JPH0560657B2 - - Google Patents

Info

Publication number
JPH0560657B2
JPH0560657B2 JP61185019A JP18501986A JPH0560657B2 JP H0560657 B2 JPH0560657 B2 JP H0560657B2 JP 61185019 A JP61185019 A JP 61185019A JP 18501986 A JP18501986 A JP 18501986A JP H0560657 B2 JPH0560657 B2 JP H0560657B2
Authority
JP
Japan
Prior art keywords
wire
point
capillary
bonding point
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61185019A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6342135A (ja
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Junkichi Enomoto
Yoshimitsu Terakado
Shinichi Kumazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP61185019A priority Critical patent/JPS6342135A/ja
Publication of JPS6342135A publication Critical patent/JPS6342135A/ja
Priority to US07/304,804 priority patent/US4932584A/en
Publication of JPH0560657B2 publication Critical patent/JPH0560657B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP61185019A 1986-08-08 1986-08-08 ワイヤボンデイング方法 Granted JPS6342135A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61185019A JPS6342135A (ja) 1986-08-08 1986-08-08 ワイヤボンデイング方法
US07/304,804 US4932584A (en) 1986-08-08 1989-01-31 Method of wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61185019A JPS6342135A (ja) 1986-08-08 1986-08-08 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6342135A JPS6342135A (ja) 1988-02-23
JPH0560657B2 true JPH0560657B2 (2) 1993-09-02

Family

ID=16163348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61185019A Granted JPS6342135A (ja) 1986-08-08 1986-08-08 ワイヤボンデイング方法

Country Status (2)

Country Link
US (1) US4932584A (2)
JP (1) JPS6342135A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222274B1 (en) 1997-10-27 2001-04-24 Kabushiki Kaisha Shinkawa Bonding wire loop shape for a semiconductor device

