JPH0574826A - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPH0574826A JPH0574826A JP3237679A JP23767991A JPH0574826A JP H0574826 A JPH0574826 A JP H0574826A JP 3237679 A JP3237679 A JP 3237679A JP 23767991 A JP23767991 A JP 23767991A JP H0574826 A JPH0574826 A JP H0574826A
- Authority
- JP
- Japan
- Prior art keywords
- hic
- integrated circuit
- hybrid integrated
- molded
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 本発明は、混成集積回路を自動打ちする際の
基板の小型化を目的とするものである。
【構成】 端子４以外にも非モールド部分２を設けたも
のである。
(57) [Summary] [Object] The present invention aims to reduce the size of a substrate when a hybrid integrated circuit is automatically punched. [Configuration] In addition to the terminals 4, the non-molded portion 2 is provided.
Description
【０００１】[0001]
【産業上の利用分野】本発明は混成集積回路（以下ＨＩ
Ｃとする）に関するものである。BACKGROUND OF THE INVENTION The present invention relates to a hybrid integrated circuit (hereinafter referred to as HI).
C)).
【０００２】[0002]
【従来の技術】図３は従来のＨＩＣの本体であり、複数
の端子４を除く全部分７が粉体塗装によりモールドされ
ている。上記ＨＩＣを自動打ちする場合のチャッキング
の方法と周辺部品の配置について図面を用いて説明す
る。図４において自動打ち機のチャック３はＨＩＣの上
から端子４を直接チャッキングしている。その理由は現
在の粉体塗装技術によるモールド部分７の寸法が個々の
部品によって大きくばらつき、自動打ちに対応できる寸
法精度を持っていないので、モールド部分をチャッキン
グすると、自動打ちの成功率が低くなることによる。他
部品８はチャックの動作範囲９の外に配置する。2. Description of the Related Art FIG. 3 shows a conventional HIC body, in which all parts 7 except a plurality of terminals 4 are molded by powder coating. A chucking method and an arrangement of peripheral components when the HIC is automatically driven will be described with reference to the drawings. In FIG. 4, the chuck 3 of the automatic driving machine directly chucks the terminal 4 from above the HIC. The reason is that the dimension of the mold part 7 by the current powder coating technology varies greatly depending on individual parts and does not have the dimensional accuracy that can cope with automatic punching. Therefore, if the mold part is chucked, the success rate of automatic punching is low. It depends. The other component 8 is arranged outside the operating range 9 of the chuck.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら上記のよ
うな方法では、他部品８がチャックの動作範囲９の妨げ
にならない様にするためには他部品８をＨＩＣから遠く
離さねばならず、基板１０上のＨＩＣ周辺部分に数多く
部品を配置できないので、ＨＩＣ本来の目的である基板
の小型化、省スペース化が自動打ちすることによって困
難になるという課題を有していた。However, in the above method, in order to prevent the other component 8 from interfering with the chuck operating range 9, the other component 8 must be far away from the HIC, and the substrate 10 must be removed. Since many parts cannot be arranged in the peripheral area of the upper HIC, there is a problem that the original purpose of the HIC is to reduce the size of the board and save the space by auto-driving.
【０００４】本発明は上記従来例の課題を解決するもの
で、生産性の向上とともにＨＩＣによる基板の小型化を
目的とするものである。The present invention solves the above-mentioned problems of the prior art, and aims to improve the productivity and reduce the size of the substrate by the HIC.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に本発明は、端子以外にも非モールド部分を設けたもの
である。In order to solve the above problems, the present invention provides a non-molded portion in addition to the terminals.
【０００６】[0006]
【作用】本発明はＨＩＣに端子以外の非モールド部分を
設け、上記部分をチャッキングすることにより基板の小
型化を可能にしたものである。According to the present invention, the HIC is provided with a non-molded portion other than the terminal, and the above portion is chucked to enable miniaturization of the substrate.
【０００７】[0007]
【実施例】以下本発明の一実施例におけるＨＩＣについ
て図面とともに説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A HIC according to an embodiment of the present invention will be described below with reference to the drawings.
