JPH0528919B2 - - Google Patents

Info

Publication number
JPH0528919B2
JPH0528919B2 JP61067222A JP6722286A JPH0528919B2 JP H0528919 B2 JPH0528919 B2 JP H0528919B2 JP 61067222 A JP61067222 A JP 61067222A JP 6722286 A JP6722286 A JP 6722286A JP H0528919 B2 JPH0528919 B2 JP H0528919B2
Authority
JP
Japan
Prior art keywords
metal film
conductive metal
filling material
cylinder
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61067222A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62224996A (ja
Inventor
Akira Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP6722286A priority Critical patent/JPS62224996A/ja
Publication of JPS62224996A publication Critical patent/JPS62224996A/ja
Publication of JPH0528919B2 publication Critical patent/JPH0528919B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP6722286A 1986-03-27 1986-03-27 プリント配線板およびその製造方法 Granted JPS62224996A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6722286A JPS62224996A (ja) 1986-03-27 1986-03-27 プリント配線板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6722286A JPS62224996A (ja) 1986-03-27 1986-03-27 プリント配線板およびその製造方法

Publications (2)

Publication Number Publication Date
JPS62224996A JPS62224996A (ja) 1987-10-02
JPH0528919B2 true JPH0528919B2 (da) 1993-04-27

Family

ID=13338665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6722286A Granted JPS62224996A (ja) 1986-03-27 1986-03-27 プリント配線板およびその製造方法

Country Status (1)

Country Link
JP (1) JPS62224996A (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6193910B1 (en) 1997-11-11 2001-02-27 Ngk Spark Plug Co., Ltd. Paste for through-hole filling and printed wiring board using the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5086675A (da) * 1973-12-06 1975-07-12
JPS6054798B2 (ja) * 1977-12-27 1985-12-02 富士通株式会社 プリント板の製造方法
JPS5595395A (en) * 1979-01-13 1980-07-19 Sony Corp Method of fabricating printed circuit board
JPS56140696A (en) * 1980-04-04 1981-11-04 Sony Corp Method of manufacturing circuit board
JPS60172371U (ja) * 1984-04-20 1985-11-15 大山　實 プリント配線板の配線孔用充填硬化剤の余剰付着分払拭装置

Also Published As

Publication number Publication date
JPS62224996A (ja) 1987-10-02

Similar Documents

Publication Publication Date Title
US4897338A (en) Method for the manufacture of multilayer printed circuit boards
US7351915B2 (en) Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same
US4529477A (en) Process for the manufacture of printed circuit boards
JP4043146B2 (ja) パッケージ基板
JPS58206192A (ja) プリント回路板の製造方法及び装置
JP3786512B2 (ja) 多層配線基板の製造方法
JPH1187865A (ja) プリント配線板およびその製造方法
JPH04186792A (ja) プリント配線板およびその製造方法
WO1988005252A1 (en) Method for the manufacture of multilayer printed circuit boards
JPH09307216A (ja) 配線基板の製造方法及び配線基板
JPH0528919B2 (da)
JPH04150095A (ja) 表面実装用多層プリント配線板及びその製造方法
JP2713037B2 (ja) プリント配線板及びその製造方法
JP2826206B2 (ja) プリント配線板
JP2984625B2 (ja) 多層プリント配線板製造方法
JPS6345888A (ja) バンプ付配線板の製造方法
JPH05259614A (ja) プリント配線板の樹脂埋め法
JP2518249B2 (ja) スル−ホ−ル基板の製法
JPH02144988A (ja) スルーホール付配線板の製造方法
JP2733375B2 (ja) プリント配線板およびその製造方法
JP2944576B2 (ja) 多層プリント配線板の製造方法
JPH1065317A (ja) プリント配線板の製造方法
JPH1154932A (ja) 多層配線基板の製造方法
JPH0756910B2 (ja) スルーホール付配線板の製造方法
JPH11307934A (ja) 多層プリント配線板及びその製造方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term