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6342135A (ja) * 1986-08-08 1988-02-23 Shinkawa Ltd ワイヤボンデイング方法
JPH0695539B2 (ja) * 1989-05-26 1994-11-24 株式会社カイジョー ワイヤボンディング方法
JPH0713988B2 (ja) * 1990-02-13 1995-02-15 株式会社東芝 ワイヤボンディング方法
JP2814151B2 (ja) * 1991-02-27 1998-10-22 株式会社新川 ワイヤボンデイング方法
JPH04273135A (ja) * 1991-02-27 1992-09-29 Shinkawa Ltd ワイヤボンデイング方法
JPH07122587A (ja) * 1993-10-28 1995-05-12 Nec Corp ワイヤボンディング方法
JP3333413B2 (ja) * 1996-12-27 2002-10-15 株式会社新川 ワイヤボンディング方法
JP3189115B2 (ja) * 1996-12-27 2001-07-16 株式会社新川 半導体装置及びワイヤボンディング方法
JP3370539B2 (ja) * 1997-01-13 2003-01-27 株式会社新川 ワイヤボンディング方法
JP3400287B2 (ja) * 1997-03-06 2003-04-28 株式会社新川 ワイヤボンディング方法
TW424027B (en) * 1998-01-15 2001-03-01 Esec Sa Method of making wire connections of predetermined shaped
EP0937530A1 (de) * 1998-02-19 1999-08-25 ESEC Management SA Verfahren zum Herstellen von Drahtverbindungen an Halbleiterchips
US6178540B1 (en) 1998-03-11 2001-01-23 Industrial Technology Research Institute Profile design for wire bonding
JP2000114304A (ja) * 1998-10-08 2000-04-21 Shinkawa Ltd ワイヤボンディング方法
US6176416B1 (en) 1999-07-02 2001-01-23 Advanced Semiconductor Engineering, Inc. Method of making low-profile wire connection
US6391759B1 (en) * 2000-04-27 2002-05-21 Advanced Semiconductor Engineering, Inc. Bonding method which prevents wire sweep and the wire structure thereof
JP3685779B2 (ja) 2002-08-27 2005-08-24 株式会社新川 ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディングプログラム
US7086148B2 (en) * 2004-02-25 2006-08-08 Agere Systems Inc. Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit
DE102006011352A1 (de) * 2005-03-23 2006-10-05 Unaxis International Trading Ltd. Verfahren zur Herstellung einer Drahtverbindung
WO2008121142A1 (en) * 2007-04-02 2008-10-09 Kulicke And Soffa Industries, Inc. Method of forming bends in a wire loop
US10414839B2 (en) 2010-10-20 2019-09-17 Sirrus, Inc. Polymers including a methylene beta-ketoester and products formed therefrom
CA2815198A1 (en) 2010-10-20 2012-04-26 Bioformix Inc. Synthesis of methylene malonates using rapid recovery in the presence of a heat transfer agent
US9249265B1 (en) 2014-09-08 2016-02-02 Sirrus, Inc. Emulsion polymers including one or more 1,1-disubstituted alkene compounds, emulsion methods, and polymer compositions
US9279022B1 (en) 2014-09-08 2016-03-08 Sirrus, Inc. Solution polymers including one or more 1,1-disubstituted alkene compounds, solution polymerization methods, and polymer compositions
US9828324B2 (en) 2010-10-20 2017-11-28 Sirrus, Inc. Methylene beta-diketone monomers, methods for making methylene beta-diketone monomers, polymerizable compositions and products formed therefrom
JP5648916B2 (ja) * 2011-02-09 2015-01-07 株式会社リコー 電子装置及びその製造方法並びに画像形成装置
EP2768897B1 (en) 2011-10-19 2019-01-23 Sirrus, Inc. Methods for making methylene beta-diketone monomers
IN2014DN07106A (2) 2012-01-28 2015-04-24 Optmed Inc
EP2807142B1 (en) 2012-01-28 2019-09-04 Optmed Inc. Improved methylidene malonate process
CA2869108A1 (en) 2012-03-30 2013-10-03 Bioformix Inc. Methods for activating polymerizable compositions, polymerizable systems, and products formed thereby
US9234107B2 (en) 2012-03-30 2016-01-12 Sirrus, Inc. Ink coating formulations and polymerizable systems for producing the same
CA2869112A1 (en) 2012-03-30 2013-10-03 Bioformix Inc. Composite and laminate articles and polymerizable systems for producing the same
WO2013181600A2 (en) 2012-06-01 2013-12-05 Bioformix Inc. Optical material and articles formed therefrom
USD753612S1 (en) 2012-09-07 2016-04-12 Cree, Inc. Light emitter device
WO2014078689A1 (en) 2012-11-16 2014-05-22 Bioformix Inc. Plastics bonding systems and methods
CN105164797B (zh) 2012-11-30 2019-04-19 瑟拉斯公司 用于电子应用的复合组合物
EP2943462B1 (en) 2013-01-11 2018-06-27 Sirrus, Inc. Method to obtain methylene malonate via bis(hydroxymethyl) malonate pathway
US9416091B1 (en) 2015-02-04 2016-08-16 Sirrus, Inc. Catalytic transesterification of ester compounds with groups reactive under transesterification conditions
US9315597B2 (en) 2014-09-08 2016-04-19 Sirrus, Inc. Compositions containing 1,1-disubstituted alkene compounds for preparing polymers having enhanced glass transition temperatures
US10501400B2 (en) 2015-02-04 2019-12-10 Sirrus, Inc. Heterogeneous catalytic transesterification of ester compounds with groups reactive under transesterification conditions
US9334430B1 (en) 2015-05-29 2016-05-10 Sirrus, Inc. Encapsulated polymerization initiators, polymerization systems and methods using the same
US9217098B1 (en) 2015-06-01 2015-12-22 Sirrus, Inc. Electroinitiated polymerization of compositions having a 1,1-disubstituted alkene compound
US9518001B1 (en) 2016-05-13 2016-12-13 Sirrus, Inc. High purity 1,1-dicarbonyl substituted-1-alkenes and methods for their preparation
US9567475B1 (en) 2016-06-03 2017-02-14 Sirrus, Inc. Coatings containing polyester macromers containing 1,1-dicarbonyl-substituted 1 alkenes
US10428177B2 (en) 2016-06-03 2019-10-01 Sirrus, Inc. Water absorbing or water soluble polymers, intermediate compounds, and methods thereof
US9617377B1 (en) 2016-06-03 2017-04-11 Sirrus, Inc. Polyester macromers containing 1,1-dicarbonyl-substituted 1 alkenes
US10196481B2 (en) 2016-06-03 2019-02-05 Sirrus, Inc. Polymer and other compounds functionalized with terminal 1,1-disubstituted alkene monomer(s) and methods thereof
US20250096195A1 (en) * 2023-09-14 2025-03-20 Infineon Technologies Ag Wire Bonding Method and Apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5326668A (en) * 1976-08-25 1978-03-11 Nec Corp Connection for electronic parts
US4327860A (en) * 1980-01-03 1982-05-04 Kulicke And Soffa Ind. Inc. Method of making slack free wire interconnections
JPS5787143A (en) * 1980-11-19 1982-05-31 Shinkawa Ltd Method for wire bonding
US4378902A (en) * 1981-02-17 1983-04-05 The Jade Corporation Apparatus for preventing wire sag in the wire bonding process for producing semiconductor devices
US4445633A (en) * 1982-02-11 1984-05-01 Rockwell International Corporation Automatic bonder for forming wire interconnections of automatically controlled configuration
JPS58139435A (ja) * 1982-02-15 1983-08-18 Toshiba Corp ボンディング方法
US4437604A (en) * 1982-03-15 1984-03-20 Kulicke & Soffa Industries, Inc. Method of making fine wire interconnections
JPS58220436A (ja) * 1982-06-17 1983-12-22 Shinkawa Ltd ワイヤボンデイング方法
JPS6342135A (ja) * 1986-08-08 1988-02-23 Shinkawa Ltd ワイヤボンデイング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222274B1 (en) 1997-10-27 2001-04-24 Kabushiki Kaisha Shinkawa Bonding wire loop shape for a semiconductor device

Also Published As

Publication number Publication date
JPS6342135A (ja) 1988-02-23
US4932584A (en) 1990-06-12

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