【０００８】図１のＨＩＣは粉体塗装によるモールド部
分１の上部にモールドされない基板部分２を有してい
る。自動打ち機のチャック３は基板部分２をチャッキン
グし自動打ちを行う。本方法を行うことにより、従来例
の図４で示した周辺部品８を比較的ＨＩＣの近傍に配置
することが可能となり、ＨＩＣ周辺部分面積を有効活用
することができる。次に上記ＨＩＣの製法について示
す。図２はモールドされる直前のＨＩＣであり、基板部
分の上端にマスキングテープ５が貼り付けてある。その
まま端子を除く全部分を粉体塗料６中に数秒間入れ、出
した直後にマスキングテープ５を剥すことにより、モー
ルドされない基板部分２を有するＨＩＣを製造すること
ができる。The HIC of FIG. 1 has an unmolded substrate portion 2 on top of a powder coated mold portion 1. The chuck 3 of the automatic striking machine chucks the substrate portion 2 to perform automatic striking. By carrying out this method, the peripheral component 8 shown in FIG. 4 of the conventional example can be arranged relatively near the HIC, and the peripheral area of the HIC can be effectively utilized. Next, a method for manufacturing the HIC will be described. FIG. 2 shows the HIC immediately before being molded, and a masking tape 5 is attached to the upper end of the substrate portion. The entire portion except the terminals is put into the powder coating material 6 for a few seconds as it is, and the masking tape 5 is peeled off immediately after the powder coating material 6 is taken out, whereby the HIC having the substrate portion 2 which is not molded can be manufactured.
【０００９】なお、前記実施例はモールド部分の上部に
非モールド部分を設ける場合について説明したが、側部
に設ける場合にも同等の効果を得ることができる。In the above embodiment, the case where the non-molded portion is provided on the upper portion of the molded portion has been described, but the same effect can be obtained when it is provided on the side portion.
【００１０】[0010]
【発明の効果】本発明は上記説明から明らかなように、
端子以外にも非モールド部分を設け、自動打ち時に非モ
ールド部分をチャッキングすることにより、自動打ち機
のチャックの動作範囲をＨＩＣ周辺部分からできるだけ
遠ざけ、基板の小型化と生産性の向上をともに図ること
ができる。As is apparent from the above description, the present invention has the following advantages.
By providing a non-molded part in addition to the terminals and chucking the non-molded part during automatic punching, the operating range of the chuck of the automatic punching machine is kept as far as possible from the peripheral part of the HIC, and both the miniaturization of the board and the improvement of productivity are achieved. Can be planned.
【図１】本発明の一実施例におけるＨＩＣの自動打ち方
法を示す側面図FIG. 1 is a side view showing an HIC automatic driving method according to an embodiment of the present invention.
【図２】本発明の一実施例におけるＨＩＣの製法を示す
側面図FIG. 2 is a side view showing a method for manufacturing a HIC according to an embodiment of the present invention.
【図３】従来のＨＩＣの外見を示す斜視図FIG. 3 is a perspective view showing the appearance of a conventional HIC.
【図４】従来のＨＩＣの自動打ち方法を示す側面図FIG. 4 is a side view showing a conventional HIC automatic driving method.
１ 粉体塗装によるモールド部分 ２ 端子以外の非モールド部分 ４ 複数の端子 1 Molded part by powder coating 2 Non-molded part other than terminals 4 Multiple terminals
Claims (1)
子と、モールドされていない基板部分から成る混成集積
回路。1. A hybrid integrated circuit comprising a powder-coated molded portion, a plurality of terminals, and an unmolded substrate portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3237679A JPH0574826A (en) | 1991-09-18 | 1991-09-18 | Hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3237679A JPH0574826A (en) | 1991-09-18 | 1991-09-18 | Hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0574826A true JPH0574826A (en) | 1993-03-26 |
Family
ID=17018903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3237679A Pending JPH0574826A (en) | 1991-09-18 | 1991-09-18 | Hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0574826A (en) |
-
1991
- 1991-09-18 JP JP3237679A patent/JPH0574826A/en active Pending
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