JPH06143260A - Resin-impregnated base and electrical laminate - Google Patents
Resin-impregnated base and electrical laminateInfo
- Publication number
- JPH06143260A JPH06143260A JP29537392A JP29537392A JPH06143260A JP H06143260 A JPH06143260 A JP H06143260A JP 29537392 A JP29537392 A JP 29537392A JP 29537392 A JP29537392 A JP 29537392A JP H06143260 A JPH06143260 A JP H06143260A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- added
- impregnated
- epoxy resin
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 10
- 235000010290 biphenyl Nutrition 0.000 claims abstract description 9
- 239000004305 biphenyl Substances 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims abstract description 6
- 239000002966 varnish Substances 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 18
- 125000003277 amino group Chemical group 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- 239000007795 chemical reaction product Substances 0.000 abstract description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 description 5
- 238000005470 impregnation Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- -1 imidazole compound Chemical class 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- OBFQBDOLCADBTP-UHFFFAOYSA-N aminosilicon Chemical compound [Si]N OBFQBDOLCADBTP-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子機器、電気機器、計
算器、通信機器等に用いられる樹脂含浸基材、電気用積
層板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material used for electronic equipment, electric equipment, calculators, communication equipment and the like, and an electric laminate.
【０００２】[0002]
【従来の技術】近年、電気、電子機器の高信頼化対策と
して耐スミア性が要求されている。このため電気用積層
板の穴明け工程においては細心の注意が必要とされ、作
業能率を著しく低下させている。2. Description of the Related Art In recent years, smear resistance has been required as a measure for increasing the reliability of electrical and electronic equipment. For this reason, meticulous attention is required in the process of punching the electrical laminate, which significantly reduces the work efficiency.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、耐スミア性を良くするために穴明け工程の作業能
率は著しく低下する。本発明は従来の技術における上述
の問題点に鑑みてなされたもので、その目的とするとこ
ろは穴明け工程の作業能率を低下させることなく耐スミ
ア性を向上させる樹脂含浸基材、電気用積層板を提供す
ることにある。As described in the prior art, the work efficiency of the drilling process is remarkably reduced in order to improve the smear resistance. The present invention has been made in view of the above problems in the prior art, and an object thereof is a resin-impregnated base material for improving smear resistance without lowering work efficiency of a punching process, and an electrical laminate. To provide a plate.
【０００４】[0004]
【課題を解決するための手段】本発明はビニル変性シリ
コンとハイドロジエンシリコンとを反応させてなるアミ
ノ基当量が７００以上のアミノシリコン付加ビフェニル
型エポキシ樹脂に硬化剤を加え、更に必要に応じて硬化
促進剤、溶剤等を添加したエポキシ樹脂ワニスに基材を
含浸、乾燥した樹脂含浸基材及び該樹脂含浸基材の所要
枚数の上面及び又は下面に金属箔を配設ー体化してなる
ことを特徴とする電気用積層板のため、上記目的を達成
することができたもので、以下本発明を詳細に説明す
る。According to the present invention, a curing agent is added to an aminosilicon-added biphenyl type epoxy resin having an amino group equivalent of 700 or more, which is obtained by reacting vinyl-modified silicone with hydrogen silicone, and further, if necessary. Epoxy resin varnish added with a curing accelerator, solvent, etc. is impregnated with a base material, dried resin-impregnated base material, and a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base material and made into a body The above-mentioned object can be achieved because of the electrical laminated board characterized by the following. The present invention will be described in detail below.
【０００５】本発明に用いるエポキシ樹脂は、ビニル変
性シリコンとハイドロジエンシリコンとを反応させてな
るアミノ基当量が７００以上のアミノシリコン付加ビフ
ェニル型エポキシ樹脂である。アミノシリコン付加ビフ
ェニル型エポキシ樹脂としては、１分子中にエポキシ基
と共にビフェニル骨格をもつ化合物の樹脂やこれに１分
子中の平均水酸基数が２．３〜１０の多価フェノ−ル
を、エポキシ基１個当たりフェノ−ル性水酸基０．０５
〜０．６個の割合で反応させたエポキシ樹脂である。こ
のエポキシ樹脂に付加するアミノシリコンはアミノ基変
性オルガノポリシロキサン等で、そのアミノ基の当量は
３００〜３０００程度のものが好ましい。硬化剤として
はフェノ−ル樹脂、イソシアネート、アミン系硬化剤、
酸無水物、ルイス酸錯化合物、イミダゾール系化合物等
が用いられ特に限定しない。必要に応じて硬化促進剤と
しては、燐系、３級アミン系硬化促進剤が用いられる。
必要に応じて溶剤としてはケトン系、アルコール系等の
ように樹脂と相溶するものを用いることができ特に限定
しない。更に必要に応じてタルク、クレー、シリカ、炭
酸カルシュウム、水酸化アルミニゥム、三酸化アンチモ
ン、五酸化アンチモン等の無機質粉末充填剤、ガラス繊
維、アスベスト繊維、パルプ繊維、合成繊維、セラミッ
ク繊維等の繊維質充填剤、着色剤等を添加することがで
きる。基材としてはガラス、アスベスト等の無機質繊
維、ポリエステル、ポリアミド、ポリアクリル、ポリビ
ニルアルコール、ポリイミド、フッ素樹脂等の有機質繊
維、木綿等の天然繊維の織布、不織布、紙、マット等を
用いることができる。基材に対する含浸は同一の樹脂の
みによる含浸でもよいが、同系樹脂又は異系樹脂による
１次含浸、２次含浸というように含浸を複数にし、より
含浸が均一になるようにすることもできる。かくして基
材に樹脂を含浸、乾燥して樹脂含浸基材を得るものであ
る。金属箔としては銅、アルミニュウム、真鍮、ニッケ
ル、鉄等の単独、合金、複合箔を用いることができる。
このようにして上記樹脂含浸基材の所要枚数の上面及び
又は下面に金属箔を配設ー体化して電気用積層板を得る
ものである。以下本発明を実施例に基づいて説明する。The epoxy resin used in the present invention is an aminosilicon-added biphenyl epoxy resin having an amino group equivalent of 700 or more obtained by reacting vinyl-modified silicone with hydrogen silicone. Examples of the aminosilicon-added biphenyl type epoxy resin include a resin of a compound having a biphenyl skeleton together with an epoxy group in one molecule and a polyvalent phenol having an average number of hydroxyl groups in one molecule of 2.3 to 10 as an epoxy group. 0.05 phenolic hydroxyl group per unit
It is an epoxy resin reacted at a ratio of ˜0.6. Aminosilicon added to the epoxy resin is an amino group-modified organopolysiloxane or the like, and the equivalent amount of the amino group is preferably about 300 to 3000. As the curing agent, phenol resin, isocyanate, amine curing agent,
An acid anhydride, a Lewis acid complex compound, an imidazole compound or the like is used and is not particularly limited. If necessary, a phosphorus-based or tertiary amine-based curing accelerator is used as the curing accelerator.
If necessary, a solvent that is compatible with the resin, such as a ketone-based solvent or an alcohol-based solvent, can be used and is not particularly limited. Further, if necessary, inorganic powder fillers such as talc, clay, silica, calcium carbonate, aluminum hydroxide, antimony trioxide and antimony pentoxide, and fiber materials such as glass fiber, asbestos fiber, pulp fiber, synthetic fiber and ceramic fiber. Fillers, colorants and the like can be added. As the base material, it is possible to use glass, inorganic fibers such as asbestos, organic fibers such as polyester, polyamide, polyacrylic, polyvinyl alcohol, polyimide and fluororesin, woven cloth of natural fibers such as cotton, non-woven fabric, paper and mat. it can. The base material may be impregnated only with the same resin, but a plurality of impregnations such as primary impregnation with the same resin or different type resin and secondary impregnation may be performed to make the impregnation more uniform. Thus, the resin is impregnated into the base material and dried to obtain a resin-impregnated base material. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like can be used.
In this manner, a metal foil is provided on the upper surface and / or the lower surface of the required number of the resin-impregnated base materials and integrated to obtain an electrical laminate. The present invention will be described below based on examples.
【０００６】[0006]
【実施例】ビニル変性シリコン（東芝シリコン株式会社
製、ＹＥ５８／８Ａ）１０重量部（以下単に部と記す）
とハイドロジエンシリコン（東芝シリコン株式会社製、
ＹＥ５８／８Ｂ）１部とを１２０℃で１時間加熱反応さ
せた反応物８部とエポキシ当量１８５のビフェニル骨格
エポキシ樹脂１３５部を窒素ガス雰囲気下において１４
０℃で３時間加熱反応して得たアミノ基当量が７５０の
アミノシリコン付加ビフェニル型エポキシ樹脂１５５部
に対し、ジシアンジアミド４部、ベンジルジメチルアミ
ン０．２部、メチルオキシトール１０0 部を添加したエ
ポキシ樹脂ワニスに、厚み０．０１８ｍｍの平織ガラス
布を樹脂付着量が４５％になるように含浸、乾燥して樹
脂含浸基材を得た。次に該樹脂含浸基材８枚を重ねた上
下面に厚み０．０３５ｍｍの銅箔を各々配設した積層体
を成形圧力４０Ｋｇ／ｃｍ2 、１６０℃で９０分間加熱
加圧成形して厚み１．６ｍｍの両面銅張り積層板を得
た。[Example] 10 parts by weight of vinyl-modified silicon (YE58 / 8A, manufactured by Toshiba Silicon Co., Ltd.) (hereinafter simply referred to as "part")
And Hydrogen Silicon (manufactured by Toshiba Silicon Co.,
YE58 / 8B) 1 part and a reaction product obtained by heating and reacting at 120 ° C. for 1 hour with 8 parts of a reaction product and 135 parts of a biphenyl skeleton epoxy resin having an epoxy equivalent of 185 under a nitrogen gas atmosphere.
An epoxy obtained by adding 4 parts of dicyandiamide, 0.2 part of benzyldimethylamine, and 100 parts of methyloxitol to 155 parts of an aminosilicone-added biphenyl type epoxy resin having an amino group equivalent of 750 obtained by heating for 3 hours at 0 ° C. A plain woven glass cloth having a thickness of 0.018 mm was impregnated in the resin varnish so that the resin adhesion amount was 45%, and dried to obtain a resin-impregnated base material. Next, a laminated body in which copper foil having a thickness of 0.035 mm is arranged on the upper and lower surfaces of the eight resin-impregnated base materials stacked on each other is heated and pressure-molded at 160 ° C. for 90 minutes at a molding pressure of 40 Kg / cm 2 , and a thickness of 1 is obtained. A 0.6 mm double-sided copper-clad laminate was obtained.
【０００７】[0007]
【比施例】エポキシ当量２１０のビスフェノ−ルＡ型エ
ポキシ樹脂１００部に対し、ジシアンジアミド４部、ベ
ンジルジメチルアミン０．２部、メチルオキシトール１
００部を添加したエポキシ樹脂ワニスを用いた以外は実
施例と同様に処理して樹脂含浸基材を得ると共に厚み
１．６ｍｍの両面銅張り積層板を得た。[Comparative Example] 4 parts of dicyandiamide, 0.2 part of benzyldimethylamine and 1 part of methyloxitol to 100 parts of bisphenol A type epoxy resin having an epoxy equivalent of 210.
A resin-impregnated base material was obtained in the same manner as in the example except that an epoxy resin varnish added with 00 parts was used to obtain a double-sided copper-clad laminate having a thickness of 1.6 mm.
【０００８】実施例及び比較例の電気用積層板をドリル
で開穴しスルホール加工した耐スミア性は表１のようで
ある。Table 1 shows the smear resistance of the electrical laminates of Examples and Comparative Examples, which were formed by drilling holes and through holes.
【０００９】[0009]
【表１】 [Table 1]
【００１０】[0010]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する樹脂含浸基材を
用いた電気用積層板は耐スミア性がよく、本発明の優れ
ていることを確認した。The present invention is constructed as described above.
It was confirmed that the electrical laminate using the resin-impregnated base material having the structure described in the claims has good smear resistance and is excellent in the present invention.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/03 Ｇ 7011−4Ｅ // Ｂ２９Ｋ 63:00 105:06 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 1/03 G 7011-4E // B29K 63:00 105: 06
Claims (2)
コンとを反応させてなるアミノ基当量が７００以上のア
ミノシリコン付加ビフェニル型エポキシ樹脂に硬化剤を
加え、更に必要に応じて硬化促進剤、溶剤等を添加した
エポキシ樹脂ワニスに基材を含浸、乾燥したことを特徴
とする樹脂含浸基材。1. A curing agent is added to an aminosilicon-added biphenyl type epoxy resin having an amino group equivalent of 700 or more obtained by reacting vinyl-modified silicone with hydrogen silicone, and a curing accelerator, a solvent and the like are further added if necessary. A resin-impregnated base material, characterized in that the added epoxy resin varnish is impregnated with the base material and dried.
コンとを反応させてなるアミノ基当量が７００以上のア
ミノシリコン付加ビフェニル型エポキシ樹脂に硬化剤を
加え、更に必要に応じて硬化促進剤、溶剤等を添加した
エポキシ樹脂ワニスに基材を含浸、乾燥した樹脂含浸基
材の所要枚数の上面及び又は下面に金属箔を配設ー体化
してなることを特徴とする電気用積層板。2. A curing agent is added to an aminosilicone-added biphenyl type epoxy resin having an amino group equivalent of 700 or more obtained by reacting vinyl-modified silicone with hydrogenene silicone, and if necessary, a curing accelerator, a solvent and the like. A laminated board for electrical use, characterized in that a base material is impregnated with the added epoxy resin varnish, and a metal foil is disposed on and integrated with a required number of dried resin-impregnated base materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537392A JPH06143260A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29537392A JPH06143260A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06143260A true JPH06143260A (en) | 1994-05-24 |
Family
ID=17819792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29537392A Pending JPH06143260A (en) | 1992-11-04 | 1992-11-04 | Resin-impregnated base and electrical laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06143260A (en) |
-
1992
- 1992-11-04 JP JP29537392A patent/JPH06143260A/en active Pending
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