JPH0516182B2 - - Google Patents
Info
- Publication number
- JPH0516182B2 JPH0516182B2 JP57149309A JP14930982A JPH0516182B2 JP H0516182 B2 JPH0516182 B2 JP H0516182B2 JP 57149309 A JP57149309 A JP 57149309A JP 14930982 A JP14930982 A JP 14930982A JP H0516182 B2 JPH0516182 B2 JP H0516182B2
- Authority
- JP
- Japan
- Prior art keywords
- reflectance
- reflected light
- amount
- laser
- detected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
- H10W20/491—Antifuses, i.e. interconnections changeable from non-conductive to conductive
- H10W20/492—Antifuses, i.e. interconnections changeable from non-conductive to conductive changeable by the use of an external beam, e.g. laser beam or ion beam
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
- H10W20/493—Fuses, i.e. interconnections changeable from conductive to non-conductive
- H10W20/494—Fuses, i.e. interconnections changeable from conductive to non-conductive changeable by the use of an external beam, e.g. laser beam or ion beam
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57149309A JPS5940548A (ja) | 1982-08-30 | 1982-08-30 | 半導体集積回路におけるプログラミング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57149309A JPS5940548A (ja) | 1982-08-30 | 1982-08-30 | 半導体集積回路におけるプログラミング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5940548A JPS5940548A (ja) | 1984-03-06 |
| JPH0516182B2 true JPH0516182B2 (el) | 1993-03-03 |
Family
ID=15472307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57149309A Granted JPS5940548A (ja) | 1982-08-30 | 1982-08-30 | 半導体集積回路におけるプログラミング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5940548A (el) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7741131B2 (en) * | 2007-05-25 | 2010-06-22 | Electro Scientific Industries, Inc. | Laser processing of light reflective multilayer target structure |
| GB2459669A (en) * | 2008-04-30 | 2009-11-04 | Xsil Technology Ltd | Dielectric layer pulsed laser scribing and metal layer and semiconductor wafer dicing |
| SI3544760T1 (sl) * | 2016-11-23 | 2021-04-30 | Aperam | Postopek za lasersko dekapiranje premikajočega se kovinskega izdelka in postrojenje za izvedbo le-tega |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5627352A (en) * | 1979-08-11 | 1981-03-17 | Ricoh Co Ltd | Ink jet head |
-
1982
- 1982-08-30 JP JP57149309A patent/JPS5940548A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5940548A (ja) | 1984-03-06 |
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