JPH0481266A - Light beam soldering device - Google Patents

Abstract

PURPOSE:To prevent the thermal influence of IR rays on circumference by providing a light source, a lamp house, an optical system disposed on the opening side of this lamp house and a mask and providing this optical system with IR ray removing devices in one of the lamp house and optical system constituting parts. CONSTITUTION:At least either of the lamp house 22 and optical system 23 constituting parts of the device equipped with the light source 21, the lamp house 22, the optical system 23, and the mask 28 disposed between the optical system and a work 32 to be soldered are provided with the IR removing devices 22, 24, 25, 26. The IR rays are removed from the light beams by these removing devices, by which the overheating by the IR rays is prevented. The IR rays are removed from the light beams with which the work to be soldered is irradiated in this way and the thermal influence of the overheating with the IR rays on the circumferential part of the parts to be soldered is suppressed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a light beam soldering device that performs soldering using the heat of a light beam.

(Prior Art) As shown in FIG. 2, a conventional light beam soldering device includes one light source (halogen lamp or xenon lamp) 11 and a lamp house (elliptical reflective a plurality of optical systems 16 including a first plane mirror 13, a second plane mirror 14, and a condensing lens (cylindrical lens) 15 disposed on the opening side of the lamp house 12; Board 17
and a mask (automatic mask) 18 placed between the two. An electronic component 19 as a workpiece to be soldered is mounted on the substrate 17.

Then, a light beam emitted from one light source 11 to the surroundings is directed downward by reflection on the inner surface of the lamp house 12, and is split and focused into a plurality of light beams by a plurality of optical systems 16, The irradiation range is limited by the mask 18,
A plurality of parts to be soldered (leads, etc.) of the electronic component 19 are irradiated, and the heat of the plurality of light beams collectively performs local soldering at a plurality of locations on a single component.

(Problems to be Solved by the Invention) In such a light beam soldering device, it is impossible to irradiate the light beam only to the parts to be soldered (leads, etc.) of the electronic component 19; A portion of the light beam is also irradiated onto the mold resins of the electronic parts 17 and the electronic components 19, and there is a problem that these resins may be deformed or discolored due to the heating of the light beams. That is, the thermal influence on the surrounding area of the soldered part cannot be ignored.

The present invention has been made in view of these points, and an object of the present invention is to provide a light beam soldering device that can suppress the thermal influence on the surrounding area of the solder (J-shaped part). .

[Structure of the invention]

(Means for Solving the Problems) The present invention includes a light source 21, a lamp house 22 disposed around the light source 21, an optical system 23 disposed on the opening side of the lamp house 22, and an optical system 23 disposed on the opening side of the lamp house 22. 23 and a mask 28 disposed between the workpiece 32 to be soldered, the infrared ray removal device 22. 24, 25, and 26 were established.

(Function) The present invention provides infrared ray removal devices 22, 24. '! 5.26
This removes infrared radiation from the light beam and prevents excessive heating due to infrared radiation.

(Example) Hereinafter, the present invention will be explained in detail with reference to an example shown in FIG.

As shown in FIG. 1, a light source 21, a lamp house 22 disposed around the light source 21, and a plurality of optical systems 23 disposed on the -1 side of the lamp house 22 provide a light source. unit is configured.

As the light source 21, a halogen lamp, a xenon lamp, a metal halide lamp, or the like is used.

As the lamp house 22, an elliptical reflecting mirror whose reflecting surface is formed by a dichroic mirror (cold mirror) serving as an infrared removing device is used. This dichroic mirror has an infrared absorption effect.

The optical system 23 includes a cold filter 24 as an infrared removal device, a first mirror 25, a second mirror 26,
It is composed of a condensing lens 27.

For example, four sets of optical systems 23 are provided, corresponding to four-side lead groups of a Ford flat package integrated circuit.

The cold filter 24 is a filter that easily transmits visible light and ultraviolet rays and reflects infrared rays (heat rays).

The first mirror 25 and the second mirror 26 are plane reflecting mirrors each having a reflecting surface formed by a dichroic mirror (cold mirror) serving as an infrared removing device.

The condensing lens 27 uses a cylindrical lens.

Further, the irradiation range of the light beam condensed by the optical system 23 is limited by a through hole in a mask (automatic mask) 28 disposed below the optical system 23.

A shutter is provided in the through hole of this mask 28, and the aperture is controlled at a necessary time and for a necessary time, and the light beam is transmitted.

Then, the light beam emitted from the light source 21 to the surroundings is
Although the light beam is directed downward by reflection on the inner surface of the lamp house 22, a portion of the infrared light in the light beam is absorbed and removed without being reflected by the dichroic mirror. Further, the infrared rays in the light beam reflected by the lamp house 22 are reflected by the cold filter 24, and further infrared rays are removed from the light beam. When the light beam transmitted through this cold filter 24 is reflected by the first mirror 25 and the second mirror 26, infrared rays are absorbed and removed by the dichroic mirror. In this way, the light beam with reduced infrared rays is focused by the condenser lens 27 and irradiated onto the shutter of the mask 28.

Therefore, when the board 31 and the electronic component 32 as a workpiece to be soldered mounted on the board 31 are carried to the light beam irradiation position below the mask 28 by a conveyor (not shown), the shutter of the mask 28 is opened. The visible light and ultraviolet rays of the plurality of light beams 33 transmitted through the holes of the mask 28 are simultaneously irradiated onto the corresponding plurality of soldered parts (four-side lead group) of the electronic component 32. Then, by heating the metal with ultraviolet rays, local reflow soldering is performed at multiple locations on a single component all at once. Since infrared rays in the light beam are removed by the lamp house 22, cold filter 24 and mirrors 25, 26, the increase in substrate temperature is minimized.

〔Effect of the invention〕

According to the present invention, the light beam soldering device is equipped with an infrared ray removal device in at least one of the lamp house and optical system components of the device, so infrared rays can be removed from the light beam irradiated to the workpiece to be soldered, and the infrared rays can be removed. It is possible to suppress the thermal influence on the surrounding area of the part to be soldered.

[Brief explanation of the drawing]

FIG. 1 is a schematic view showing an embodiment of the light beam soldering apparatus of the present invention, and FIG. 2 is a schematic view showing a conventional light beam soldering apparatus. 21...Light source, 22...Lamp house, 23...Optical system, 24...Infrared removal device, 28...Mask, 32...
Work to be soldered.

Claims (1)

[Claims] (1) A light source, a lamp house placed around this light source, an optical system placed on the opening side of this lamp house, and a mask placed between this optical system and the workpiece to be soldered. What is claimed is: 1. A light beam soldering device comprising: an infrared ray removal device provided in at least one of the lamp house and the optical system components.