JPH0547504B2 - - Google Patents
Info
- Publication number
- JPH0547504B2 JPH0547504B2 JP17664988A JP17664988A JPH0547504B2 JP H0547504 B2 JPH0547504 B2 JP H0547504B2 JP 17664988 A JP17664988 A JP 17664988A JP 17664988 A JP17664988 A JP 17664988A JP H0547504 B2 JPH0547504 B2 JP H0547504B2
- Authority
- JP
- Japan
- Prior art keywords
- silica
- ultrafine
- powder
- sintered body
- vacuum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17664988A JPH0226862A (ja) | 1988-07-15 | 1988-07-15 | シリカ焼結体の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17664988A JPH0226862A (ja) | 1988-07-15 | 1988-07-15 | シリカ焼結体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0226862A JPH0226862A (ja) | 1990-01-29 |
| JPH0547504B2 true JPH0547504B2 (fr) | 1993-07-16 |
Family
ID=16017273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17664988A Granted JPH0226862A (ja) | 1988-07-15 | 1988-07-15 | シリカ焼結体の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226862A (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5728470A (en) * | 1994-05-13 | 1998-03-17 | Nec Corporation | Multi-layer wiring substrate, and process for producing the same |
| CN114349516B (zh) * | 2021-12-16 | 2023-05-12 | 郑州大学 | 一种低温合成高致密SiC陶瓷的方法 |
-
1988
- 1988-07-15 JP JP17664988A patent/JPH0226862A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0226862A (ja) | 1990-01-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |