JPH06143259A - Resin-impregnated base and electrical laminate - Google Patents
Resin-impregnated base and electrical laminateInfo
- Publication number
- JPH06143259A JPH06143259A JP29537292A JP29537292A JPH06143259A JP H06143259 A JPH06143259 A JP H06143259A JP 29537292 A JP29537292 A JP 29537292A JP 29537292 A JP29537292 A JP 29537292A JP H06143259 A JPH06143259 A JP H06143259A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- epoxy resin
- impregnated
- added
- impregnated base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 15
- 239000004305 biphenyl Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims abstract description 6
- 239000002966 varnish Substances 0.000 claims abstract description 6
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 18
- ARLJCLKHRZGWGL-UHFFFAOYSA-N ethenylsilicon Chemical compound [Si]C=C ARLJCLKHRZGWGL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 239000000835 fiber Substances 0.000 description 5
- 238000005470 impregnation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- OBFQBDOLCADBTP-UHFFFAOYSA-N aminosilicon Chemical compound [Si]N OBFQBDOLCADBTP-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- -1 vinylphenyl Chemical group 0.000 description 2
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- HOSGXJWQVBHGLT-UHFFFAOYSA-N 6-hydroxy-3,4-dihydro-1h-quinolin-2-one Chemical group N1C(=O)CCC2=CC(O)=CC=C21 HOSGXJWQVBHGLT-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229920013822 aminosilicone Polymers 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる樹脂含浸基材、電気用積
層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.
【０００２】[0002]
【従来の技術】近年、電気、電子機器の高信頼化対策と
して耐スミア性が要求されている。このため電気用積層
板の穴明け工程においては細心の注意が必要とされ、作
業能率を著しく低下させている。2. Description of the Related Art In recent years, smear resistance has been required as a measure for increasing the reliability of electrical and electronic equipment. For this reason, meticulous attention is required in the process of punching the electrical laminate, which significantly reduces the work efficiency.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、耐スミア性を良くするために穴明け工程の作業能
率は著しく低下する。本発明は従来の技術における上述
の問題点に鑑みてなされたもので、その目的とするとこ
ろは穴明け工程の作業能率を低下させることなく耐スミ
ア性を向上させる樹脂含浸基材、電気用積層板を提供す
ることにある。As described in the prior art, the work efficiency of the drilling process is significantly reduced in order to improve the smear resistance. The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a resin-impregnated base material for improving smear resistance without lowering work efficiency in a punching process, and an electrical laminate. To provide a plate.
【０００４】[0004]
【課題を解決するための手段】本発明はアミノシリコン
付加ビフェニル型エポキシ樹脂とビニルシリコンとの反
応物であるビフェニル型エポキシ樹脂に硬化剤を加え、
更に必要に応じ、更に必要に応じて硬化促進剤、溶剤等
を添加したエポキシ樹脂ワニスに基材を含浸、乾燥した
樹脂含浸基材及び該樹脂含浸基材の所要枚数の上面及び
又は下面に金属箔を配設ー体化してなることを特徴とす
る電気用積層板のため、上記目的を達成することができ
たもので、以下本発明を詳細に説明する。Means for Solving the Problems The present invention adds a curing agent to a biphenyl epoxy resin which is a reaction product of an aminosilicon-added biphenyl epoxy resin and vinylsilicon,
If necessary, further, if necessary, a base material is impregnated with an epoxy resin varnish to which a curing accelerator, a solvent, etc. are added, and the resin-impregnated base material is dried, and the required number of upper and / or lower surfaces of the resin-impregnated base material are metal. The above-mentioned object can be achieved because the laminated board for electric use is characterized in that the foil is arranged and formed into a body, and the present invention will be described in detail below.
【０００５】本発明に用いるエポキシ樹脂は、アミノシ
リコン付加ビフェニル型エポキシ樹脂とビニルシリコン
との反応物であるビフェニル型エポキシ樹脂である。ア
ミノシリコン付加ビフェニル型エポキシ樹脂としては、
１分子中にエポキシ基と共にビフェニル骨格をもつ化合
物の樹脂やこれに１分子中の平均水酸基数が２．３〜１
０の多価フェノ−ルを、エポキシ基１個当たりフェノ−
ル性水酸基０．０５〜０．６個の割合で反応させたエポ
キシ樹脂である。このエポキシ樹脂に付加するアミノシ
リコンはアミノ基変性オルガノポリシロキサン等で、そ
のアミノ基の当量は３００〜３０００程度のものが好ま
しい。該アミノシリコン付加ビフェニル型エポキシ樹脂
にビニルシリコンを過酸化物の存在下に付加重合させて
ビフェニル型エポキシ樹脂を得るものである。硬化剤と
してはフェノ−ル樹脂、イソシアネート、アミン系硬化
剤、酸無水物、ルイス酸錯化合物、イミダゾール系化合
物等が用いられ特に限定しない。必要に応じて硬化促進
剤としては、燐系、３級アミン系硬化促進剤が用いられ
る。必要に応じて溶剤としてはケトン系、アルコール系
等のように樹脂と相溶するものを用いることができ特に
限定しない。更に必要に応じてタルク、クレー、シリ
カ、炭酸カルシュウム、水酸化アルミニゥム、三酸化ア
ンチモン、五酸化アンチモン等の無機質粉末充填剤、ガ
ラス繊維、アスベスト繊維、パルプ繊維、合成繊維、セ
ラミック繊維等の繊維質充填剤、着色剤等を添加するこ
とができる。基材としてはガラス、アスベスト等の無機
質繊維、ポリエステル、ポリアミド、ポリアクリル、ポ
リビニルアルコール、ポリイミド、フッ素樹脂等の有機
質繊維、木綿等の天然繊維の織布、不織布、紙、マット
等を用いることができる。基材に対する含浸は同一の樹
脂のみによる含浸でもよいが、同系樹脂又は異系樹脂に
よる１次含浸、２次含浸というように含浸を複数にし、
より含浸が均一になるようにすることもできる。かくし
て基材に樹脂を含浸、乾燥して樹脂含浸基材を得るもの
である。金属箔としては銅、アルミニュウム、真鍮、ニ
ッケル、鉄等の単独、合金、複合箔を用いることができ
る。このようにして上記樹脂含浸基材の所要枚数の上面
及び又は下面に金属箔を配設ー体化して電気用積層板を
得るものである。以下本発明を実施例に基づいて説明す
る。The epoxy resin used in the present invention is a biphenyl type epoxy resin which is a reaction product of an aminosilicon-added biphenyl type epoxy resin and vinylsilicon. As amino silicone addition biphenyl type epoxy resin,
A resin of a compound having a biphenyl skeleton together with an epoxy group in one molecule and an average number of hydroxyl groups in one molecule of 2.3 to 1
A polyvalent phenol of 0 per phenol group
It is an epoxy resin reacted at a ratio of 0.05 to 0.6 hydroxyl groups. Aminosilicon added to the epoxy resin is an amino group-modified organopolysiloxane or the like, and the equivalent amount of the amino group is preferably about 300 to 3000. A vinylphenyl epoxy resin is obtained by addition-polymerizing vinyl silicone to the aminosilicone-added biphenyl epoxy resin in the presence of a peroxide. As the curing agent, a phenol resin, an isocyanate, an amine type curing agent, an acid anhydride, a Lewis acid complex compound, an imidazole type compound or the like can be used without any particular limitation. If necessary, a phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator. If necessary, a solvent that is compatible with the resin, such as a ketone-based solvent or an alcohol-based solvent, can be used and is not particularly limited. Further, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, and fiber materials such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber and ceramic fiber. Fillers, colorants and the like can be added. As the base material, it is possible to use glass, inorganic fibers such as asbestos, organic fibers such as polyester, polyamide, polyacrylic, polyvinyl alcohol, polyimide and fluororesin, woven cloth of natural fibers such as cotton, non-woven fabric, paper and mat. it can. The base material may be impregnated only with the same resin, but multiple impregnations such as primary impregnation and secondary impregnation with the same resin or different resin,
It is also possible to make the impregnation more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used. In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate. The present invention will be described below based on examples.
【０００６】[0006]
【実施例】エポキシ当量１８５のビフェニル骨格エポキ
シ樹脂１３５重量部（以下単に部と記す）に、アミノ基
当量２４００の末端アミノシリコン８部を加え、窒素ガ
ス雰囲気下において１４０℃で３時間加熱反応し、次い
で末端ビニル変性シリコン１２部、ｔ−ブチルクミルパ
ーオキサイド０．２部を加え１４０℃で１時間加熱反応
して得たビフェニル型エポキシ樹脂１５５部に対し、ジ
シアンジアミド４部、ベンジルジメチルアミン０．２
部、メチルオキシトール１０0 部を添加したエポキシ樹
脂ワニスに、厚み０．０１８ｍｍの平織ガラス布を樹脂
付着量が４５％になるように含浸、乾燥して樹脂含浸基
材を得た。次に該樹脂含浸基材８枚を重ねた上下面に厚
み０．０３５ｍｍの銅箔を各々配設した積層体を成形圧
力４０Ｋｇ／ｃｍ2 、１６０℃で９０分間加熱加圧成形
して厚み１．６ｍｍの両面銅張り積層板を得た。Example: To 135 parts by weight of a biphenyl skeleton epoxy resin having an epoxy equivalent of 185 (hereinafter simply referred to as "part"), 8 parts of terminal aminosilicon having an amino group equivalent of 2400 was added, and heated and reacted at 140 ° C. for 3 hours in a nitrogen gas atmosphere. Then, 12 parts of terminal vinyl-modified silicone and 0.2 part of t-butylcumyl peroxide were added, and 155 parts of a biphenyl type epoxy resin obtained by heating and reaction at 140 ° C. for 1 hour were added to 4 parts of dicyandiamide and 0. Two
Part of the epoxy resin varnish containing 100 parts of methyl oxitol was impregnated with a 0.018 mm-thick plain woven glass cloth so that the amount of resin adhered was 45%, and dried to obtain a resin-impregnated base material. Next, a laminated body in which copper foil having a thickness of 0.035 mm is arranged on the upper and lower surfaces of the eight resin-impregnated base materials stacked on each other is heated and pressure-molded at 160 ° C. for 90 minutes at a molding pressure of 40 Kg / cm 2 , and a thickness of 1 is obtained. A 0.6 mm double-sided copper-clad laminate was obtained.
【０００７】[0007]
【比施例】エポキシ当量２１０、粘度１００００ｃｐｓ
のビスフェノ−ルＡ型エポキシ樹脂１００部に対し、ジ
シアンジアミド４部、ベンジルジメチルアミン０．２
部、メチルオキシトール１００部を添加したエポキシ樹
脂ワニスを用いた以外は実施例と同様に処理して樹脂含
浸基材を得ると共に厚み１．６ｍｍの両面銅張り積層板
を得た。[Comparative Example] Epoxy equivalent 210, viscosity 10000 cps
Bisphenol A type epoxy resin of 100 parts, dicyandiamide of 4 parts and benzyldimethylamine of 0.2 parts
Parts and a resin-impregnated base material were obtained in the same manner as in the example except that an epoxy resin varnish added with 100 parts of methyl oxitol was used to obtain a double-sided copper-clad laminate having a thickness of 1.6 mm.
【０００８】実施例及び比較例の電気用積層板をドリル
で開穴しスルホール加工した耐スミア性は表１のようで
ある。Table 1 shows the smear resistance of the electrical laminates of Examples and Comparative Examples, which were formed by drilling holes and through holes.
【０００９】[0009]
【表１】 [Table 1]
【００１０】[0010]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する樹脂含浸基材を
用いた電気用積層板は耐スミア性がよく、本発明の優れ
ていることを確認した。The present invention is constructed as described above.
It was confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has good smear resistance and is excellent in the present invention.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/03 Ｇ 7011−4Ｅ // Ｂ２９Ｋ 63:00 105:06 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 1/03 G 7011-4E // B29K 63:00 105: 06
Claims (2)
樹脂とビニルシリコンとの反応物であるビフェニル型エ
ポキシ樹脂に硬化剤を加え、更に必要に応じて硬化促進
剤、溶剤等を添加したエポキシ樹脂ワニスに基材を含
浸、乾燥したことを特徴とする樹脂含浸基材。1. An epoxy resin varnish obtained by adding a curing agent to a biphenyl type epoxy resin, which is a reaction product of an aminosilicon-added biphenyl type epoxy resin and vinyl silicon, and further adding a curing accelerator, a solvent, etc., if necessary. A resin-impregnated base material characterized by being impregnated with a material and dried.
樹脂とビニルシリコンとの反応物であるビフェニル型エ
ポキシ樹脂に硬化剤を加え、更に必要に応じて硬化促進
剤、溶剤等を添加したエポキシ樹脂ワニスに基材を含
浸、乾燥した樹脂含浸基材の所要枚数の上面及び又は下
面に金属箔を配設ー体化してなることを特徴とする電気
用積層板。2. An epoxy resin varnish obtained by adding a curing agent to a biphenyl type epoxy resin, which is a reaction product of an aminosilicon-added biphenyl type epoxy resin and vinyl silicon, and further adding a curing accelerator, a solvent, etc., if necessary. A laminate for electrical use, characterized in that a required number of resin-impregnated base materials that have been impregnated with a material and dried are provided with a metal foil on the upper surface and / or the lower surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537292A JPH06143259A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537292A JPH06143259A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06143259A true JPH06143259A (en) | 1994-05-24 |
Family
ID=17819779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29537292A Pending JPH06143259A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06143259A (en) |
-
1992
- 1992-11-04 JP JP29537292A patent/JPH06143259A/en active Pending
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