JPH0655268U - Lead frame - Google Patents

Abstract

(57) [Abstract] [Purpose] When a plurality of circuit boards are connected by using a plurality of conductive frames, one electrode pattern is formed at the end of each circuit board and one conductive pattern is formed. (EN) Provided is a lead frame which can be efficiently sandwiched and temporarily fixed to each conductive clip of a frame. [Structure] A plurality of conductive frames having a plurality of conductive clips for sandwiching and supporting an electrode pattern formed on an end portion of a circuit board are connected to each other, and a plurality of conductive frames are continuously formed in a ladder shape. .

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a lead frame for connecting a plurality of circuit boards in a laminated state.

[0002]

[Prior art]

 This type of lead frame is composed of one conductive frame, and a plurality of conductive clips are formed on this conductive frame. When connecting multiple circuit boards in a stacked state using multiple conductive frames, sandwich the electrode pattern formed at the end of each circuit board with each conductive clip of one conductive frame. It is temporarily fixed and then soldered through the solder bath in this temporarily fixed state.

[0003]

[Problems to be solved by the device]

 In order to connect a plurality of circuit boards in a laminated state by using a plurality of conductive frames of this type, the position of each conductive clip of the conductive frame and each electrode pattern formed on the end of the circuit board is required. Then, the electrode patterns of the circuit board are tentatively fixed by being sandwiched between the conductive clips of the conductive frame. In this way, for the work of temporarily fixing a plurality of circuit boards in a stacked state by using a plurality of conductive frames, one conductive frame is formed on each conductive clip and one end of the circuit board. Since it is complicated due to the alignment work with each electrode pattern, it has been desired to improve.

Therefore, in the present invention, when a plurality of circuit boards are connected using a plurality of conductive frames in a laminated state, one electrode pattern is formed on the end portion of each circuit board and one conductive pattern is formed. It is an object of the present invention to provide a lead frame which can be efficiently sandwiched and temporarily fixed to each conductive clip of the frame.

[0005]

[Means for Solving the Problems]

 According to the present invention, a plurality of conductive frames having a plurality of conductive clips for sandwiching and supporting an electrode pattern formed on an end portion of a circuit board are connected to each other to connect a plurality of conductive frames in a ladder shape. It is characterized by being formed.

[0006]

[Action]

 In the present invention, when the electrode patterns formed on the ends of the circuit board are aligned and inserted into the conductive clips of one conductive frame with respect to the plurality of conductive frames formed integrally, other conductive frames are inevitably inserted. Alignment with the conductive clip of the conductive frame allows easy insertion and efficient temporary fixing.

[0007]

【Example】

 Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the lead frame of the present invention, and FIG. 2 is a perspective view showing an example of use of the lead frame of the present invention. The same reference numerals in FIGS. 1 and 2 indicate the same items.

In FIG. 1, reference numeral 1 denotes a lead frame in which a plurality of conductive frames 2 are integrally formed in parallel, and both ends of each conductive frame 2 are connected to each other to form a ladder-shaped metal frame. Reference numeral 5 denotes a conductive clip formed by cutting and raising the conductive frame 1 so as to face each other. A plurality of conductive frames 2 formed in parallel are formed so as to have the same arrangement relationship and are adjacent to each other. The conductive clips 5 of each conductive frame 2 are arranged in parallel. Next, referring to FIG. 2, reference numeral 6 denotes a circuit board on which a plurality of electronic components 7 are mounted, and electrode patterns 8 are formed at a plurality of locations on the end portion of the circuit board 6. Since the lead frame 1 is integrally formed with a plurality of conductive frames 2, when the electrode pattern 8 formed on the end portion of the circuit board 6 is aligned and inserted into the conductive clip 5 of one conductive frame 2. Inevitably, the conductive clip 5 of the other conductive frame 2 is aligned, the circuit board 6 can be easily aligned with the lead frame 1, and the electrode patterns 8 formed at the ends of the circuit board 6 are connected to the lead frame. One conductive frame 2 is efficiently sandwiched and temporarily fixed to each conductive clip. Thus, the plurality of circuit boards 6 are temporarily fixed and connected in a laminated state by the plurality of conductive frames 2, and in this temporarily fixed state, soldering is performed through a solder bath (not shown). After that, if the connecting portions at both ends of each conductive frame 2 are cut as required, the conductive frames 2 can be individually separated and separated.

[0009]

[Effect of device]

 As described above, in the present invention, the electrode patterns formed on the end portions of the circuit board are aligned and inserted into the conductive clips of one conductive frame with respect to the plurality of integrally formed conductive frames. Inevitably, the conductive clips of other conductive frames are aligned with each other so that they can be easily inserted and can be temporarily fixed efficiently.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a lead frame of the present invention.

FIG. 2 is a perspective view showing a usage example of the lead frame of FIG.

[Explanation of symbols]

 1 lead frame 2 conductive frame 3, 4 cut and raised 5 conductive clip 6 circuit board 8 electrode pattern

Claims (1)

[Scope of utility model registration request] 1. A plurality of conductive frames having a plurality of conductive clips for sandwiching and supporting an electrode pattern formed on an end portion of a circuit board are connected to each other to connect a plurality of conductive frames in a ladder shape. A lead frame characterized by being formed.