JPH052739B2 - - Google Patents

Info

Publication number
JPH052739B2
JPH052739B2 JP58217136A JP21713683A JPH052739B2 JP H052739 B2 JPH052739 B2 JP H052739B2 JP 58217136 A JP58217136 A JP 58217136A JP 21713683 A JP21713683 A JP 21713683A JP H052739 B2 JPH052739 B2 JP H052739B2
Authority
JP
Japan
Prior art keywords
target
support plate
cooling water
cooling
brazed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58217136A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60110873A (ja
Inventor
Minoru Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21713683A priority Critical patent/JPS60110873A/ja
Publication of JPS60110873A publication Critical patent/JPS60110873A/ja
Publication of JPH052739B2 publication Critical patent/JPH052739B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP21713683A 1983-11-17 1983-11-17 タ−ゲットの冷却方法 Granted JPS60110873A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21713683A JPS60110873A (ja) 1983-11-17 1983-11-17 タ−ゲットの冷却方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21713683A JPS60110873A (ja) 1983-11-17 1983-11-17 タ−ゲットの冷却方法

Publications (2)

Publication Number Publication Date
JPS60110873A JPS60110873A (ja) 1985-06-17
JPH052739B2 true JPH052739B2 (cs) 1993-01-13

Family

ID=16699414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21713683A Granted JPS60110873A (ja) 1983-11-17 1983-11-17 タ−ゲットの冷却方法

Country Status (1)

Country Link
JP (1) JPS60110873A (cs)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6279870U (cs) * 1985-11-05 1987-05-21
US5180478A (en) * 1990-12-19 1993-01-19 Intevac, Inc. Sputter coating source
CN100473756C (zh) * 2002-10-24 2009-04-01 霍尼韦尔国际公司 用于加强冷却并降低挠曲和变形的靶设计及相关方法
EP1659193A1 (de) 2004-11-19 2006-05-24 Applied Films GmbH & Co. KG Gekühlte Rückenplatte für ein Sputtertarget und Sputtertarget bestehend aus mehreren Rückenplatten
US7799190B2 (en) * 2005-04-14 2010-09-21 Tango Systems, Inc. Target backing plate for sputtering system
JP6636796B2 (ja) * 2015-12-24 2020-01-29 株式会社アルバック スパッタリング装置及びスパッタリング方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5677380A (en) * 1979-11-28 1981-06-25 Hitachi Ltd Sputtering apparatus
JPS5949308B2 (ja) * 1980-02-07 1984-12-01 日電アネルバ株式会社 スパッタ装置

Also Published As

Publication number Publication date
JPS60110873A (ja) 1985-06-17

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