JP 12441290 U JP12441290 U JP 12441290U JP 12441290 U JP12441290 U JP 12441290U JP H0480094 U JPH0480094 U JP H0480094U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- thickness
- ceramic substrate
- semiconductor device
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図はこの考案の一実施例による半導体装置
の断面図、第２図は従来の断面図である。
図において、１はセラミツク基板、２は半田、
３は金属板、４はシヤーシ、５はネジである。な
お、図中、同一符号は同一、又は相当部分を示す
。
FIG. 1 is a sectional view of a semiconductor device according to an embodiment of this invention, and FIG. 2 is a sectional view of a conventional device. In the figure, 1 is a ceramic substrate, 2 is solder,
3 is a metal plate, 4 is a chassis, and 5 is a screw. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
補正 平３．７．１０
図面の簡単な説明を次のように補正する。
明細書第４頁第７行の「３は金属板、４はシヤ
ーシ、」を「３は金属板、３ａはネジ取付穴、４
はシヤーシ、」と訂正する。Amendment 3.7.10 The brief description of the drawing is amended as follows. On page 4, line 7 of the specification, "3 is a metal plate, 4 is a chassis," is replaced with "3 is a metal plate, 3a is a screw mounting hole, 4
``Siyashi,'' he corrected.
Claims (1)
ミツク基板を半田付により金属板の上に搭載した
半導体装置において、金属板の少なくとも一端の
厚さを前記セラミツク基板を搭載した金属板の厚
さよりも所定の値小さい厚さにしたことを特徴と
する半導体装置。 In a semiconductor device in which a ceramic substrate on which semiconductor elements and circuits are formed is mounted on a metal plate by soldering, the thickness of at least one end of the metal plate is set to a predetermined value less than the thickness of the metal plate on which the ceramic substrate is mounted. A semiconductor device characterized by having a small thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12441290U JPH0480094U (en) | 1990-11-26 | 1990-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12441290U JPH0480094U (en) | 1990-11-26 | 1990-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0480094U true JPH0480094U (en) | 1992-07-13 |
Family
ID=31872064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12441290U Pending JPH0480094U (en) | 1990-11-26 | 1990-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0480094U (en) |
-
1990
- 1990-11-26 JP JP12441290U patent/JPH0480094U/ja active Pending