JPH0575167B2 - - Google Patents
Info
- Publication number
- JPH0575167B2 JPH0575167B2 JP5187786A JP5187786A JPH0575167B2 JP H0575167 B2 JPH0575167 B2 JP H0575167B2 JP 5187786 A JP5187786 A JP 5187786A JP 5187786 A JP5187786 A JP 5187786A JP H0575167 B2 JPH0575167 B2 JP H0575167B2
- Authority
- JP
- Japan
- Prior art keywords
- mesa
- groove
- semiconductor substrate
- resist film
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 25
- 239000012535 impurity Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5187786A JPS62209829A (ja) | 1986-03-10 | 1986-03-10 | メサ型半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5187786A JPS62209829A (ja) | 1986-03-10 | 1986-03-10 | メサ型半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62209829A JPS62209829A (ja) | 1987-09-16 |
| JPH0575167B2 true JPH0575167B2 (fr) | 1993-10-20 |
Family
ID=12899108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5187786A Granted JPS62209829A (ja) | 1986-03-10 | 1986-03-10 | メサ型半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62209829A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5861660A (en) * | 1995-08-21 | 1999-01-19 | Stmicroelectronics, Inc. | Integrated-circuit die suitable for wafer-level testing and method for forming the same |
-
1986
- 1986-03-10 JP JP5187786A patent/JPS62209829A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62209829A (ja) | 1987-09-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |